Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2010
08/12/2010US20100200906 Nonvolatile semiconductor memory device and method for manufacturing same
08/12/2010US20100200905 Nand memory cells and manufacturing method thereof
08/12/2010US20100200904 Gate fringing effect based channel formation for semiconductor device
08/12/2010US20100200901 Semiconductor memory device having cylinder-type capacitor lower electrode and associated methods
08/12/2010US20100200900 Magnetoresistive element and method of manufacturing the same
08/12/2010US20100200899 Spin transistor and method of manufacturing the same
08/12/2010US20100200897 Transistor and method of manufacturing the same
08/12/2010US20100200896 Embedded stress elements on surface thin direct silicon bond substrates
08/12/2010US20100200889 Method for forming a light-emitting case and related light-emitting module
08/12/2010US20100200880 Semiconductor wafers and semiconductor devices and methods of making semiconductor wafers and devices
08/12/2010US20100200869 Method of manufacturing display device and display device
08/12/2010US20100200865 Group iii nitride semiconductor substrate and method for cleaning the same
08/12/2010US20100200863 Electrode structure, semiconductor device, and methods for manufacturing those
08/12/2010US20100200861 Organic light emitting diode display and method of manufacturing the same
08/12/2010US20100200860 Thin Film Transistor Array Panel and Manufacturing Method Thereof
08/12/2010US20100200859 Thin film transistor array panel for x-ray detector
08/12/2010US20100200856 Method for manufacturing e-jpaper array substrate and e-paper array substrate
08/12/2010US20100200855 Semiconductor device and manufacturing method thereof
08/12/2010US20100200854 Method for reclaiming a surface of a substrate
08/12/2010US20100200853 Semiconductor device and manufacturing method thereof
08/12/2010US20100200852 Nonvolatile memory element, nonvolatile memory apparatus, and method of manufacture thereof
08/12/2010US20100200851 Semiconductor device and method of manufacturing the semiconductor device
08/12/2010US20100200850 Method of Producing a Partly or Completely Semi-Insulating or P-Type Doped ZnO Substrate, Substrates Obtained, and Electronic, Electro-Optic or Optoelectronic Devices Comprising Them
08/12/2010US20100200849 Thin film transistor array panel and manufacturing method thereof
08/12/2010US20100200840 Graphene-based transistor
08/12/2010US20100200837 Dual sided processing and devices based on freestanding nitride and zinc oxide films
08/12/2010US20100200836 Nanoparticle positioning technique
08/12/2010US20100200835 Fabrication of germanium nanowire transistors
08/12/2010US20100200830 Memory device having self-aligned cell structure
08/12/2010US20100200813 Semiconductor nanocrystals
08/12/2010US20100200772 Radiation system with contamination barrier
08/12/2010US20100200547 Liquid processing apparatus and liquid processing method
08/12/2010US20100200412 Process For Through Silicon Via Filling
08/12/2010US20100200064 Dye-sensitizing solar cell and fabricating method thereof
08/12/2010US20100200042 Photovoltaic device and method for manufacturing photovoltaic device
08/12/2010US20100199450 Flexible Formed Sheets for Treating Surfaces
08/12/2010DE202010004773U1 Dichtungselement mit Postionierungsmerkmal für eine festgeklemmte monolithische Gasverteilungselektrode Sealing element with Postionierungsmerkmal for a clamped monolithic gas distribution electrode
08/12/2010DE112007003640T5 Vorrichtung zum Erzeugen eines Gases für eine dielektrische Barrierenentladung Means for generating a gas for a dielectric barrier discharge
08/12/2010DE112007003638T5 Prozess zum Herstellen einer siliziumhaltigen Beschichtung, siliziumhaltige Beschichtung und Halbleitervorrichtung Process for producing a silicon-containing coating, silicon-containing coating, and semiconductor device
08/12/2010DE112004001023B4 Verfahren zum Herstellen einer magnetischen Speicherzelle und magnetisches Speicherbauelement A method of manufacturing a magnetic memory cell, and magnetic memory device
08/12/2010DE10252049B4 Chemisch-mechanische Polier-Aufschlämmung und chemisch-mechanisches Polierverfahren unter Verwendung derselben The chemical mechanical polishing slurry and chemical mechanical polishing method using the same
