Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/11/2010CN101419924B Manufacturing method for semiconductor device
08/11/2010CN101414635B Groove insulated gate type gate-leakage composite field plate power device and preparation method thereof
08/11/2010CN101414628B Groove Gamma gate transistor with high electron mobility and preparing method thereof
08/11/2010CN101414623B Groove gate type source-leakage composite field plate heterojunction field effect transistor and preparation method thereof
08/11/2010CN101409293B Poly-SiGe gate three-dimensional strain CMOS integrated component and preparation method thereof
08/11/2010CN101409285B Semiconductor device and a method of manufacturing the same
08/11/2010CN101408694B Method for preparing pixel structure of semi-penetrating inverse LCD device
08/11/2010CN101405867B Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
08/11/2010CN101399204B Grid structure, flash memory and method for producing the same
08/11/2010CN101399163B Method for calibrating epitaxial reaction chamber temperature
08/11/2010CN101398580B LCD device and method for manufacturing same
08/11/2010CN101393887B Dual damascene structure forming method
08/11/2010CN101393840B Prime coating method and coating method of photoresist
08/11/2010CN101388342B Method for preparing inorganic thin-film transistor by complete solution treatment process
08/11/2010CN101388327B Substrate processing device and processing method thereof
08/11/2010CN101383283B Manufacturing method for low voltage diode with large capacitance variant ratio
08/11/2010CN101371337B Trench schottky barrier diode with differential oxide thickness
08/11/2010CN101369568B Packaging structure, packaging method and photosensitive device
08/11/2010CN101369519B Substrate processing apparatus and method
08/11/2010CN101364538B Gate layer forming method
08/11/2010CN101362241B Solder reflow sample position limiter
08/11/2010CN101359615B Semiconductor isolation structure and manufacturing method of semiconductor device
08/11/2010CN101359588B Substrate processing apparatus, load-lock chamber unit, and method of carrying out a transfer device
08/11/2010CN101355029B Method for forming grids of semiconductor device
08/11/2010CN101350306B Method for reducing threshold voltage standard variance
08/11/2010CN101345255B Power semiconductor device and manufacturing method therefor
08/11/2010CN101335190B Methods of patterning self-assembly nano-structure and forming porous dielectric
08/11/2010CN101335184B Method for forming fine pattern in semiconductor device
08/11/2010CN101334853B Electronic label encapsulation method
08/11/2010CN101331595B Microetching composition and method of using the same
08/11/2010CN101330051B Method for obtaining LCOS device using argentum and generated structure thereof
08/11/2010CN101330049B Self-aligning shallow groove isolation structure, memory unit and method for forming the same
08/11/2010CN101330045B Manufacturing method of semiconductor device
08/11/2010CN101330013B Method for preparing tunneling oxide layer and flash memory
08/11/2010CN101325845B Multilayer printed circuit board and method of fabricating the same
08/11/2010CN101320752B Lateral diffusion metal-oxide-semiconductor element with low opening resistor and manufacturing method thereof
08/11/2010CN101315919B Chip packaging structure and technique
08/11/2010CN101312143B Carrying bench and plasma treating device using the same
08/11/2010CN101312114B Method for preventing silicon chip back face contaminating front in immersion type wet method process
08/11/2010CN101311302B Chemical vapour deposition equipment and furnace tube
08/11/2010CN101303991B Control sheet for testing grid medium layer and method for forming the same
08/11/2010CN101303987B Method for manufacturing semiconductor device
08/11/2010CN101303985B Stack type chip packaging structure production method
08/11/2010CN101300672B Vibration isolation mechanism for article receiving container
08/11/2010CN101295622B Device and method for cleaning wafer
08/11/2010CN101293294B Sealing-in method for packaging outer shell with aluminum silicon carbide
08/11/2010CN101290869B Plasma treatment apparatus
08/11/2010CN101286524B Display, method for driving display, and electronic apparatus
08/11/2010CN101286473B Fabricating method for semiconductor device
08/11/2010CN101281878B Control device for driving crystal-fetching arm of crystal-storing machine
08/11/2010CN101276777B Substrate mounting stage and substrate processing apparatus
08/11/2010CN101276103B Liquid crystal device, method of manufacturing liquid crystal device, and electronic apparatus
08/11/2010CN101252101B Method for making ultra-high power intelligent device using exposal field split joint technology
08/11/2010CN101252096B Chip package structure and preparation method thereof
08/11/2010CN101246856B Production method of SONOS flash memory
08/11/2010CN101246305B Graphic method
08/11/2010CN101243202B Aluminum sputtering while biasing wafer
08/11/2010CN101241846B Techniques for improving etch rate uniformity
08/11/2010CN101236313B Display device and making method thereof
08/11/2010CN101221939B Package structure for optoelectronic device and fabrication method thereof
08/11/2010CN101207064B Method for forming device isolation region
08/11/2010CN101207056B Method for measuring loading effect and percentage of coverage for thin membrane stairway
08/11/2010CN101207026B Method for forming semiconductor device grids
08/11/2010CN101206179B Light emission microscope sample
08/11/2010CN101197296B Convex point reflow process without soldering flux
08/11/2010CN101190556B Waste glue stripping device
08/11/2010CN101189712B Method and apparatus for inspecting marking of semiconductor package
08/11/2010CN101174545B Apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
08/11/2010CN101170074B A method for improving ultra-deep sub-micro MOSFET radiation-resisting performance
08/11/2010CN101169591B Lens imaging system for overlay accuracy and its feeding and calibration method
08/11/2010CN101131921B Wafer processing method
08/11/2010CN101127345B Semiconductor device and manufacturing method thereof
08/11/2010CN101123260B Display device and display device manufacturing method
08/11/2010CN101105504B Probe card device
08/11/2010CN101095211B Strained dislocation-free channels for cmos and method of manufacture
08/11/2010CN101073880B Grinding pad and its production
08/11/2010CN101063625B BGA packaging retainer apparatus and method for testing BGA packaging
08/11/2010CN101034261B Method and device for preventing barrier processing from polluting optical element
08/11/2010CN101031994B Vacuum holder for integrated circuit units
08/11/2010CN101026157B Semiconductor device and its making method
08/11/2010CN101017329B Substrate treatment system, substrate treatment method
08/11/2010CN101000864B Wafer dividing method and wafer dividing apparatus
08/10/2010USRE41478 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
08/10/2010USRE41477 Semiconductor device with a reduced mask count buried layer
08/10/2010US7774738 Lithography method for forming a circuit pattern
08/10/2010US7774737 Performance in model-based OPC engine utilizing efficient polygon pinning method
08/10/2010US7774736 Method and apparatus for providing optical proximity features to a reticle pattern for deep sub-wavelength optical lithography
08/10/2010US7774186 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
08/10/2010US7774086 Substrate thickness measuring during polishing
08/10/2010US7774081 Manufacturing system, manufacturing method, managing apparatus, managing method and computer readable medium
08/10/2010US7773849 Device and method for optical resizing and backlighting
08/10/2010US7773491 Method and apparatus for high-speed optical disc recording using multi chip module
08/10/2010US7773430 Method of identifying logical information in a programming and erasing cell by on-side reading scheme
08/10/2010US7773365 Dielectric material
08/10/2010US7773363 Electroadhesion
08/10/2010US7773209 Method and apparatus for parts manipulation, inspection, and replacement
08/10/2010US7773199 Methods and systems to compensate for a stitching disturbance of a printed pattern
08/10/2010US7772917 Semiconductor device
08/10/2010US7772709 Resin sealed semiconductor device and manufacturing method therefor
08/10/2010US7772708 Stacking integrated circuit dies
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