| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/21/2013 | US20130043557 Vertically oriented semiconductor device and shielding structure thereof |
| 02/21/2013 | US20130043556 Size-filtered multimetal structures |
| 02/21/2013 | US20130043554 Method and structure for vertical integration of semiconductor devices |
| 02/21/2013 | US20130043551 Sloped structure, method for manufacturing sloped structure, and spectrum sensor |
| 02/21/2013 | US20130043548 Method for manufacturing a micromechanical structure, and micromechanical structure |
| 02/21/2013 | US20130043547 Mems device having chip scale packaging |
| 02/21/2013 | US20130043546 Semiconductor Contact Barrier |
| 02/21/2013 | US20130043545 Semiconductor device having high-k gate dielectric layer and manufacturing method thereof |
| 02/21/2013 | US20130043544 Structure having three independent finfet transistors |
| 02/21/2013 | US20130043543 Semiconductor device and method of manufacturing the same |
| 02/21/2013 | US20130043542 Semiconductor device and method of manufacturing the same |
| 02/21/2013 | US20130043540 Implant for performance enhancement of selected transistors in an integrated circuit |
| 02/21/2013 | US20130043539 Interlayer dielectric structure and method making the same |
| 02/21/2013 | US20130043537 Semiconductor device and method for manufacturing semiconductor device |
| 02/21/2013 | US20130043536 Buffered finfet device |
| 02/21/2013 | US20130043535 Isolation region fabrication for replacement gate processing |
| 02/21/2013 | US20130043534 High density lateral dmos and associated method for making |
| 02/21/2013 | US20130043532 Lateral high-voltage transistor and associated method for manufacturing |
| 02/21/2013 | US20130043531 Vertically stacked fin transistors and methods of fabricating and operating the same |
| 02/21/2013 | US20130043528 Power transistor device and fabricating method thereof |
| 02/21/2013 | US20130043527 Shielded gate trench mosfet package |
| 02/21/2013 | US20130043526 Method of making an insulated gate semiconductor device with source-substrate connection and structure |
| 02/21/2013 | US20130043523 Nonvolatile semiconductor memory device and method of manufacturing the same |
| 02/21/2013 | US20130043522 Semiconductor structure and method of forming the same |
| 02/21/2013 | US20130043521 3-dimensional non-volatile memory device and method of manufacturing the same |
| 02/21/2013 | US20130043517 Semiconductor Structure And Method For Manufacturing The Same |
| 02/21/2013 | US20130043516 Semiconductor Device and Manufacturing Method Thereof |
| 02/21/2013 | US20130043515 Strained Channel Field Effect Transistor and the Method for Fabricating the Same |
| 02/21/2013 | US20130043514 Multiphase ultra low k dielectric material |
| 02/21/2013 | US20130043513 Shallow trench isolation structure and fabricating method thereof |
| 02/21/2013 | US20130043512 Semiconductor Device Manufacturing Methods and Methods of Forming Insulating Material Layers |
| 02/21/2013 | US20130043511 Integrated circuits and methods of forming integrated circuits |
| 02/21/2013 | US20130043510 Structure and method for motion sensor |
| 02/21/2013 | US20130043509 3-d structured non-volatile memory device and method of manufacturing the same |
| 02/21/2013 | US20130043508 Method for Manufacturing a Low Defect Interface Between a Dielectric and a III-V Compound |
| 02/21/2013 | US20130043507 Semiconductor Device with a Buried Stressor |
| 02/21/2013 | US20130043506 Fin-FET and Method of Forming the Same |
| 02/21/2013 | US20130043505 Apparatuses and methods comprising a channel region having different minority carrier lifetimes |
| 02/21/2013 | US20130043490 Semiconductor device and method for fabricating the device |
| 02/21/2013 | US20130043488 Epitaxial substrate and method for manufacturing epitaxial substrate |
| 02/21/2013 | US20130043486 System and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same |