08/12/2010DE10236896B4 Vorrichtung und Verfahren zum thermischen Behandeln von Halbleiterwafern Device and method for the thermal treatment of semiconductor wafers
08/12/2010DE102010000839A1 Halbleitervorrichtung; Semiconductor device; Verfahren zur Herstellung hiervon und Mehrschichtsubstrat hiermit Method for the preparation thereof and multilayer substrate hereby
08/12/2010DE102010000336A1 Non-volatile memory device i.e. vertical NAND-memory device, has directly adjacent, displaced vertical NAND-channels electrically coupled to lower and upper selection gate lines and displaced with each other in bit line direction
08/12/2010DE102009010891A1 Method for producing MOSFET contacts on surface of silicon carbide semiconductor material of e.g. semiconductor element, involves heating metal layer to specific temperature, and removing metal layer from region of insulation layer
08/12/2010DE102009008371A1 Integraler Prozeß von Waferherstellung bis Modulfertigung zur Herstellung von Wafern, Solarzellen und Solarmodulen Integral process of wafer production to module production for the production of wafers, cells and modules
08/12/2010DE102009008223A1 Verfahren zur Strukturierung einer Halbleiteroberfläche und Halbleiterchip A method of structuring a semiconductor surface and the semiconductor chip
08/12/2010DE102009007800A1 Aerosol-Drucker, dessen Verwendung und Verfahren zur Herstellung von Linienunterbrechungen bei kontinuierlichen Aerosol-Druckverfahren Aerosol printer, its use and process for preparing aerosol line interruptions in continuous printing method
08/12/2010DE102009007136A1 Ätzmischung zur Herstellung einer strukturierten Oberfläche auf Siliziumsubstraten Etching mixture for producing a textured surface on silicon substrates
08/12/2010DE102009006885A1 Abgestufte Wannenimplantation für asymmetrische Transistoren mit kleinen Gateelektrodenabständen Graduated well implantation for asymmetric transistors with small gate electrode spacings
08/12/2010DE102009006884A1 In-situ erzeugte Drain- und Source-Gebiete mit einer verformungsinduzierenden Legierung und einem graduell variierenden Dotierstoffprofil In-situ generated drain and source regions with a strain-alloy and a gradually varying dopant
08/12/2010DE102009006881A1 Hohlraumversiegelung in einem dielektrischen Material einer Kontaktebene eines Halbleiterbauelements, das dicht liegende Transistoren aufweist Cavity sealing comprises a dielectric material of a contact plane of a semiconductor device, the closely placed transistors
08/12/2010DE102009006871A1 Component carrier for use with positioning aid for supporting placement of component of system in target area on surface of component carrier, has pole shoe which is arranged in or on component carrier at distance from surface
08/12/2010DE102009006801A1 Kurzkanaltransistor mit geringerer Längenfluktuation durch Verwenden eines amorphen Elektrodenmaterials während der Implantation Short channel transistor with a shorter length fluctuation by using an amorphous electrode material during implantation
08/12/2010DE102009006800A1 Vergrößerte Tiefe von Drain- und Sourcegebieten in komplementären Transistoren durch Herstellen eines tiefen Drain- und Sourcegebiets vor der Ätzung einer Aussparung Increased depth of drain and source regions in complementary transistors by making a deep drain and source region prior to etching a recess
08/12/2010DE102009006798A1 Verfahren zur Herstellung eines Metallisierungssystems eines Halbleiterbauelements unter Anwendung einer Hartmaske zum Definieren der Größe der Kontaktdurchführung A process for producing a metallization of a semiconductor device using a hard mask to define the size of the via
08/12/2010DE102009005458A1 Halbleiterbauelement mit Durchkontaktierung und Verfahren zu dessen Herstellung A semiconductor device having through-hole plating and process for its preparation
08/12/2010DE102009000491A1 Sintered ceramic substrate used in data transmission systems, particularly microwave circuits, has metallic-hermetic through holes, where holes are filled with mesh made of one or multiple electrically conductive materials
08/12/2010DE102008060077B4 Verfahren zur Herstellung einer integrierten Schaltung A method of fabricating an integrated circuit
