Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2012
08/22/2012CN202396086U Circuit board impedance strip and circuit board
08/22/2012CN202396085U Novel circuit plate
08/22/2012CN202396084U Flexible circuit board
08/22/2012CN202396083U Device for improving channel isolation
08/22/2012CN202396082U Flexible multilayer circuit board with unequal lengths
08/22/2012CN202396081U Device for inhibiting EMC (Electro Magnetic Compatibility) device by using PCB (Printed Circuit Board) layout
08/22/2012CN202396080U Film circuit board
08/22/2012CN202396079U FPC circuit board
08/22/2012CN202396078U Wiring substrate, cell stack and ambipolar secondary cell
08/22/2012CN202394640U High frequency inductor
08/22/2012CN202388871U Copper-clad plate
08/22/2012CN202388857U Flexible copper clad laminate
08/22/2012CN102648672A A shock damping and thermal isolation system for a surface mounted vibration sensitive device
08/22/2012CN102648667A Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
08/22/2012CN102648666A Heat radiating printed circuit board and chassis assembly having the same
08/22/2012CN102648665A Electronic power module, and method for manufacturing said module
08/22/2012CN102648520A Power module for an automobile
08/22/2012CN102648246A Method for applying carbon/tin mixtures to metal or alloy layers
08/22/2012CN102647863A Electronic device
08/22/2012CN102647861A Metal-core printed circuit board and manufacturing method thereof
08/22/2012CN102647859A Producing process for carbon ink of circuit board
08/22/2012CN102647854A Inductor component, printed circuit board incorporating inductor component therein, and method of manufacturing inductor component
08/22/2012CN102647853A High-accuracy through-hole resistance printed board and manufacture method thereof
08/22/2012CN102647852A High heat radiation printed circuit board and production method thereof
08/22/2012CN102647851A Surface adhesion module and circuit board
08/22/2012CN102647850A Positioning mark structure for measuring harmomegathus of six-layer HDI (high density interconnect) circuit board
08/22/2012CN102646902A Anti-high-pressure surging connector and circuit board using same
08/22/2012CN102645711A Optical module and substrate mounting same
08/22/2012CN102643574A Liquid photosensitive spraying ink
08/22/2012CN102643572A Thermocuring solder-mask ink and preparation method thereof
08/22/2012CN102045993B Anti-EMI (Electromagnetic Interference) circuit module and preparation method thereof
08/22/2012CN102014600B Radiating structure and manufacturing method thereof as well as electronic device with radiating structure
08/22/2012CN102014570B PCB (printed circuit board) carried tape for phone card with non-contact function
08/22/2012CN101959935B Polyimide precursor composition, polyimide film and transparent flexible film
08/22/2012CN101917821B High-density circuit board registration hole and manufacturing method thereof
08/22/2012CN101917818B Pad structure of circuit board and manufacturing method thereof
08/22/2012CN101916752B Multilayer printed wiring board
08/22/2012CN101547559B Flexible copper clad laminate
08/22/2012CN101499451B Printed circuit board, semiconductor package, card apparatus, and system
08/22/2012CN101364679B Electrical connection assembly
08/22/2012CN101304017B Sintered high performance semiconductor substrate and corresponding production method
08/22/2012CN101297305B A system for mapping defective printed circuits
08/22/2012CN101248436B Hardware protection in form of printed circuit board drawn into semi-case
08/22/2012CN101167416B Process for producing double-sided flexible printed board and double-sided flexible printed board
08/21/2012US8248816 Methods of designing multilayer circuitry, multilayer circuit design apparatuses, and computer-usable media
08/21/2012US8248813 Electronic device, electronic module, and methods for manufacturing the same
08/21/2012US8248802 Backboard assembly and electronic device having the same
08/21/2012US8247895 4D device process and structure
08/21/2012US8247705 Circuit substrate and manufacturing method thereof
08/21/2012US8247704 Motherboard interconnection device
08/21/2012US8247703 Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
08/21/2012US8247702 Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
08/21/2012US8247701 Electroconductive particle placement sheet and anisotropic electroconductive film
