Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1990
03/13/1990US4908178 Heating metal mold, injecting plastic into heated mold, melting plastic, hardening
03/13/1990US4908096 Photodefinable interlevel dielectrics
03/13/1990US4908095 Supporting object on first electrode, pushing object into holding member between first and second electrodes, generating plasma while supplying reaction gases into gap between electrodes, etching object
03/13/1990US4908086 Low-cost semiconductor device package process
03/13/1990US4908074 Gallium arsenide on sapphire heterostructure
03/13/1990US4908065 Coating solution for use in the formation of metal oxide film
03/13/1990US4907974 Method of growing a semiconductor device structure
03/13/1990US4907931 Apparatus for handling semiconductor wafers
03/13/1990US4907790 Pellet-lifting apparatus
03/13/1990US4907734 Method of bonding gold or gold alloy wire to lead tin solder
03/13/1990US4907701 Apparatus for inspecting the appearance of semiconductor devices
03/13/1990US4907612 Universal material handling apparatus
03/13/1990US4907526 Installation for charging and discharging substrates out of a vacuum tank
03/13/1990US4907349 Spin drier for semiconductor materials
03/13/1990CA1266724A1 Method of fabricating a tapered via hole in polyimide
03/08/1990WO1990002449A1 In-chip intermediate driver for discrete wsi systems
03/08/1990WO1990002417A1 Charge-coupled device
03/08/1990WO1990002416A1 METHOD FOR NEUTRALIZING ACCEPTORS ATOMS IN InP OF p TYPE
03/08/1990WO1990002217A1 Elemental mercury source for metal-organic chemical vapor deposition
03/08/1990WO1990002214A1 Process and device for vapour deposition of a coating on a substrate in vacuo
03/08/1990DE3829159A1 Device for holding semiconductor wafers
03/08/1990DE3828812A1 Three-dimensional integrated circuit and method for the production thereof
03/07/1990EP0357532A2 Improvements in performance sensing for integrated circuit chips
03/07/1990EP0357528A1 MOS transistor and its use in a free running diode
03/07/1990EP0357458A2 Luminescent device
03/07/1990EP0357426A2 Light quantity controlling apparatus
03/07/1990EP0357424A2 A wafer supporting apparatus
03/07/1990EP0357346A2 CMOS integrated circuit having improved isolation
03/07/1990EP0357333A2 Sealed charge storage structure
03/07/1990EP0357221A1 Process for producing contacts in integrated circuits having shallow junctions
03/07/1990EP0357205A1 Polishing liquid for polishing semiconductor substrate and polishing process
03/07/1990EP0357202A1 Method of forming isolation region in integrated circuit structure
03/07/1990EP0357124A2 Method of selectively providing a metal from the liquid phase on a substrate by means of a laser
03/07/1990EP0357116A1 Method of manufacturing a semiconductor device
03/07/1990EP0357095A1 Method of manufacturing an optoelectronic device
03/07/1990EP0357064A2 Metal bump type semiconductor device and method for manufacturing the same
03/07/1990EP0356968A2 Three-dimensional memory element and memory device
03/07/1990EP0356684A2 Electrostatic dust collector for use in vacuum system
03/07/1990EP0356650A2 Driving circuitry for EEPROM memory cell
03/07/1990EP0356557A1 Thin dielectric layer on a substrate and method for forming such a layer
03/07/1990EP0356465A1 Encapsulation barrier for thick-film hybrid circuits
03/07/1990EP0229050B1 Chemical refill system
03/07/1990EP0208851B1 Fabricating a semiconductor device by means of molecular beam epitaxy
03/07/1990EP0197078B1 Method for making monocrystalline silicon islands electrically isolated from each other
03/06/1990US4907198 Semiconductor memory device
03/06/1990US4907197 Non-volatile semiconductor memory device
03/06/1990US4907184 Arithmetic operation circuit
03/06/1990US4907180 Hardware switch level simulator for MOS circuits
03/06/1990US4907129 Lead frame and electronic divice
03/06/1990US4907128 Chip to multilevel circuit board bonding
03/06/1990US4907066 Planar tungsten interconnect with implanted silicon
03/06/1990US4907065 Integrated circuit chip sealing assembly