| 02/21/2013 | US20130043484 Hemt with integrated low forward bias diode |
| 02/21/2013 | US20130043480 Exposure Device, Exposure Method and Method of Manufacturing Semiconductor Device |
| 02/21/2013 | US20130043479 Thin film transistor substrate and method for fabricating the same |
| 02/21/2013 | US20130043474 Active array substrate and method for manufacturing the same |
| 02/21/2013 | US20130043473 Display substrate and method of manufacturing the same |
| 02/21/2013 | US20130043471 Magnetic tunnel junction for MRAM applications |
| 02/21/2013 | US20130043470 Crack stop structure and method for forming the same |
| 02/21/2013 | US20130043469 Thin-Film Transistor and Method for Manufacturing the Same |
| 02/21/2013 | US20130043468 Vertical field effect transistor on oxide semiconductor substrate |
| 02/21/2013 | US20130043467 Thin film device and manufacturing method thereof |
| 02/21/2013 | US20130043466 Semiconductor device and method for manufacturing the same |
| 02/21/2013 | US20130043464 Thin film transistor, pixel structure and method for fabricating the same |
| 02/21/2013 | US20130043452 Structures And Methods For Facilitating Enhanced Cycling Endurance Of Memory Accesses To Re-Writable Non Volatile Two Terminal Memory Elements |
| 02/21/2013 | US20130042899 Thermoelectric device |
| 02/21/2013 | US20130042808 Film crack detection apparatus and film forming apparatus |
| 02/21/2013 | DE202011110123U1 Vorrichtung zum Trocknen von Substraten A device for drying substrates |
| 02/21/2013 | DE19964471B4 Semiconductor diode surface contact manufacturing method - has contact formed by galvanic thickening of metal film applied to surface of semiconductor diode |
| 02/21/2013 | DE112010005514T5 Nassätz-Spannvorrichtung Wet etching jig |
| 02/21/2013 | DE10394374B4 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 02/21/2013 | DE10391795B4 Verfahren zum Bearbeiten und Zerteilen eines Halbleiterwafers A method of machining and dicing a semiconductor wafer |
| 02/21/2013 | DE102012200236B3 Method for structuring silicon carbide for e.g. silicon carbide-trench-MOSFET, involves reperforming anisotropic plasma etching step such that passivation layer is removed from trench bottom, and forming enlarged trench region in substrate |
| 02/21/2013 | DE102012107403A1 Chip-Gehäuse-Modul für einen Chip und ein Verfahren zum Herstellen eines Chip-Gehäuse-Moduls Chip package for a chip module and a method of manufacturing a chip package module |
| 02/21/2013 | DE102012107289A1 System und Verfahren zum Ausrichten eines Wafers für die Herstellung System and method for aligning a wafer for the production |
| 02/21/2013 | DE102012107287A1 System und Verfahren zum identifizieren von Fehlern in einem Material System and method for identifying defects in a material |
| 02/21/2013 | DE102012106710A1 Chip-Montagevorrichtung und Verfahren zur Chip-Montage Chip mounting apparatus and method for mounting chip- |
| 02/21/2013 | DE102012015942A1 Verfahren zur Herstellung von chemisch-mechanischen Polierschichten Process for the preparation of chemical mechanical polishing layers |
| 02/21/2013 | DE102012015825A1 Verfahren zum chemisch-mechanischen Polieren von Wolfram A method for chemical-mechanical polishing of tungsten |
| 02/21/2013 | DE102012015824A1 Verfahren zum chemisch-mechanischen Polieren von Kupfer A method for chemical mechanical polishing of copper |
| 02/21/2013 | DE102011111032A1 Method for manufacturing power-semiconductor module, involves copper layer made of electrically conductive material differs from material and isolated on connecting surfaces and bonding wires |
| 02/21/2013 | DE102011110616A1 Transport apparatus for transporting planar semiconductor substrates to drying furnace chamber to drive out solvent of electronic screen printing pastes during manufacturing solar cells, has power supply that produces current flow by belt |
| 02/21/2013 | DE102011110592A1 Verfahren zum Konditionieren von flachen Gegenständen A method for conditioning of flat objects |
| 02/21/2013 | DE102011110362A1 Sawing ingots, bricks or wafers that are useful for fabricating a photovoltaic device, where the cooling fluid contains a suspension of solid particles and the saw is encased by a saw layer in the longitudinal direction |
| 02/21/2013 | DE102011081099A1 Anordnung mit Sensor oder Aktor und Bausteinen Assembly with sensor or actuator and components |
| 02/21/2013 | DE102010053297B4 Halbleiterbauelement mit reduziertem Oberflächenfeldeffekt und Verfahren zu dessen Fertigung A semiconductor device with reduced surface field effect and process for its manufacturing |
| 02/21/2013 | DE102010034002B4 Siliciumscheibe und Verfahren zu deren Herstellung Silicon wafer and processes for their preparation |
| 02/21/2013 | DE102007057950B4 Vorrichtung zur Halterung von Werkstücken, insbesondere bei der Oberflächenbearbeitung von Linsen, Halbleitern und dergleichen unter Vakuum oder Atmosphäre, mittels Ionenstrahlen, Verwendung der Vorrichtung sowie Bearbeitungsvorrichtung A device for holding workpieces, in particular for surface treatment of lenses, semiconductors and the like under vacuum or atmosphere by means of ion beams, use of the apparatus and processing apparatus |
| 02/21/2013 | DE102005020342B4 Verfahren zur Herstellung von Ladungseinfang-Speicherbauelementen A process for the production of charge trapping memory devices, |
| 02/21/2013 | DE102004030268B4 Verfahren zum Herstellen eines Halbleiterelements A method of manufacturing a semiconductor element |
| 02/21/2013 | DE10107337B4 Haftkleberfolie zum Wafer-Kleben Adhesive film for wafer bonding |
| 02/20/2013 | EP2560210A1 Semiconductor device and manufacturing method thereof |
| 02/20/2013 | EP2560209A1 Buffered Finfet Device |
| 02/20/2013 | EP2560206A1 Semiconductor device |
| 02/20/2013 | EP2560199A1 Process for manufacturing a through insulated interconnection in a body of semiconductor material |
| 02/20/2013 | EP2560198A1 Light-reflective anisotropic conductive adhesive agent, and light emitting device |
| 02/20/2013 | EP2560197A1 Conductive connecting member and manufacturing method of same |
| 02/20/2013 | EP2560196A1 Method and system for forming a metallic structure |
| 02/20/2013 | EP2560195A1 Memory device with an isolated gate comprising two portions separated by a barrier and method of operating the same |
| 02/20/2013 | EP2560194A1 Silicon carbide semiconductor device and method for manufacturing same |
| 02/20/2013 | EP2560193A1 Gas injection unit and a thin-film vapour-deposition device and method using the same |
| 02/20/2013 | EP2560192A2 Stage device, exposure apparatus, and method of manufacturing devices |
| 02/20/2013 | EP2560191A1 Semiconductor substrate having dot markings, and method for producing same |
| 02/20/2013 | EP2560190A1 Group iii nitride composite substrate |
| 02/20/2013 | EP2560049A2 Composition for forming a silicon-containing resist underlayer film and patterning processing using the same |
| 02/20/2013 | EP2559791A1 Single-crystal substrate, single-crystal substrate having crystalline film, crystalline film, method for producing single-crystal substrate having crystalline film, method for producing crystalline substrate, and method for producing element |
| 02/20/2013 | EP2559062A2 Forming functionalized carrier structures with coreless packages |
| 02/20/2013 | EP2559061A2 Method and device for forming solder deposits on protruding contacts |
| 02/20/2013 | EP2559060A2 Composition and method for polishing bulk silicon |
| 02/20/2013 | EP2559059A2 Apparatus for high throughput wafer bonding |
| 02/20/2013 | EP2559058A2 Method for producing a photovoltaic module comprising semiconductor cells contact-connected on the rear side, and photovoltaic module |