Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/1989
09/12/1989CA1259426A1 Method of producing soi devices
09/12/1989CA1259425A1 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
09/12/1989CA1259168A1 Method of assembly of at least two components of ceramic material each having at least one flat surface
09/11/1989EP0318539A4 Microwave plasma generator.
09/08/1989WO1989008325A1 Semiconductor component with two connections and process and device for manufacturing it
09/08/1989WO1989008324A1 Alignment of leads for ceramic integrated circuit packages
09/08/1989WO1989008323A1 Process for anisotropic etching of semiconductor materials using an electrochemical etch-stop
09/08/1989WO1989008322A1 Focused ion beam imaging and process control
09/08/1989WO1989008060A1 Robotic accessible wafer shipper assembly
09/08/1989WO1989007332A3 Esd protection circuit employing channel depletion
09/08/1989WO1989006444A3 Vertical power transistor and fabrication methods
09/07/1989DE3806287A1 Etching process for patterning a multilayer metallisation
09/07/1989DE3805971A1 Handling device
09/06/1989EP0331598A2 A method for producing a plurality of layers of metallurgy
09/06/1989EP0331555A1 Gettering treatment process
09/06/1989EP0331527A2 Superconductive transistor
09/06/1989EP0331500A1 Brazing paste for bonding metal and ceramic
09/06/1989EP0331494A2 Photoresist process
09/06/1989EP0331482A2 Transistor structure
09/06/1989EP0331477A2 Organic dye thin film and organic thin film element
09/06/1989EP0331467A2 Method of forming semiconductor thin film
09/06/1989EP0331433A1 Semiconductor substrate comprising wafer substrate and compound semiconductor layer
09/06/1989EP0331431A1 Semiconductor memory device with improved address wiring arrangement
09/06/1989EP0331418A2 Eprom programming elements
09/06/1989EP0331333A2 Method of making an article comprising a tandem groove, and article produced by the method
09/06/1989EP0331282A1 Membrane-based IC test probe with precisely positioned contacts
09/06/1989EP0331245A2 Integrated circuit chip package and method
09/06/1989EP0331223A2 Process for obtaining high-voltage N channel transistors particularly for EEPROM memories with CMOS technology
09/06/1989EP0331206A2 Semiconductor integrated circuit device of multilayer interconnection structure
09/06/1989EP0331161A1 Method for fabricating multilayer circuits
09/06/1989EP0331114A2 Programmable logic array
09/06/1989EP0331113A2 Semiconductor memory device
09/06/1989EP0331051A2 Magnetic device integrated circuit interconnection system
09/06/1989EP0331022A2 Radiation induced pattern deposition
09/06/1989EP0330989A2 Integrated circuit die with resistive substrate isolation of multiple circuits
09/06/1989EP0330909A2 Process for mounting parts on a printed-circuit board
09/06/1989EP0330896A2 Method for attaching semiconductor components to substrates, and arrangement for carrying it out
09/06/1989EP0330895A2 Method for attaching electronic components to substrates, and arrangement for carrying it out
09/06/1989EP0330848A1 Heat-conductive aluminium nitride sintered body and method of manufacturing the same
09/06/1989EP0330831A1 Method and device to insert electronic components in metallic support strips
09/06/1989EP0330749A1 Semiconductor device
09/06/1989EP0185426B1 Integrated circuits comprising a protection device against electrostatic discharges
09/06/1989CN1035396A Process for manufacturing copper thick-film conductor by infrared stove
09/05/1989US4864581 Semiconductor structures and a method of manufacturing semiconductor structures
09/05/1989US4864539 Radiation hardened bipolar static RAM cell
09/05/1989US4864514 Wire-bonding method and apparatus
09/05/1989US4864471 Component for surface mounting and method for fastening a component for surface mounting
09/05/1989US4864464 Low-profile, folded-plate dram-cell capacitor fabricated with two mask steps
09/05/1989US4864454 Means for reducing damage to JFETs from electrostatic discharge events
