| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/11/2012 | CN102314038A Electrophoretic display device and method of fabrication thereof |
| 01/11/2012 | CN102314029A Liquid crystal display panel and fabricating method of the same |
| 01/11/2012 | CN102313599A Device and method for measuring temperature of coupling window, and plasma equipment |
| 01/11/2012 | CN102312220A Method for manufacturing semiconductor device |
| 01/11/2012 | CN102312213A Method of manufacturing a semiconductor device and substrate processing apparatus |
| 01/11/2012 | CN102312189A Film formation apparatus |
| 01/11/2012 | CN102311711A Active energy ray-curable pressure-sensitive adhesive for re-release and dicing die-bonding film |
| 01/11/2012 | CN102311708A Laser dicing sheet and method for manufacturing chip body |
| 01/11/2012 | CN102310410A Gripping device, transfer device, processing device, and manufacturing method for electronic device |
| 01/11/2012 | CN102310262A Heating block device |
| 01/11/2012 | CN102310059A Method for removing high-melting-point adhesives |
| 01/11/2012 | CN102074157B Corrosion device for copper clad laminate |
| 01/11/2012 | CN102044456B 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 01/11/2012 | CN102024687B Method for improving gluing capacity |
| 01/11/2012 | CN101925982B Improved high tilt implant angle performance using in-axis tilt |
| 01/11/2012 | CN101924106B Integrated circuit structure |
| 01/11/2012 | CN101887893B Film transistor array substrate and manufacturing method thereof |
| 01/11/2012 | CN101887861B Chip packaging mould |
| 01/11/2012 | CN101887844B Wafer cleaning device |
| 01/11/2012 | CN101879706B Diamond grinding disc and manufacturing method thereof |
| 01/11/2012 | CN101877305B Substrate processing apparatus |
| 01/11/2012 | CN101872768B Ferroelectric dynamic random storage based on bismuth based storage materials and preparation method thereof |
| 01/11/2012 | CN101868848B Method for fabricating p-type gallium nitride-based semiconductor, method for fabricating nitride-based semiconductor element, and method for fabricating epitaxial wafer |
| 01/11/2012 | CN101847629B MIM decoupling capacitors under contact pad |
| 01/11/2012 | CN101847569B System and method for implementing wafer acceptance test ( wat ) advanced process control ( apc ) with routing model |
| 01/11/2012 | CN101840844B Substrate processing apparatus |
| 01/11/2012 | CN101834209B Power MOS (Metal Oxide Semiconductor) device with groove and manufacturing method thereof |
| 01/11/2012 | CN101834146B Electronic element package and formation method thereof |
| 01/11/2012 | CN101826507B Electrical fuse and relevant control circuit thereof |
| 01/11/2012 | CN101826469B Coreless encapsulation substrate and manufacturing method thereof |
| 01/11/2012 | CN101816060B Semiconductor substrate and semiconductor device |
| 01/11/2012 | CN101814579B Preparation method for high density phase-change memory |
| 01/11/2012 | CN101809711B Apparatus, method for depositing thin film on wafer and method for gap-filling trench using the same |
| 01/11/2012 | CN101809710B Method of manufacturing a structure comprising a substrate and a layer deposited on one of its faces |
| 01/11/2012 | CN101807061B Vision detection control system and method for integrated circuit tendon-cut system |
| 01/11/2012 | CN101800204B Semiconductor sealing structure with model lock and radiating fin thereof |
| 01/11/2012 | CN101796612B Subassembly that includes a power semiconductor die and a heat sink and method of forming same |
| 01/11/2012 | CN101783281B Plasma etching device and etching method of grid electrode |
| 01/11/2012 | CN101779286B Stress relief of a semiconductor device |
| 01/11/2012 | CN101764125B Overspeed delay test system and method |
| 01/11/2012 | CN101736405B Method for improving key size evenness of polysilicon film |
| 01/11/2012 | CN101714533B Circuit device and method of manufacturing the same |
| 01/11/2012 | CN101710574B COG glass substrate positioning device |
| 01/11/2012 | CN101685271B Method for detecting wafer edge cleaning width of wafer |
| 01/11/2012 | CN101681924B Forming a non-planar transistor having a quantum well channel |
| 01/11/2012 | CN101681858B Electronic component connecting method and joined body |
| 01/11/2012 | CN101681721B Intertwined finger capacitors |
| 01/11/2012 | CN101661897B Interconnector structure and manufacturing method thereof |
| 01/11/2012 | CN101661894B Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device |
| 01/11/2012 | CN101656249B Multilayer interconnection structure of wafer level package, manufacturing method and application |
| 01/11/2012 | CN101656241B Packaging structure with substrate post and packaging method thereof |
