| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/21/2013 | WO2013024314A1 Gas distribution system for a reaction chamber |
| 02/21/2013 | WO2013024128A1 Arrangement comprising photocells |
| 02/21/2013 | WO2013023971A1 Pressing tool and method for pressing a silicone element |
| 02/21/2013 | WO2013023708A1 Apparatus and method for bonding substrates |
| 02/21/2013 | WO2013023680A1 Holding device for holding a patterned wafer |
| 02/21/2013 | WO2013023561A1 Array substrate, preparation method thereof and display device |
| 02/21/2013 | WO2013023528A1 Capacitor and preparation method thereof |
| 02/21/2013 | WO2013023456A1 Method for simultaneously preparing vertical conduction hold and first layer of re-wiring layer |
| 02/21/2013 | WO2013023445A1 Eeprom core structure embedded with bcd process and forming method thereof |
| 02/21/2013 | WO2013023417A1 Manufacturing method of semiconductor device |
| 02/21/2013 | WO2013023360A1 Test pin array with electrostatic discharge protection |
| 02/21/2013 | WO2013009433A8 Method of growing heteroepitaxial single crystal or large grained semiconductor films on glass substrates and devices thereon |
| 02/21/2013 | WO2012173770A3 Multi-step and asymmetrically shaped laser beam scribing |
| 02/21/2013 | WO2012173768A3 Water soluble mask for substrate dicing by laser and plasma etch |
| 02/21/2013 | WO2012170630A3 Nanoscale wires, nanoscale wire fet devices, and nanotube-electronic hybrid devices for sensing and other applications |
| 02/21/2013 | WO2012164405A3 Introduction of an insulating buffer layer in multilayer with electro - optic layer |
| 02/21/2013 | WO2012138868A3 Exposed die package for direct surface mounting |
| 02/21/2013 | WO2012129422A9 Aromatic polyamide films for transparent flexible substrates |
| 02/21/2013 | WO2012116270A3 Real time liquid particle counter (lpc) end point detection system |
| 02/21/2013 | WO2012112937A3 Method and system for wafer level singulation |
| 02/21/2013 | US20130045663 Method and apparatus for optically measuring by interferometry the thickness of an object |
| 02/21/2013 | US20130045609 Method for making a semiconductor device by laser irradiation |
| 02/21/2013 | US20130045608 Reduction of pore fill material dewetting |
| 02/21/2013 | US20130045607 Pattern generating apparatus, pattern generating program, and method for fabricating semiconductor device |
| 02/21/2013 | US20130045606 Semiconductor device cleaning method and apparatus |
| 02/21/2013 | US20130045605 Dry-etch for silicon-and-nitrogen-containing films |
| 02/21/2013 | US20130045604 Plasma processing apparatus and plasma processing method |
| 02/21/2013 | US20130045603 Semiconductor process |
| 02/21/2013 | US20130045602 Method for forming contact holes |
| 02/21/2013 | US20130045601 Composition for forming a silicon-containing resist underlayer film and patterning process using the same |
| 02/21/2013 | US20130045600 Method for forming fin-shaped semiconductor structure |
| 02/21/2013 | US20130045599 Method for chemical mechanical polishing copper |
| 02/21/2013 | US20130045598 Method for chemical mechanical polishing tungsten |
| 02/21/2013 | US20130045597 Liquid composition for cleaning semiconductor substrate and method of cleaning semiconductor substrate using the same |
| 02/21/2013 | US20130045596 Semiconductor device manufacturing method and polishing apparatus |
| 02/21/2013 | US20130045595 Method for processing metal layer |
| 02/21/2013 | US20130045594 Manufacturing method for semiconductor device having metal gate |
| 02/21/2013 | US20130045593 Method for manufacturing silicon carbide semiconductor device |
| 02/21/2013 | US20130045592 Method for manufacturing silicon carbide semiconductor device and device for manufacturing silicon carbide semiconductor device |
| 02/21/2013 | US20130045591 Negative tone develop process with photoresist doping |
| 02/21/2013 | US20130045590 Carbon tape intended to receive a layer of a semiconductor material |
| 02/21/2013 | US20130045589 Semiconductor devices and methods of manufacturing the same |
| 02/21/2013 | US20130045588 Method for manufacturing semiconductor device |
| 02/21/2013 | US20130045587 LOW TEMPERATURE MIGRATION ENHANCED Si-Ge EPITAXY WITH PLASMA ASSISTED SURFACE ACTIVATION |
| 02/21/2013 | US20130045586 Process Of Internal Gettering For Czochralski Silicon Wafer |
| 02/21/2013 | US20130045585 Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device |
| 02/21/2013 | US20130045584 Method of eliminating fragments of material present on the surface of a multilayer structure |
| 02/21/2013 | US20130045583 Method for measuring defects in a silicon substrate |
| 02/21/2013 | US20130045582 Capacitor insulating film, method of forming the same, capacitor and semiconductor device using the capacitor insulating film |
