Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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03/20/1990 | US4910566 Layer structure of a memory cell for a dynamic random access memory device and method for producing the same |
03/20/1990 | US4910565 Electrically erasable and electrically programmable read-only memory |
03/20/1990 | US4910564 Highly integrated field effect transistor and method for manufacturing the same |
03/20/1990 | US4910562 Field induced base transistor |
03/20/1990 | US4910499 Tag and method of making same |
03/20/1990 | US4910232 Ultraviolet-curable organopolysiloxane composition |
03/20/1990 | US4910170 Forming grooves in film |
03/20/1990 | US4910169 Forming copper metallization film; patterning; depositing dielectric |
03/20/1990 | US4910168 Method to reduce silicon area for via formation |
03/20/1990 | US4910167 III-V Semiconductor growth initiation on silicon using TMG and TEG |
03/20/1990 | US4910165 Method for forming epitaxial silicon on insulator structures using oxidized porous silicon |
03/20/1990 | US4910164 Forming masked recesses; deposit second layer; remove second layer; remove except over recesses |
03/20/1990 | US4910163 Gaseous stream of iodine and carrier gas; passing through silicon to produce silicon iodide; disproportionate with silicon oxide; deposit silicon on substrate |
03/20/1990 | US4910162 Integrated circuit; containing silicon switch transistor |
03/20/1990 | US4910161 Preparing first electroconductive semiconductor substate; doping; forming electrodes; then second electroconductive layer; supplying constant voltage |
03/20/1990 | US4910160 Masking oxide, etching, applying dopes, diffusion cycles on silicon substrate |
03/20/1990 | US4910159 Forming a diffused p-type secondary collector region; joining to primary collector region |
03/20/1990 | US4910157 Method of producing recessed gate of MESFET in compound semiconductor |
03/20/1990 | US4910156 Doping phosphor into crystal |
03/20/1990 | US4910155 Wafer flood polishing |
03/20/1990 | US4910122 Anti-reflective coating |
03/20/1990 | US4910094 Heating, diffusion, exposure |
03/20/1990 | US4910043 Processing apparatus and method |
03/20/1990 | US4909998 Apparatus for performing solution growth of group II-VI compound semiconductor crystal |
03/20/1990 | US4909897 Local oxidation of silicon process |
03/20/1990 | US4909863 Polishing intermetallic surface with aqueous solution containing bromine and an acid |
03/20/1990 | US4909857 Doped intermetallic of tellurium and group 2b metal |
03/20/1990 | US4909701 Articulated arm transfer device |
03/20/1990 | US4909695 Method and apparatus for handling and processing wafer-like materials |
03/20/1990 | US4909431 Method and apparatus for preparing a bonding wire |
03/20/1990 | US4909428 Furnace to solder integrated circuit chips |
03/20/1990 | US4909314 Apparatus for thermal treatment of a wafer in an evacuated environment |
03/20/1990 | US4909184 Apparatus for the formation of a functional deposited film using microwave plasma chemical vapor deposition process |
03/20/1990 | US4909183 Apparatus for plasma CVD |
03/20/1990 | US4908937 Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
03/20/1990 | US4908935 Method for fabricating electronic devices |
03/20/1990 | US4908933 Method of manufacturing a substrate for mounting electronic components |
03/20/1990 | CA1266923A1 Ion beam implantation display method and apparatus |
03/20/1990 | CA1266812A1 Method of fabricating a self-aligned metal- semiconductor fet |
03/20/1990 | CA1266805A1 Semiconductor fabrication |
03/15/1990 | DE3927679A1 Transistor with emitter layer diffused in base layers - has collector layer near base layer, but spaced from emitter layer with sectional main region |
03/15/1990 | DE3913540A1 Self-adjusting Schottky gate formation - involves self-adjusting gate electrode mfr., using structural layer(s) for gate form mfr. |
03/15/1990 | DE3831130A1 Method for producing semiconducting, thin layers on an insulating substrate |
03/15/1990 | DE3830299A1 Method and arrangement for determining internal thermal resistances of wafer-shaped semiconductor components |
03/15/1990 | DE3829906A1 Method for producing semiconductor components |
03/15/1990 | DE3828378A1 Method for producing small openings in thin films |
03/14/1990 | EP0358567A2 Method of exposing patterns of semiconductor devices and stencil mask for carrying out same |
03/14/1990 | EP0358517A2 Compositions including a phenolic resin and a sensitizer |
03/14/1990 | EP0358513A2 Position detecting method and apparatus |
03/14/1990 | EP0358512A2 Position detecting method and apparatus |