08/21/2012US8247700 Wired circuit board
08/21/2012US8247699 Flex circuit assembly with a dummy trace between two signal traces
08/21/2012US8247698 Electronic device and latching mechanism thereof
08/21/2012US8246773 RFID label technique
08/21/2012CA2455068C Printed circuit board antenna structure
08/16/2012WO2012108541A1 Laminated body for manufacturing flexible electronic device, biaxially-oriented polyester film used for same, flexible electronic device using same, and manufacturing method therefor
08/16/2012WO2012108533A1 Method for manufacturing substrate for light emitting element and substrate for light emitting element
08/16/2012WO2012108502A1 Flexible conductive material, method for manufacturing same, and electrode, wiring, electromagnetic wave shielding, and transducer using flexible conductive material
08/16/2012WO2012108264A1 Two-layered copper-clad laminate material, and method for producing same
08/16/2012WO2012108229A1 Ceramic substrate and method for manufacturing same
08/16/2012WO2012108070A1 Metal foil with carrier and method for producing laminated substrate using same
08/16/2012WO2012107463A1 Arrangement for electrically contact-connecting electrical components
08/16/2012WO2012106767A1 Electronic assembly
08/16/2012WO2012106739A1 Inhaler component
08/16/2012WO2012084849A3 Pickering emulsion for producing electrically conductive coatings and process for producing a pickering emulsion
08/16/2012WO2012061183A3 Flexible led device for thermal management and method of making
08/16/2012WO2011106751A8 Electric discharge protection for surface mounted and embedded components
08/16/2012US20120206892 Circular interposers
08/16/2012US20120206891 Circuit board, and semiconductor device having component mounted on circuit board
08/16/2012US20120206890 Method for integration of circuit components into the build-up layers of a printed wiring board
08/16/2012US20120206889 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
08/16/2012US20120206888 Sensor arrangement and chip comprising additional fixing pins
08/16/2012US20120206887 Electrical device-battery assembly and the method to make the same
08/16/2012US20120206886 High-frequency module
08/16/2012US20120206885 Remote radio unit
08/16/2012US20120206379 Single-layer and multi-touch projected capacitive apparatus
08/16/2012US20120206068 Hole formation method, multilayer wiring, semiconductor device, display element, image display device, and system containing via hole formed by the hole formation method
08/16/2012US20120205148 Device packaging structure and device packaging method
08/16/2012US20120205147 Electronic assembly
08/16/2012US20120205146 Heat-resistant copper foil and method of producing the same, circuit board, and copper-clad laminate and method of producing the same
08/16/2012US20120205145 Multilayer substrate and manufacturing method thereof
08/16/2012US20120205144 Transparent flexible printed wiring board and method for manufacturing the same
08/16/2012US20120205143 Manufacturing apparatus, manufacturing method and packaged device
08/16/2012US20120205142 Wiring substrate and method of manufacturing the same
08/16/2012US20120205141 Printed wiring board
08/16/2012US20120205140 Articles with photocurable and photocured compositions
08/16/2012DE102011004171A1 Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement And tempering method for fastening an electric component to the temperature-
08/16/2012DE102011000765A1 Heating device for, e.g. air conditioning apparatus of electric vehicle, has printed circuit board with several through holes for fluid such that heating element is indirectly or directly arranged with respect to through hole
08/16/2012DE102005024900B4 Leistungsmodul Power module
08/16/2012CA2827359A1 Electronic assembly
08/15/2012EP2488003A1 Electrical control unit using printed-circuit technology for the power-line conductor
08/15/2012EP2487030A2 Porous film and layered product including porous film
08/15/2012EP2486780A2 Heat radiating printed circuit board and chassis assembly having the same
08/15/2012EP2194098B1 Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
08/15/2012EP2184960B1 Circuit board and method for manufacturing circuit board
08/15/2012EP1811820B1 Process for producing metallized aluminum nitride substrate and substrate obtained thereby
08/15/2012EP1756360B1 Aramid paper blend
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