08/12/2010DE102008044985B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einem kohlenstoffenthaltenden leitenden Material für Durchgangskontakte A process for producing a semiconductor device with a carbon-containing conductive material for vias
08/12/2010DE102008010321B4 Herstellungsverfahren für eine Vorrichtung mit Superjunctionhalbleiterelement, Vorrichtung und integrierte Schaltung mit Superjunctionhalbleiterelement Manufacturing method for a device with Super Junction semiconductor element, device and integrated circuit with Super Junction semiconductor element
08/12/2010DE102006045866B4 Halte- und Drehvorrichtung für berührungsempfindliche ebene Objekte Holding and rotating device for touch-sensitive flat objects
08/12/2010DE102004052577B4 Verfahren zur Herstellung einer dielektrischen Ätzstoppschicht über einer Struktur, die Leitungen mit kleinem Abstand enthält Includes method for producing a dielectric etch stop layer on a structure, the wires at a small distance
08/12/2010DE102004030806B4 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
08/12/2010DE10017233B4 Verfahren zum Deponieren einer Schicht und zur Herstellung eines akustischen Wellengerätes A method for depositing a layer, and for producing an acoustic wave device
08/12/2010CA2751709A1 Plasma source and method for removing materials from substrates utilizing pressure waves
08/12/2010CA2692067A1 Organoamine stabilized silver nanoparticles and process for producing same
08/11/2010EP2216824A2 Compound thin-film solar cell and process for producing the same
08/11/2010EP2216823A1 Method for electrochmical depositing metal electrode of solar cell
08/11/2010EP2216819A2 Solid-state image pick-up device and manufacturing method thereof, image-pickup apparatus, semiconductor device and manufacturing method thereof, and semiconductor substrate
08/11/2010EP2216816A2 Display device
08/11/2010EP2216811A2 Radiation hardened SRAM cells with floating bodies
08/11/2010EP2216810A2 A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate
08/11/2010EP2216809A1 A method of characterizing an ionic implantation process
08/11/2010EP2216808A2 Method of making a heat sink
08/11/2010EP2216807A2 Heat-dissipation apparatus
08/11/2010EP2216806A2 Compound semiconductor device and method of manufacturing the same
08/11/2010EP2216805A2 Method of cutting semiconductor substrate
08/11/2010EP2216804A1 Plasma processing apparatus
08/11/2010EP2216803A1 Manufacturing method for laminated substrate
08/11/2010EP2216802A1 Device for bonding wafers
08/11/2010EP2216800A2 Method for forming selective emitter of solar cell and diffusion apparatus for forming the same
08/11/2010EP2216656A1 Probe device
08/11/2010EP2216428A1 PROCESS FOR PRODUCING SINGLE CRYSTAL SiC SUBSTRATE AND SINGLE CRYSTAL SiC SUBSTRATE PRODUCED BY THE PROCESS
08/11/2010EP2216277A1 Substrate holding mechanism, substrate delivery/reception mechanism, and substrate processing device
08/11/2010EP2216172A1 Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet
08/11/2010EP2216128A2 Method of cutting object to be processed
08/11/2010EP2215658A2 Semiconductor constructions, methods of forming capacitors, and methods of forming dram arrays
08/11/2010EP2215655A1 Wafer level packaging using flip chip mounting
08/11/2010EP2215653A1 Method to reduce trench capacitor leakage for random access memory device
08/11/2010EP2215652A1 Plasma treatment between deposition processes
08/11/2010EP2215651A1 Device and process for wet treating a peripheral area of a wafer-shaped article
08/11/2010EP2215203A1 High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean
08/11/2010EP1894980B1 Dicing die bonding film
08/11/2010EP1887614B1 Patterning method
08/11/2010EP1817793B1 Methods for forming co-planar wafer-scale chip packages
08/11/2010EP1490902B1 Semiconductor device with a protective security coating and method of manufacturing the same
08/11/2010EP1479102B1 Method of forming different silicide portions on different silicon-containing regions in a semiconductor device
08/11/2010CN201549489U Packaging structure of SIP substrate
08/11/2010CN201549487U Wafer transport unit of semiconductor device
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