03/06/1990US4907064 Semiconductor device having silicon oxynitride film with improved moisture resistance
03/06/1990US4907063 Semiconductor body, and device formed therefrom, having grooves with silicon nitride on the groove surfaces
03/06/1990US4907062 Semiconductor wafer-scale integrated device composed of interconnected multiple chips each having an integration circuit chip formed thereon
03/06/1990US4907061 Electronic device
03/06/1990US4907059 Semiconductor bipolar-CMOS inverter
03/06/1990US4907058 Complementary semiconductor device having a double well
03/06/1990US4907057 Semiconductor device
03/06/1990US4907053 Semiconductor integrated circuit
03/06/1990US4907049 Charge-coupled semiconductor device having an improved electrode structure
03/06/1990US4907048 Double implanted LDD transistor self-aligned with gate
03/06/1990US4907047 Semiconductor memory device
03/06/1990US4907046 Semiconductor device with multilayer silicon oxide silicon nitride dielectric
03/06/1990US4907041 Intra-gate offset high voltage thin film transistor with misalignment immunity
03/06/1990US4907039 Semiconductor device
03/06/1990US4907038 Langmuir Blodgett ultrathin membrane of polyfumarate
03/06/1990US4907021 Projection exposure apparatus
03/06/1990US4906956 On-chip tuning for integrated circuit using heat responsive element
03/06/1990US4906921 Structure and process for testing integrated circuits permitting determination of the properties of layers
03/06/1990US4906920 Self-leveling membrane probe
03/06/1990US4906914 Intermediate potential generation circuit for generating a potential intermediate between a power source potential and ground potential
03/06/1990US4906872 Integrated circuit device
03/06/1990US4906869 Output circuit having wide range frequency response characteristic
03/06/1990US4906863 Wide range power supply BiCMOS band-gap reference voltage circuit
03/06/1990US4906852 Projection alignment method and apparatus
03/06/1990US4906823 Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same
03/06/1990US4906596 Die attach adhesive composition
03/06/1990US4906595 Method of manufacturing a semiconductor device, in which a silicon wafer is provided at its surface with field oxide regions
03/06/1990US4906594 Surface smoothing method and method of forming SOI substrate using the surface smoothing method
03/06/1990US4906593 Method of producing a contact plug
03/06/1990US4906592 Method for forming a multilayered metal network for bonding components of a high-density integrated circuit using a spin on glass layer
03/06/1990US4906591 Method of manufacturing a semiconductor device having an electric contact portion
03/06/1990US4906590 Method of forming a trench capacitor on a semiconductor substrate
03/06/1990US4906589 Inverse-T LDDFET with self-aligned silicide
03/06/1990US4906588 Enclosed buried channel transistor
03/06/1990US4906585 Method for manufacturing wells for CMOS transistor circuits separated by insulating trenches
03/06/1990US4906583 Making a semiconductor photodetector
03/06/1990US4906550 Method of producing polydiacetylene thin film
03/06/1990US4906549 Positive-working photoresist composition with quinone diazide sulfonic acid ester and novolac made from m-cresol, p-cresol and aliphatic phenol with 2-6 carbon atoms
03/06/1990US4906511 Aluminum nitride circuit board
03/06/1990US4906491 Semiconductor device manufacturing methods
03/06/1990US4906347 Dry-etching apparatus
03/06/1990US4906346 Electroplating apparatus for producing humps on chip components
03/06/1990US4906341 Method of manufacturing semiconductor device and apparatus therefor
03/06/1990US4906325 Method of making single-crystal mercury cadmium telluride layers
03/06/1990US4906314 Process for simultaneously applying precut swatches of precured polyimide film to each semiconductor die on a wafer
03/06/1990US4906194 High density connector for an IC chip carrier
03/06/1990US4906080 for use in a semiconductor device
03/01/1990DE3928765A1 Chemische dampfabscheidung unter verwendung von disilan Chemical vapor deposition using disilane
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