Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/1990
04/18/1990EP0364393A2 Power semiconductor device
04/18/1990EP0364259A2 Process for thermally patterning semiconductor bodies
04/18/1990EP0364215A2 Plasma etching apparatus
04/18/1990EP0364164A2 Capacitance guided assembly of parts
04/18/1990EP0364139A1 Crystal article and method for forming same
04/18/1990EP0363982A2 Dry etching method
04/18/1990EP0363978A2 Resist composition
04/18/1990EP0363973A2 Semiconductor memory device
04/18/1990EP0363944A1 Method of manufacturing a semiconductor device having a silicon carbide layer
04/18/1990EP0363936A2 Method of manufacturing electric devices
04/18/1990EP0363776A2 Light-sensitive composition and light-sensitive copy material produced therewith
04/18/1990EP0363737A2 Compositions for production of electronic coatings
04/18/1990EP0363689A2 Semiconductor devices manufacture using selective epitaxial growth and poly-Si deposition in the same apparatus
04/18/1990EP0363679A2 Method of fabricating a semiconductor device
04/18/1990EP0363673A1 Sputter-deposited nickel layer and process for depositing same
04/18/1990EP0363548A1 Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils
04/18/1990EP0363547A1 Method for etching mirror facets of III-V semiconductor structures
04/18/1990EP0363525A1 Method of recognising the two-dimensional position and orientation of already known objects
04/18/1990CN2056280U Layer-press packager for solar module
04/18/1990CN1041468A Method and device for sub-micron processing surface
04/18/1990CN1007681B Semiconductor integrated circuit device and method of producting same
04/18/1990CN1007680B Integrated circuit with smooth interface over polysilicon
04/18/1990CN1007679B Method for manufacturing semiconductor components
04/18/1990CN1007678B Process for preparing semiconductor device
04/18/1990CN1007677B Method for forming electrode of iii-v simi-conducting elements
04/18/1990CA2000888A1 Method of encapsulating an article
04/17/1990US4918655 Magnetic device integrated circuit interconnection system
04/17/1990US4918614 Hierarchical floorplanner
04/17/1990US4918563 ECL gate array semiconductor device with protective elements
04/17/1990US4918514 Press-contact type semiconductor device
04/17/1990US4918513 Socket for an integrated circuit chip carrier and method for packaging an integrated circuit chip
04/17/1990US4918510 Compact CMOS device structure
04/17/1990US4918505 Method of treating an integrated circuit to provide a temperature sensor that is integral therewith
04/17/1990US4918504 Active matrix cell
04/17/1990US4918503 Dynamic random access memory device having a plurality of one transistor type memory cells
04/17/1990US4918501 Semiconductor device and method of producing the same
04/17/1990US4918500 Semiconductor device having trench capacitor and manufacturing method therefor
04/17/1990US4918499 Semiconductor device with improved isolation between trench capacitors
04/17/1990US4918454 Compensated capacitors for switched capacitor input of an analog-to-digital converter
04/17/1990US4918379 Integrated monolithic circuit having a test bus
04/17/1990US4918374 Method and apparatus for inspecting integrated circuit probe cards
04/17/1990US4918334 Bias voltage generator for static CMOS circuits
04/17/1990US4918333 Microprocessor having high current drive
04/17/1990US4918332 TTL output driver gate configuration
04/17/1990US4918318 Electronic optics device with variable illumination and aperture limitation, and application thereof to an electron beam lithographic system
04/17/1990US4918301 Position sensor having double focuses and utilizing a chromatic aberration
04/17/1990US4918033 PECVD (plasma enhanced chemical vapor deposition) method for depositing of tungsten or layers containing tungsten by in situ formation of tungsten fluorides
04/17/1990US4918032 Method for fabricating three-dimensional microstructures and a high-sensitivity integrated vibration sensor using such microstructures
04/17/1990US4918031 Anisotropic plasma etching; low gas pressure
04/17/1990US4918030 Method of forming light-trapping surface for photovoltaic cell and resulting structure
04/17/1990US4918029 Method for liquid-phase thin film epitaxy
04/17/1990US4918028 Capillaries; fixed and labelled reagents
04/17/1990US4918027 Method of fabricating semiconductor device
04/17/1990US4918026 Process for forming vertical bipolar transistors and high voltage CMOS in a single integrated circuit chip
04/17/1990US4917877 Process for producing aluminum nitride powder
04/17/1990US4917759 Method for forming self-aligned vias in multi-level metal integrated circuits
04/17/1990US4917757 Method of performing solution growth of ZnSe crystals
04/17/1990US4917568 Suction pick-up apparatus for electrical or electronic components
04/17/1990US4917556 Modular wafer transport and processing system
04/17/1990US4917467 Active matrix addressing arrangement for liquid crystal display
04/17/1990US4917466 Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
04/17/1990US4917286 Bonding method for bumpless beam lead tape
04/17/1990US4917136 Process gas supply piping system
04/17/1990US4917123 Apparatus for treating wafers with process fluids
04/17/1990US4917122 Photoresist stripping solution
04/17/1990US4917044 Electrical contact apparatus for use with plasma or glow discharge reaction chamber
04/17/1990US4916809 Method for programmable laser connection of two superimposed conductors of the interconnect system of an integrated circuit
04/17/1990US4916805 Curing adhesive in lesser time and lower temperature
04/17/1990CA1267990A1 Diffusion isolation layer for maskless cladding process
04/17/1990CA1267978A1 Semi-conductor processing system
04/17/1990CA1267975A1 Charge-coupled device and method of manufacturing the same
04/17/1990CA1267825A1 Double polysilicon integrated circuit process
04/13/1990CA2000552A1 Resist composition
04/12/1990DE3933194A1 Formation of tungsten contacts to silicon diffused regions - reduces series resistance of contacts and results in planar surface for interconnection pattern
04/12/1990DE3929880A1 Semi-self alignment HV MOSFET - has semiconductor body with source region of opposite conductivity extending towards body surface
04/12/1990DE3834526A1 Process for the production of thin layers of conductive polymers, and the use of the coated substrates
04/12/1990DE3834396A1 Method for removing surface layers
04/12/1990DE3833931A1 Method for producing a doped insulator layer
04/11/1990EP0363297A1 Improved contact stud structure for semiconductor devices
04/11/1990EP0363256A1 Method of making electrical connections through a substrate
04/11/1990EP0363235A1 Process and apparatus for the uniform application of a resist layer to a substrate
04/11/1990EP0363179A2 Programmable die size continuous array
04/11/1990EP0363164A2 X-ray exposure system
04/11/1990EP0363163A2 X-ray exposure apparatus
04/11/1990EP0363134A1 Formation of refractory metal silicide layers
04/11/1990EP0363133A1 Metallization process for an integrated circuit
04/11/1990EP0363100A2 Selective polishing method
04/11/1990EP0363099A1 Fine working method of crystalline material
04/11/1990EP0363065A2 Method for fabricating devices
04/11/1990EP0363055A2 Electron gun and process of producing same
04/11/1990EP0363020A1 Driving circuit
04/11/1990EP0362952A1 Method of manufacturing an epitaxial indium phosphide layer on a substrate surface
04/11/1990EP0362867A2 Method for manufacturing semiconductor devices
04/11/1990EP0362838A2 A method of fabricating semiconductor devices
04/11/1990EP0362811A2 Polishing apparatus
04/11/1990EP0362779A1 Method of forming an isolation region in a semiconductor substrate.
04/11/1990EP0362571A2 Method for forming semiconductor components
04/11/1990EP0362547A1 Power device with self-centering electrode
04/11/1990EP0362511A1 Method for making a contact on a semiconductor device and said device
04/11/1990EP0362418A1 Improved method and system for the angled exposition of a surface portion to an emission impinging obliquely thereon, and semiconductor wafers having facets exposed according to said method