| 01/11/2012 | CN101656196B Method for making a substrate structure comprising a film |
| 01/11/2012 | CN101651093B Method of forming semiconductor thin film and inspection device of semiconductor thin film |
| 01/11/2012 | CN101636832B Patterned thin soi |
| 01/11/2012 | CN101628395B Chemical mechanical polishing pad manufacturing assembly |
| 01/11/2012 | CN101627461B Edge electrodes with variable power |
| 01/11/2012 | CN101625988B Lens support and wirebond protector |
| 01/11/2012 | CN101582374B Method of forming a thin film pattern for semiconductor device and apparatus for the same |
| 01/11/2012 | CN101577286B Compound type transfer grid and production method thereof |
| 01/11/2012 | CN101577281B Active matrix display and TV comprising the display |
| 01/11/2012 | CN101546721B Unit for opening insert for test tray and method of mounting semiconductor device using the same |
| 01/11/2012 | CN101536260B Adhesive film, and connection structure and connecting method for circuit member |
| 01/11/2012 | CN101536158B Method for cleaning a substrate |
| 01/11/2012 | CN101529578B Improved process for transfer of a thin layer formed in a substrate with vacancy clusters |
| 01/11/2012 | CN101527557B Robust semiconductor power devices with design to protect transistor cells with slower switching speed |
| 01/11/2012 | CN101527176B PN type nuclear battery and preparation method thereof |
| 01/11/2012 | CN101523558B UV-assisted dielectric formation for devices with strained germanium-containing layers |
| 01/11/2012 | CN101521165B Chip-scale packaging method |
| 01/11/2012 | CN101499478B Liquid crystal display device using thin film transistor |
| 01/11/2012 | CN101490850B Semiconductor device, method for fabricating the same and electronic device |
| 01/11/2012 | CN101488465B Chip feature configuring method and chip |
| 01/11/2012 | CN101483968B Ejection type plasma gun and plasma processing device applying the same |
| 01/11/2012 | CN101471294B Method for manufacturing CMOS circuit containing photo triode device |
| 01/11/2012 | CN101452834B Method of manufacturing GaN substrate, method of manufacturing epitaxialwafer, method of manufacturing semiconductor device and epitaxialwafer |
| 01/11/2012 | CN101452828B Method of dividing wafer |
| 01/11/2012 | CN101447394B Method for improving back pollution of work piece during manufacturing process of semiconductor |
| 01/11/2012 | CN101441408B Photomask, manufacturing method thereof, and pattern transfer print method |
| 01/11/2012 | CN101436555B Method of manufacturing semiconductor package |
| 01/11/2012 | CN101432853B Laser processing of workpieces containing low-K dielectric material |
| 01/11/2012 | CN101428403B Improved chemical mechanical polishing pad and methods of making and using same |
| 01/11/2012 | CN101410941B Post-etch treatment system for removing residue on a substrate |
| 01/11/2012 | CN101403785B Probe apparatus and probing method |
| 01/11/2012 | CN101399161B Heat treatment method and device for semiconductor workpieces |
| 01/11/2012 | CN101385087B SONOS memory device with reduced short-channel effects |
| 01/11/2012 | CN101383369B Image sensor and method for manufacturing same |
| 01/11/2012 | CN101371340B Method for smoothing wafer surface and apparatus used therefor |
| 01/11/2012 | CN101364562B Chuck table mechanism and holding method of machined workpiece |
| 01/11/2012 | CN101358109B Polymeric barrier removal polishing slurry |
| 01/11/2012 | CN101352829B Method for processing silicon polished section with low-roughness concentration |
| 01/11/2012 | CN101330032B Plasma processing apparatus and transition chamber thereof |
| 01/11/2012 | CN101330022B Method and platform for making high-tension film |
| 01/11/2012 | CN101326256B Adjuvant capable of controlling a polishing selectivity and chemical mechanical polishing slurry comprising the same |
| 01/11/2012 | CN101315874B Substrate holding apparatus and substrate processing method |
| 01/11/2012 | CN101266982B Semiconductor device, semiconductor display device |
| 01/11/2012 | CN101262013B Semiconductor device and manufacture method thereof |
| 01/11/2012 | CN101261994B Semiconductor device comprising capacitor and method of fabricating the same |
| 01/11/2012 | CN101221936B Wafer level package with die receiving through-hole and method of the same |
| 01/11/2012 | CN101206393B Optical mask employed for manufacturing array substrate, array substrate and method for manufacturing the same |
| 01/11/2012 | CN101201522B Liquid crystal display device and method of manufacturing the same |
| 01/11/2012 | CN101183668B Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof |