Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1989
08/08/1989US4855246 Fabrication of a gaas short channel lightly doped drain mesfet
08/08/1989US4855245 Method of manufacturing integrated circuit containing bipolar and complementary MOS transistors on a common substrate
08/08/1989US4855244 Method of making vertical PNP transistor in merged bipolar/CMOS technology
08/08/1989US4855214 Radiation-sensitive high-polymeric material
08/08/1989US4855199 Photopatterned product of silicone polyamic acid on a transparent substrate
08/08/1989US4855197 Mask for ion, electron or X-ray lithography and method of making it
08/08/1989US4855190 Electroluminescent lighting elements
08/08/1989US4855160 Method for passivating wafer
08/08/1989US4855102 Sintering method
08/08/1989US4855017 Reactive ion etching
08/08/1989US4855016 Method for etching aluminum film doped with copper
08/08/1989US4855015 Dry etch process for selectively etching non-homogeneous material bilayers
08/08/1989US4855014 Monocrystalline thin film is formed by dissolving and recrystallizing amorphous or polycrystalline film, annealing with radiatiion beam
08/08/1989US4855007 Automatic die attach workholder
08/08/1989US4854986 Bonding technique to join two or more silicon wafers
08/08/1989US4854731 Temperature sensing apparatus
08/08/1989US4854658 Radiation deflector assembly
08/08/1989US4854623 End effector
08/08/1989US4854495 Sealing structure, method of soldering and process for preparing sealing structure
08/08/1989US4854494 Monitoring bond parameters during the bonding process
08/08/1989US4854444 Precise feeding mechanism
08/08/1989US4854337 Apparatus for treating wafers utilizing megasonic energy
08/08/1989CA1258320A1 Small contactless ram cell
08/03/1989DE3802841A1 Method for characterising optical properties of semiconductor lasers, and device for carrying out the method
08/02/1989EP0326531A2 Improved RF plasma processing apparatus
08/02/1989EP0326499A1 Sintering process of conductors made of copper or copper-based alloys and of their cordierite ceramic substrate
08/02/1989EP0326465A1 Floating-gate EEPROM memory with a transistor for source line selection
08/02/1989EP0326432A2 Semiconductor device having a defect-containing zone in the substrate
08/02/1989EP0326425A2 Positioning mechanism and method
08/02/1989EP0326405A2 Plasma chemical vapour reaction apparatus
08/02/1989EP0326362A2 Bipolar transistor process using sidewall spacer for aligning base insert
08/02/1989EP0326293A1 Method for forming interconnects
08/02/1989EP0326218A1 Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body
08/02/1989EP0326217A1 Method of manufacturing a semiconductor device
08/02/1989EP0326211A1 Semiconductor device and method of manufacturing same
08/02/1989EP0326204A2 Method for realizing an electrical contact to an electronic device
08/02/1989EP0326187A2 Power MOSFET structure
08/02/1989EP0326020A2 Laser bonding apparatus and method
08/02/1989EP0326018A2 Semiconductor device comprising conductor films
08/02/1989EP0325950A1 Semiconductor device with polyimide passivation
08/02/1989EP0325939A2 Process for planarizing the surfaces of semiconductors
08/02/1989EP0325808A1 Process for producing an electric connexion on a silicon semiconductor device
08/02/1989EP0325753A2 Apparatus for monitoring the conductivity of a semiconductor wafer during polishing
08/02/1989EP0325704A2 Process for the simultaneous manufacture of a plurality of semiconductor devices from a single wafer
08/02/1989EP0325660A1 Method of heat treatment of low melting -point metal
08/02/1989EP0325647A1 A method and apparatus for dry processing or etching a substrate
08/02/1989EP0202279B1 Process for encapsulating micro-electronic semi-conductor and layer-type circuits
08/02/1989EP0183724B1 Integrated circuit package
08/02/1989CN1034400A Manufacturing method and equipment of single silicon crystal
08/01/1989USH665 Resistive field shields for high voltage devices
08/01/1989US4853968 Pattern recognition apparatus and method
08/01/1989US4853895 EEPROM including programming electrode extending through the control gate electrode
08/01/1989US4853894 Static random-access memory having multilevel conductive layer
08/01/1989US4853893 Data storage device and method of using a ferroelectric capacitance divider
08/01/1989US4853870 Electron beam exposure system
08/01/1989US4853763 Mounting base pad means for semiconductor devices and method of preparing same
08/01/1989US4853761 Semiconductor device
08/01/1989US4853760 Semiconductor device having insulating layer including polyimide film
08/01/1989US4853758 Laser-blown links
08/01/1989US4853757 Semiconductor integrated circuit
08/01/1989US4853756 Projection exposure apparatus
08/01/1989US4853745 Exposure apparatus
08/01/1989US4853646 Temperature compensated bipolar circuits
08/01/1989US4853628 Apparatus for measuring circuit parameters of a packaged semiconductor device
08/01/1989US4853562 Programmable logic array using single transistor to generate true or complement signal
08/01/1989US4853561 Family of noise-immune logic gates and memory cells
08/01/1989US4853549 Electron beam drawing method
08/01/1989US4853347 Selective metal deposition process
08/01/1989US4853346 Ohmic contacts for semiconductor devices and method for forming ohmic contacts
08/01/1989US4853345 Process for manufacture of a vertical DMOS transistor
08/01/1989US4853344 Method of integrated circuit isolation oxidizing walls of isolation slot, growing expitaxial layer over isolation slot, and oxidizing epitaxial layer over isolation slot
08/01/1989US4853343 Method for fabricating a semiconductor integrated circuit device having thick oxide films and groove etch and refill
08/01/1989US4853342 Method of manufacturing semiconductor integrated circuit device having transistor
08/01/1989US4853341 Process for forming electrodes for semiconductor devices using focused ion beams
08/01/1989US4853340 Semiconductor device isolated by a pair of field oxide regions
08/01/1989US4853339 Method of sensitizing Pb-salt epitaxial films for schottky diodes
08/01/1989US4853286 Adhesive layer
08/01/1989US4853251 Process for forming deposited film including carbon as a constituent element
08/01/1989US4853077 Process for the preparation of mono-crystalline 3-5 semi-insulating materials by doping and use of the semi-insulating materials thus obtained
08/01/1989US4853076 Heat treatment while crystallizing to produce tensile stress which produces electron mobility
08/01/1989US4852516 Modular processing apparatus for processing semiconductor wafers
08/01/1989US4852250 Hermetically sealed package having an electronic component and method of making
08/01/1989US4852247 Suction pick-up apparatus for electrical or electronic components
08/01/1989CA1258141A1 Integrated circuits having stepped dielectric regions
08/01/1989CA1258140A1 Self-aligned channel stop
08/01/1989CA1258125A1 High-performance dram arrays including trench capacitors
08/01/1989CA1258124A1 Trench-incorporated monolithic semiconductor capacitor and high density dynamic memory cells including the capacitor
07/1989
07/27/1989WO1989006863A1 Method of producing semiconductor devices
07/27/1989WO1989006862A1 Semiconductor device
07/27/1989DE3901114A1 Method for fabricating a semiconductor device
07/26/1989EP0325575A2 Device for stabilizing an illuminated mask
07/26/1989EP0325545A2 Laminate for the formation of beam leads for ic chip bonding featuring improved positive-working resist
07/26/1989EP0325524A1 Charge transfer memory and method of producing it
07/26/1989EP0325514A2 Lead detection for cut and clinch process
07/26/1989EP0325493A2 Epitaxial substrate for high-intensity LED, and method of manufacturing same
07/26/1989EP0325408A2 Semiconductor device having an interconnection layer
07/26/1989EP0325383A2 Charge amplifier circuit comprising a junction field effect transistor
07/26/1989EP0325342A2 Complementary BICMOS process with isolated vertical PNP transistors
07/26/1989EP0325328A1 A method of manufacturing a semiconductor device using sputter etching
07/26/1989EP0325275A2 A visible light semiconductor laser with (AlxGa1-x)0.5In0.5P crystal layers and a process for growing an (AlxGa1-x)0.5In0.5P crystal
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