03/14/1990 | EP0358467A2 Exposure apparatus and control of the same |
03/14/1990 | EP0358443A2 Mask cassette loading device |
03/14/1990 | EP0358426A2 SOR exposure system |
03/14/1990 | EP0358425A2 Position detecting method and apparatus |
03/14/1990 | EP0358376A2 Integrated test circuit |
03/14/1990 | EP0358371A2 Enhanced test circuit |
03/14/1990 | EP0358365A2 Testing buffer/register |
03/14/1990 | EP0358350A2 Forming a Prescribed Pattern on a Semiconductor Device Layer |
03/14/1990 | EP0358246A1 Method of manufacturing a semiconductor device comprising a silicon body in which semiconductor regions are formed by ion implantations |
03/14/1990 | EP0358194A2 Positive-type photoresist composition |
03/14/1990 | EP0358077A2 Semiconductor device and method of forming it |
03/14/1990 | EP0358042A2 Self-aligned process for manufacturing a gate electrode |
03/14/1990 | EP0357982A2 Memory cell with improved single event upset rate reduction circuitry |
03/14/1990 | EP0357980A2 A memory cell with capacitance for single event upset protection |
03/14/1990 | EP0357824A1 A sheet plasma sputtering method and an apparatus for carrying out the method |
03/14/1990 | EP0357802A1 Methods of manufacture of a resin-sealed semiconductor device |
03/14/1990 | EP0357769A1 Vernier structure for flip chip bonded devices |
03/14/1990 | EP0357759A1 Alignment of leads for ceramic integrated circuit packages |
03/14/1990 | EP0357616A1 Process and device for compensating errors of measurement. |
03/14/1990 | EP0357606A1 Low stress heat sinking for semiconductors |
03/14/1990 | EP0160003B1 Mos floating gate memory cell and process for fabricating same |
03/14/1990 | CN1040462A Cmos transistor and one-capacitor dynamic-random-access memory cell and fabrication process thereof |
03/14/1990 | CN1040461A Electric device and mfg. method of same by use of plasma processing |
03/14/1990 | CN1040460A Forming ways of silicon seperate structure using the oxidization of obstruction style porous silicon |
03/14/1990 | CN1040401A Vapour-phase gaas/inp hetero epitaxial technique |
03/13/1990 | US4908871 Pattern inspection system |
03/13/1990 | US4908736 Self packaging chip mount |
03/13/1990 | US4908696 Connector and semiconductor device packages employing the same |
03/13/1990 | US4908692 Fuse-containing semiconductor device |
03/13/1990 | US4908691 Selective epitaxial growth structure and isolation |
03/13/1990 | US4908690 Semiconductor integrated circuit device with high reliability wiring layers |
03/13/1990 | US4908689 Organic solder barrier |
03/13/1990 | US4908688 Means and method for providing contact separation in silicided devices |
03/13/1990 | US4908683 Technique for elimination of polysilicon stringers in direct moat field oxide structure |
03/13/1990 | US4908680 Semiconductor integrated circuit |
03/13/1990 | US4908679 Low resistance Schottky diode on polysilicon/metal-silicide |
03/13/1990 | US4908495 For use with semiconductor reactors |
03/13/1990 | US4908348 Barrier layer arrangement for conductive layers on silicon substrates |
03/13/1990 | US4908334 Method for forming metallic silicide films on silicon substrates by ion beam deposition |
03/13/1990 | US4908333 Process for manufacturing a semiconductor device having a contact window defined by an inclined surface of a composite film |
03/13/1990 | US4908332 Process for making metal-polysilicon double-layered gate |
03/13/1990 | US4908331 Method of manufacturing a semiconductor device by depositing metal on semiconductor maintained at temperature to form silicide |
03/13/1990 | US4908329 Microwave plasma generated in plasma generation chamber in cavity resonator integrated with impedance circuits for film formation |
03/13/1990 | US4908328 High voltage power IC process |
03/13/1990 | US4908327 Counter-doped transistor |
03/13/1990 | US4908326 Process for fabricating self-aligned silicide lightly doped drain MOS devices |
03/13/1990 | US4908325 Forming gallium arsenide layer, forming doped epitaxial layer of aluminum gallium arsenide, growing aluminum arsenide layer, forming overlying layer, etching, depositing gate electrode |
03/13/1990 | US4908324 Forming insulating film on semiconductor wafer, masking, patterning, depositing conductive material, masking, etching, doping, forming oxide film, doping |
03/13/1990 | US4908299 Forming several layers of sensitive Langmuir-Blodgett film containing silicon, selectively polymerizing or decomposing by radiation, selectively etching |
03/13/1990 | US4908226 Selective area nucleation and growth method for metal chemical vapor deposition using focused ion beams |