Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2012
10/10/2012CN102726125A Plug connector and multi-layer circuit board
10/10/2012CN102725334A Prepreg, laminate, metal-foil-clad laminate, circuit board, and circuit board for led mounting
10/10/2012CN102724814A Machining structure and machining method of flexible printed circuit board
10/10/2012CN102724812A Exposed character manufactured by directly welding LEDs on flexible circuit board and method
10/10/2012CN102724811A Liquid crystal display device and PCB (printed circuit board) for same
10/10/2012CN102724810A LED circuit board with circuits flexible to be detached and LED module
10/10/2012CN102724809A Multi-layer PCB (printed circuit board) and manufacturing method thereof
10/10/2012CN102724808A Printed circuit board (PCB) connecting structure and manufacturing method thereof
10/10/2012CN102724807A Printed circuit board
10/10/2012CN102724806A Method for manufacturing circuit substrates and circuit boards with high heat dissipation and high heat conductivity
10/10/2012CN102724805A Composite ceramic substrate with characteristics of high heat radiation and high heat conduction
10/10/2012CN102720996A Illumination system, electro-optic device, and electronic apparatus
10/10/2012CN102223751B Multilayer circuit board and assembly thereof
10/10/2012CN102065645B Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof
10/10/2012CN101851389B Thermosetting resin composition with high heat resistance and copper-clad laminate made of same
10/10/2012CN101796106B Insulating sheet and multilayer structure
10/10/2012CN101643650B Phosphorus-containing flame retardant and preparation method thereof
10/10/2012CN101547555B Printed circuit board
10/10/2012CN101489348B Circuit board and display device including the same
10/10/2012CN101253433B Optical waveguide film, method for manufacturing the film, optoelectrical hybrid film including the waveguide film, and electronic device
10/10/2012CN101153966B Liquid crystal panel module and liquid crystal display device using the same
10/09/2012US8285343 Wireless headset having improved RF immunity to RF electromagnetic interference produced from a mobile wireless communications device
10/09/2012US8284562 Electro device embedded printed circuit board and manufacturing method thereof
10/09/2012US8284561 Embedded component package structure
10/09/2012US8284557 Circuit board, mounting structure, and method for manufacturing circuit board
10/09/2012US8283575 Flexible-circuit flat cable with cluster section
10/09/2012US8283574 Printed circuit board with compound via
10/09/2012US8283573 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
10/09/2012US8283572 Printed circuit board
10/09/2012US8283571 Printed circuit board
10/09/2012US8283570 Semiconductor assembly and multilayer wiring board
10/09/2012US8283569 Electrode array and method of fabrication
10/09/2012US8283568 Device mounting board, and semiconductor module and manufacturing method therefor
10/09/2012US8283567 Flexible printed circuit board and touch screen panel apparatus having the same
10/09/2012US8283566 Printed circuit boards by massive parallel assembly
10/09/2012US8283565 Flexible substrate
10/09/2012US8282400 Electronic connector with grounding metal plate
10/09/2012DE202012006289U1 Miniaturisierte Spannungsumformungs-Vorrichtung Miniaturized voltage re-form device
10/04/2012WO2012133755A1 Transmission system and method for constructing backplane system
10/04/2012WO2012133750A1 Connection structure for flexible printed circuit boards
10/04/2012WO2012133684A1 Production method for laminate having patterned metal films, and plating layer-forming composition
10/04/2012WO2012133594A1 Polyimide film and metal laminate using same
10/04/2012WO2012133587A1 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device
10/04/2012WO2012133518A1 Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate
10/04/2012WO2012133496A1 Decoupling method, device for designing power supply line, and circuit board
10/04/2012WO2012133439A1 Metal foil having electrical resistance layer, and manufacturing method for same
10/04/2012WO2012133380A1 Circuit board, and method for manufacturing circuit board
10/04/2012WO2012133313A1 Method for manufacturing resin substrate with built-in component
10/04/2012WO2012133099A1 Wiring board and method for manufacturing same
10/04/2012WO2012133038A1 Wiring board and manufacturing method therefor
10/04/2012WO2012132952A1 Electronic component
10/04/2012WO2012132923A1 Prepreg, metal-foil-cladded laminate board, and printed wiring board
10/04/2012WO2012132814A1 Metallic foil composite, flexible printed circuit board using same, molded body, and manufacturing method for molded body
10/04/2012WO2012132713A1 Copper alloy plate having superior heat dissipation and repeated bending workability
10/04/2012WO2012132593A1 Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil
10/04/2012WO2012132592A1 Metal foil provided with electrically resistive film, and method for producing same
10/04/2012WO2012132578A1 Copper foil with copper carrier, method for producing same, copper foil for electronic circuit, method for producing same, and method for forming electronic circuit
10/04/2012WO2012132577A1 Copper foil for printed circuit
10/04/2012WO2012132576A1 Rolled copper or copper-alloy foil provided with roughened surface
10/04/2012WO2012132574A1 Composite copper foil and method for producing same
10/04/2012WO2012132573A1 Composite copper foil and method for producing same
10/04/2012WO2012132572A1 Copper foil with copper carrier, method for producing said copper foil, copper foil for electronic circuit, method for producing said copper foil, and method for forming electronic circuit
10/04/2012WO2012132524A1 Flexible multilayer substrate
10/04/2012WO2012132383A1 Laminate sheet manufacturing device and method for manufacturing laminate sheet
10/04/2012WO2012132210A1 Substrate for element mounting, cell, and cell module
10/04/2012WO2012132202A1 Base board, enhancement module, and connection structure for base board and enhancement module
10/04/2012WO2012131352A1 Improvements for electrical circuits
10/04/2012WO2012130815A1 Circuit carrier with embedded circuit board
10/04/2012WO2012130549A1 Electronic module and method for the production thereof
10/04/2012WO2012130548A1 Electronic module
10/04/2012US20120250281 Printed wiring board and method for manufacturing the same
10/04/2012US20120250277 Printed wiring board
10/04/2012US20120250274 Wiring Substrate and Electronic Device
10/04/2012US20120250269 Television receiver and electronic device
10/04/2012US20120250268 Photosensitive resin composition, dry film thereof, and printed wiring board using them
10/04/2012US20120249883 Television receiver and electronic device
10/04/2012US20120248630 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
10/04/2012US20120248468 Metal Wiring Structure, Organic Light-Emitting Display Device Using the Same, and Method of Manufacturing the Organic Light-Emitting Display Device
10/04/2012US20120248380 Nanowire ink solution and method of forming the ink solution
10/04/2012US20120247825 Printed circuit board
10/04/2012US20120247824 Suspension board with circuit
10/04/2012US20120247823 Package-substrate-mounting printed wiring board and method for manufacturing the same
10/04/2012US20120247822 Coreless layer laminated chip carrier having system in package structure
10/04/2012US20120247821 Ceramic substrate and method for manufacturing the same
10/04/2012US20120247820 Resin composition, prepreg laminate obtained with the same and printed-wiring board
10/04/2012US20120247819 Electronic component-embeded board and method for manufacturing the same
10/04/2012US20120247818 Printed wiring board
10/04/2012US20120247817 Conductive particles, conductive paste, and circuit board
10/04/2012US20120247816 Flexible wiring substrate, method for assembling flexible wiring substrate, and method for manufacturing liquid jetting apparatus
10/04/2012US20120247814 Wiring substrate and method of manufacturing the same
10/04/2012US20120247813 Printed wiring board and method for manufacturing printed wiring board
10/04/2012US20120247812 Semiconductor device with power supply line system of reduced resistance
10/04/2012US20120247811 Composite circuit board with fracturable structure
10/04/2012DE102012204677A1 Verfahren und Bestückungsvorrichtung zur Herstellung eines elektrischen Kontaktaufnehmerplättchens und zur automatisierten Bestückung eines elektrischen oder elektronischen Moduls mit dem Kontaktaufnehmerplättchen, Kontaktaufnehmerplättchen sowie Verwendung des Kontaktaufnehmerplättchens A method and mounting apparatus for manufacturing an electrical Kontaktaufnehmerplättchens and automated assembly of an electric or electronic module to the Kontaktaufnehmerplättchen, Kontaktaufnehmerplättchen and using the Kontaktaufnehmerplättchens
10/04/2012DE102011080256A1 Transformer for ballast used for LED lamp, has primary-side connecting pin and secondary-side connection pin which are provided on mounting face of base, and spacer devices are adapted to vary spacing of mounting face of base to the board
10/04/2012DE102011016034A1 Metal-containing composition, useful e.g. to produce contact structure, comprises electrically conductive metal powder and/or their alloy and/or organometallic compound of the conductive metal, first oxide material, and oxidizing agent
10/04/2012DE102011006632A1 Elektronikmodul Electronics module
10/04/2012DE102011006622A1 Elektronikmodul sowie Verfahren zu dessen Herstellung Electronics module and method for its production
10/04/2012DE102011006356A1 Schaltungsträger mit eingebetteter Schaltungsplatine Circuit board with embedded circuit board
10/04/2012DE10030289B4 Träger für Bauteile und Herstellungsverfahren Support for components and manufacturing processes
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