| 02/21/2013 | US20130045581 Method of manufacturing a semiconductor device |
| 02/21/2013 | US20130045580 Methods for fabricating finfet integrated circuits in bulk semiconductor substrates |
| 02/21/2013 | US20130045579 Method of forming semiconductor device |
| 02/21/2013 | US20130045578 Devices and methods to improve carrier mobility |
| 02/21/2013 | US20130045577 Manufacturing method of high voltage device |
| 02/21/2013 | US20130045576 Method for fabricating field effect transistor with fin structure |
| 02/21/2013 | US20130045575 Epoxy encapsulating and lamination adhesive and method of making same |
| 02/21/2013 | US20130045574 Semiconductor package and method of manufacturing the semiconductor package |
| 02/21/2013 | US20130045573 Chip on leads |
| 02/21/2013 | US20130045571 Method for fabricating electronic device package |
| 02/21/2013 | US20130045570 Method and system for wafer level singulation |
| 02/21/2013 | US20130045569 Method and apparatus for fabricating integrated circuit device using self-organizing function |
| 02/21/2013 | US20130045568 Semiconductor device and manufacturing method thereof |
| 02/21/2013 | US20130045567 Methods for manufacturing a metal-oxide thin film transistor |
| 02/21/2013 | US20130045557 Deposition of porous films for thermoelectric applications |
| 02/21/2013 | US20130045555 Thin film semiconductor device, display device using such thin film semiconductor device and manufacturing method thereof |
| 02/21/2013 | US20130045548 Apparatus and method for simultaneous deposition of a plurality of semiconductor layers in a plurality of process chambers |
| 02/21/2013 | US20130045547 Plasma processing apparatus and plasma processing method |
| 02/21/2013 | US20130045546 DETECTION OF SURFACE DEFECTS BY OPTICAL INLINE METROLOGY DURING Cu-CMP PROCESS |
| 02/21/2013 | US20130045545 Test map classification method and fabrication process condition setting method using the same |
| 02/21/2013 | US20130044782 Optical Device Structure Using GaN Substrates and Growth Structures for Laser Applications |
| 02/21/2013 | US20130044781 Semiconductor laser element and method of manufacturing the same |
| 02/21/2013 | US20130044455 Vertically oriented semiconductor device and shielding structure thereof |
| 02/21/2013 | US20130044322 Semiconductor laser mounting with intact diffusion barrier layer |
| 02/21/2013 | US20130044004 Apparatus and Methods for Real-Time Error Detection in CMP Processing |
| 02/21/2013 | US20130043940 Back-to-back stacked dies |
| 02/21/2013 | US20130043696 Electric-Controlled Operator |
| 02/21/2013 | US20130043635 Stage heater and method of manufacturing shaft |
| 02/21/2013 | US20130043604 Semiconductor device and method for manufacturing the same |
| 02/21/2013 | US20130043603 Method of forming a conductive image on a non-conductive surface |
| 02/21/2013 | US20130043599 Chip package process and chip package structure |
| 02/21/2013 | US20130043598 Bond pad structure to reduce bond pad corrosion |
| 02/21/2013 | US20130043597 Semiconductor Constructions and Methods of Forming Interconnects |
| 02/21/2013 | US20130043594 Method for manufacturing semiconductor device and semiconductor device |
| 02/21/2013 | US20130043592 Methods of Forming a Replacement Gate Comprised of Silicon and a Device Including Same |
| 02/21/2013 | US20130043591 Tungsten metallization: structure and fabrication of same |
| 02/21/2013 | US20130043590 Semiconductor structure and method of manufacturing |
| 02/21/2013 | US20130043589 Methods of Forming a Non-Planar Cap Layer Above Conductive Lines on a Semiconductor Device |
| 02/21/2013 | US20130043587 Package-on-package structures |
| 02/21/2013 | US20130043586 Method for encapsulating electronic components on a wafer |
| 02/21/2013 | US20130043585 Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus |
| 02/21/2013 | US20130043583 Dummy Flip Chip Bumps for Reducing Stress |
| 02/21/2013 | US20130043575 Chip-packaging module for a chip and a method for forming a chip-packaging module |
| 02/21/2013 | US20130043574 Multi-Die Semiconductor Package With One Or More Embedded Die Pads |
| 02/21/2013 | US20130043573 Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores |
| 02/21/2013 | US20130043571 Power overlay structure with leadframe connections |
| 02/21/2013 | US20130043569 Integrated Circuit Devices and Methods and Apparatuses for Designing Integrated Circuit Devices |
| 02/21/2013 | US20130043563 Semiconductor device and method of manufacturing the same |
| 02/21/2013 | US20130043562 Compressive Polycrystalline Silicon Film and Method of Manufacture Thereof |
| 02/21/2013 | US20130043560 Metal-Insulator-Metal Capacitor and Method of Fabricating |
| 02/21/2013 | US20130043559 Trench formation in substrate |