Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/04/2005DE10361715A1 Production of transition region between a trench (3) and a semiconductor useful in semiconductor and transistor technology
08/04/2005DE10361697A1 Preparation of trench structures with oxidation layers including cladding of trench inner region formed in semiconductor region, deposition of a further layer and oxidation
08/04/2005DE10361696A1 Integrated semiconductor circuit has at least two modules or chips in a common housing that are galvanically separated by an integrated microprocessed structure
08/04/2005DE10361635A1 Technik zur Herstellung eines Abstandselements für ein Leitungselement durch Anwenden einer Ätzstoppschicht, die durch eine stark richtungsgebundene Abscheidetechnik aufgebracht wird Technique for producing a spacer for a line element by applying an etch stop layer is applied by a highly directional deposition
08/04/2005DE10254663B4 Transistor mit niederohmigem Basisanschluß und Verfahren zum Herstellen With low-impedance transistor base terminal and method for producing
08/04/2005DE10240085B4 Verfahren zum Strukturieren einer Maskenschicht A method of patterning a mask layer
08/04/2005DE10210272B4 Verfahren zur Herstellung eines Halbleiterbauelements mit wenigstens einer Transistorzelle und einer Randzelle A process for producing a semiconductor device having at least one transistor cell and a peripheral cell
08/04/2005DE102005001916A1 Aufdruckprägesystem Print embossing system
08/04/2005DE102005001904A1 Halbleiterspeicher, Halbleiterbauteil und Verfahren zu deren Herstellung A semiconductor memory, semiconductor device and process for their preparation
08/04/2005DE102005001856A1 Packungsleiterplatte, Herstellungs- und Spannungsbereitstellungsverfahren Pack PCB, manufacturing and voltage provisioning procedures
08/04/2005DE102005001164A1 Werkstückhandhabungs- und Ausrichtungsvorrichtung Werkstückhandhabungs- and alignment device
08/04/2005DE102005001134A1 Knotenpunkt-Kontaktstrukturen in Halbleitervorrichtungen und Verfahren zur Herstellung derselben Node contact structures in semiconductor devices and methods of manufacturing the same
08/04/2005DE102005000997A1 Integrierte Halbleiterschaltungen mit gestapelten Knotenkontaktstrukturen und Verfahren zum Herstellen solcher Vorrichtungen Integrated semiconductor circuits stacked with node contact structures and methods for making such devices
08/04/2005DE102005000800A1 Optische Halbleitereinrichtung und Verfahren zum Herstellen einer optischen Halbleitereinrichtung An optical semiconductor device and method for producing an optical semiconductor device
08/04/2005DE102004063589A1 Semiconductor device comprises semiconductor substrate, gate on semiconductor substrate, epitaxial layer on semiconductor substrate, spacer on sidewall of gate, source/drain regions, and low doping concentration region
08/04/2005DE102004063583A1 Non-volatile memory device e.g. ROM, has gate oxide layer positioned on semiconductor substrate and block oxide layers disposed in bottom of lateral faces of polysilicon gate, and word lines vertically placed on substrate
08/04/2005DE102004063529A1 Transflektiv-Flüssigkristallanzeigevorrichtung und Herstellungsverfahren derselben Transflective liquid crystal display device and production method thereof
08/04/2005DE102004063148A1 Isolierverfahren bei Halbleiter-Bauelementen Isolation for semiconductor devices
08/04/2005DE102004063144A1 Semiconductor device e.g. transistor has substrate with lightly doped regions, heavily doped regions and diffusion source/drain areas surrounding lightly doped regions
08/04/2005DE102004063143A1 Dummy-Schicht bei einem Halbleiter-Bauelement und Herstellungsverfahren dafür Dummy layer in a semiconductor device and manufacturing method thereof
08/04/2005DE102004063142A1 Verfahren für die Herstellung von Halbleiter-Bauelementen A process for the production of semiconductor devices
08/04/2005DE102004063140A1 Fotomaske und Verfahren für die Herstellung derselben Photo mask and method for manufacturing the same
08/04/2005DE102004062926A1 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production
08/04/2005DE102004062835A1 Fabrication of dual damascene pattern involves forming via hole and trench up to respective predetermined depth, extending the via hole, and etching protective film exposed through the via hole to expose lower conductive pattern
08/04/2005DE102004062392A1 Verfahren zum Bilden einer Metallverdrahtung einer Halbleitervorrichtung A method of forming a metal wiring of a semiconductor device