09/05/1989US4864384 Pre-matched module for an ultra-high frequency diode and a process for forming the biasing connection for the diode
09/05/1989US4864379 Bipolar transistor with field shields
09/05/1989US4864378 Schottky barrier infrared detector
09/05/1989US4864377 Silicon on insulator (SOI) semiconductor device
09/05/1989US4864376 Thin-film transistor and method of fabricating the same
09/05/1989US4864373 Semiconductor circuit device with voltage clamp
09/05/1989US4864372 Field effect transistor
09/05/1989US4864371 Partially opaque substrate red LED
09/05/1989US4864360 Exposure apparatus
09/05/1989US4864220 Voltage detector using electro-optic material and interference of light beams
09/05/1989US4863880 InSb device manufacturing by anodic oxidation
09/05/1989US4863879 Method of manufacturing self-aligned GaAs MESFET
09/05/1989US4863878 Integrated circuits; radiation resistance
09/05/1989US4863877 Ion implantation and annealing of compound semiconductor layers
09/05/1989US4863808 Undercutting resistance from gold and tin plating baths
09/05/1989US4863755 Plasma enhanced chemical vapor deposition of thin films of silicon nitride from cyclic organosilicon nitrogen precursors
09/05/1989US4863683 Oxidation, reduction, sintering
09/05/1989US4863657 Method of making semi-conductor diffusion furnace components
09/05/1989US4863563 Nonionic surfactants
09/05/1989US4863562 Multilayer, channels, silicon oxides and nitrides
09/05/1989US4863561 Method and apparatus for cleaning integrated circuit wafers
09/05/1989US4863560 Ink printheads
09/05/1989US4863559 Method for forming local interconnects using chlorine bearing agents
09/05/1989US4863558 Method for etching tungsten
09/05/1989US4863557 Pattern forming process and thin-film magnetic head formed by said process
09/05/1989US4863556 Method for transferring superfine photoresist structures
09/05/1989US4863554 Process for pulling a single crystal
09/05/1989US4863548 Test pattern for use monitoring variations of critical dimensions of patterns during fabrication of semiconductor devices
09/05/1989US4863547 Equipment for heating and cooling substrates for coating photo resist thereto
09/05/1989US4863529 Thin film single crystal diamond substrate
09/05/1989US4862827 Apparatus for coating semiconductor components on a dielectric film
09/05/1989US4862588 Method of making a flexible interconnect
09/05/1989US4862586 Lead frame for enclosing semiconductor chips with resin
09/05/1989CA1259135A1 Selectively accessible memory having an active load
08/1989
08/31/1989DE3905634A1 Semiconductor storage device and method for its fabrication
08/31/1989DE3805752A1 Anisotropes aetzverfahren mit elektrochemischem aetzstop Anisotropic etching method with electrochemical etch stop
08/31/1989DE3805584A1 Device and method for the controlled feeding of a bonding wire to the wedge or to the capillary of a bonding head
08/30/1989EP0330589A1 Device for transferring objects from at least one supporting member to at least one other supporting member
08/30/1989EP0330536A2 Method and apparatus for inspecting reticles
08/30/1989EP0330512A2 Producing electronic components with the aid of lead frames
08/30/1989EP0330437A1 VLSI optimized modulator
08/30/1989EP0330386A2 Radiation sensitive materials and devices made therewith
08/30/1989EP0330371A1 Plasma etching process
08/30/1989EP0330330A2 Filled grid mask
08/30/1989EP0330299A2 Semi-custom integrated circuit
08/30/1989EP0330189A2 Semiconductor crystal pulling method
08/30/1989EP0330175A2 A method and an apparatus for evaluating the gas purifying ability of a gas purifier
08/30/1989EP0330142A2 Multi-gate field-effect transistor
08/30/1989EP0330141A1 Crystal pulling apparatus and crystal pulling method using the same
08/30/1989EP0330105A2 Integrated thin-film diaphragm
08/30/1989EP0330053A2 Device and method for the controlled supply of a bonding wire to the wedge or to the capillary of a bonding head
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