08/04/2005DE102004062224A1 Halbleitervorrichtung und Halbleitervorrichtungsmodul Semiconductor device and semiconductor device module
08/04/2005DE102004062214A1 Halbleitervorrichtung mit Temperaturerfassungsfunktion A semiconductor device comprising temperature detection function
08/04/2005DE102004062202A1 Verfahren zum Herstellen einer Schichtenfolge und Verfahren zum Herstellen eines integrierten Schaltkreises A method of manufacturing a layer sequence and methods for producing an integrated circuit
08/04/2005DE102004061596A1 Lasermaske und Kristallationsverfahren unter Verwendung derselben Laser mask and Kristallationsverfahren using the same
08/04/2005DE102004061533A1 Verfahren und Vorrichtung zur Sondennavigation sowie Defektprüfvorrichtung Method and apparatus for navigation and defect inspection probe
08/04/2005DE102004059778A1 Refractive projection objective for production of semiconductor elements by immersion microlithography, comprises five lens groups and a system screen, forming a single-waist system of light beam diameters
08/04/2005DE102004059409A1 Magnetische Speichervorrichtung Magnetic storage device
08/04/2005DE102004056022A1 Verfahren zur Bildung eines Nickelsalicids und Verfahren zur Herstellung eines Halbleiterbauelements unter Verwendung desselben Of the same method for forming a Nickelsalicids and method for producing a semiconductor device using
08/04/2005DE102004055463A1 Elektronische Vorrichtung einschließlich Elektroden mit darauf befindlichen Isolier-Spacern und verwandte Verfahren Electronic device including electrodes thereon insulating spacers and allied processes
08/04/2005DE102004048690A1 Antischmelzsicherungs-Programmierschaltung mit einer Transistorstufe, die während der Programmierung in einer Reihe mit der Antischmelzsicherung zwischen die Stromzuführungen eingesetzt ist Antifuse programming circuit with a transistor stage which is used during programming in a series with the anti-fuse between the supply leads
08/04/2005DE102004047002A1 Vertikale DMOS- Transistor- Vorrichtung, integrierter Schaltkreis und Verfahren zur Herstellung dieser Vertical DMOS transistor device, integrated circuit and methods for producing these
08/04/2005DE102004046418A1 Überspannungs-Schutzschaltung für einen MOS-Ausgangstransistor Over-voltage protection circuit for a MOS transistor output
08/04/2005DE102004031518A1 Verfahren zum Bilden einer Metallverdrahtung in Halbleiterbauelementen A method of forming a metal wiring in semiconductor devices
08/04/2005DE102004030174A1 Verfahren zur Herstellung magnetischer Direktzugriffsspeicher A process for the production of magnetic random access memory
08/04/2005DE102004001713A1 Production process for an eprom memory cell with memory capacitor and transistor forms common polysilicon capacitor cover and gate electrodes and uses sink diffusion
08/04/2005DE102004001411A1 Process to determine defects in a regular structure on a carrier as in microelectronic semiconductor components forms a difference signal between differently polarized radiations
08/04/2005DE102004001340A1 Verfahren zum Herstellen eines Nanoelement-Feldeffektransistors, Nanoelement-Feldeffekttransistor und Nanoelement-Anordnung A method for producing a nano-element field effect transistor, nano-element field effect transistor and nano-element arrangement
08/04/2005DE102004001239A1 Production process for a self adjusting epitaxial emitter for a bipolar transistor forms emitter layer over base then covers with doped polysilicon and anneals
08/04/2005DE102004001108A1 Product production process for chips and actuators places foil and component on a substrate with a gap between them that is closed by foil wrinkling
08/04/2005DE10153813B4 Poliervorrichtung zum Polieren von äußeren Umfangsabschnitten eines plattenförmigen Werkstücks A polishing apparatus for polishing the outer peripheral portions of a plate-shaped workpiece
08/04/2005DE10153200B4 Verfahren zum BPSG-Glasverfüllen von Öffnungen in Gate-Elektrodenschichten A method of BPSG glass filling of holes in gate electrode layers
08/04/2005DE10100695B4 Halbleitervorrichtung Semiconductor device
08/04/2005DE10000624B4 Verfahren zur Herstellung von MOS-Transistoren A process for producing MOS-transistors
08/03/2005EP1560280A1 Thin film multilayer body, electronic device using such thin film multilayer body, actuator, and method for manufacturing actuator
08/03/2005EP1560271A2 Optical device
08/03/2005EP1560269A1 MOS capacitor in an integrated semiconductor circuit
08/03/2005EP1560268A2 Nanometer-scale memory device with self-aligned rectifying elements and manufacture thereof using nano-imprint lithography
08/03/2005EP1560265A2 Semiconductor device and method for manufacturing the same
08/03/2005EP1560264A1 Interconnection structure and method of forming same
08/03/2005EP1560263A2 Method for forming macropores in a layer and products obtained thereof
08/03/2005EP1560262A1 Plasma etching chamber and plasma etching system using same
08/03/2005EP1560261A1 Method for processing nitride semiconductor crystal surface and nitride semiconductor crystal obtained by such method
08/03/2005EP1560260A1 T-gate formation
08/03/2005EP1560259A2 Nitride semiconductor thin film and method for growing the same
08/03/2005EP1560252A2 Deposition apparatus
08/03/2005EP1560231A2 Magnetic resistance device
08/03/2005EP1560223A2 A current threshold detector
08/03/2005EP1560220A1 Low consumption integrated memory circuit
08/03/2005EP1560134A2 Circuit board with emulation circuit and network interface
08/03/2005EP1560073A2 Method of predicting and minimizing model opc deviation due to mix/match of exposure tools using a calibrated eigen decomposition model
08/03/2005EP1560072A2 Computer aided modeling, reliability checking and verification of a lithography process using a calibrated eigen decomposition model
08/03/2005EP1560071A1 Electron beam exposure method and electron beam exposure system
08/03/2005EP1560070A1 Composition for forming antireflection film for lithography
08/03/2005EP1560069A1 Photosensitive composition for interlayer dielectric and method of forming patterned interlayer dielectric
08/03/2005EP1559801A1 Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part
08/03/2005EP1559762A2 Chemical mechanical polishing slurry useful for copper substrates
08/03/2005EP1559761A1 Porous-film-forming composition, preparation method of the composition, porous film and semiconductor device
08/03/2005EP1559738A1 Polyimide film and process for producing the same
08/03/2005EP1559187A1 Dc/dc converter using bipolar transistor, method of manufacturing the same and dc power supply module using the same
08/03/2005EP1559144A2 Semiconductor component and method of manufacture
08/03/2005EP1559142A1 Thin film transistors and methods of manufacture thereof
08/03/2005EP1559141A1 One transistor dram cell structure and method for forming
08/03/2005EP1559139A2 Method of detaching a thin film at moderate temperature after co-implantation
08/03/2005EP1559138A1 Method for forming a brittle zone in a substrate by co-implantation
08/03/2005EP1559137A1 Planarizing gate material to improve gate critical dimension in semiconductor devices
08/03/2005EP1559136A2 A method of rapidly thermally annealing multilayer wafers with an edge
08/03/2005EP1559135A1 Heater module of rapid thermal processing apparatus
08/03/2005EP1559133A1 Forced convection assisted rapid thermal furnace
08/03/2005EP1559132A2 Removal of particle contamination on patterned slilicon/silicon dioxide using supercritical carbon dioxide/chemical formulations
08/03/2005EP1559131A2 Semiconductor arrangement
08/03/2005EP1559130A2 Polymer microneedles
08/03/2005EP1559108A2 Using isolated p-well transistor arrangements to avoid leakage caused by word line/bit line shorts
08/03/2005EP1558977A2 Probability constrained optimization for electrical fabrication control
08/03/2005EP1558784A2 Two-layer film for next generation damascene barrier application with good oxidation resistance
08/03/2005EP1558783A2 Two-step atomic layer deposition of copper layers
08/03/2005EP1558698A1 Fluorinated surfactants for aqueous acid etch solutions
08/03/2005EP1558697A1 Fluorinated surfactants for buffered acid etch solutions
08/03/2005EP1558688A1 Composition for polishing metal, polishing method for metal layer, and production method for wafer
08/03/2005EP1558678A1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition
08/03/2005EP1558569A1 Multimetallic oxide composition
08/03/2005EP1558426A1 Polishing apparatus
08/03/2005EP1558425A2 Device and method for connecting objects
08/03/2005EP1488427B1 A volumetric data storage apparatus comprising a plurality of stacked matrix-addressable memory devices
08/03/2005EP1470583A4 Chip and wafer integration process using vertical connections
08/03/2005EP1397806B1 Identification of an integrated circuit from its physical manufacture parameters
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