Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2012
01/11/2012CN202111064U Substrate heating/cooling device
01/11/2012CN202105747U High pressure water spraying device
01/11/2012CN1956153B Method of forming a trench semiconductor device and structure therefor
01/11/2012CN1945854B Strained semiconductor device and method of making the same
01/11/2012CN1938844B A semiconductor apparatus
01/11/2012CN1923642B Carrier for transporting substrate
01/11/2012CN1906756B Pillar cell flash memory technology
01/11/2012CN1846304B Method for forming a semiconductor device having isolation regions
01/11/2012CN1826844B Solder ball loading method and solder ball loading unit
01/11/2012CN1822227B Multi-level cell memory device and associated read method
01/11/2012CN1752846B Mask patterns including gel layers for semiconductor device fabrication and methods of forming the same
01/11/2012CN1741281B Semiconductor device and manufacturing method for the same
01/11/2012CN1614743B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/11/2012CN1554974B Semiconductor device and method of manufacturing the same
01/11/2012CN102318450A Printed electronics
01/11/2012CN102318086A Method for producing a dopant profile
01/11/2012CN102318078A Enhanced vision system for screen printing pattern alignment
01/11/2012CN102318075A Semiconductor Core, Integrated Fibrous Photovoltaic Device
01/11/2012CN102318073A Flexible semiconductor device and method for manufacturing same
01/11/2012CN102318062A Process/design methodology to enable high performance logic and analog circuits using a single process
01/11/2012CN102318059A Semiconductor protection film-forming film with dicing sheet, method for manufacturing semiconductor device using same,and semiconductor device
01/11/2012CN102318058A Cross-point memory structures, and methods of forming memory arrays
01/11/2012CN102318057A Memory cell having dielectric memory element
01/11/2012CN102318056A Dicing system and method
01/11/2012CN102318055A A method for manufacturing a heterostructure aiming at reducing the tensile stress condition of the donor substrate
01/11/2012CN102318054A A method for fabricating thin touch sensor panels
01/11/2012CN102318053A Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus
01/11/2012CN102318052A Bump, method for forming bump, and method for mounting substrate having the bump formed thereon
01/11/2012CN102318051A Semiconductor chip with reinforcement layer
01/11/2012CN102318050A Preparation of moulded body with electric circuit
01/11/2012CN102318049A Epitaxial substrate for electronic devices and manufacturing method therefor
01/11/2012CN102318048A Semiconductor device
01/11/2012CN102318047A Semiconductor device and method of manufacturing the device
01/11/2012CN102318046A Fin and finfet formation by angled ion implantation
01/11/2012CN102318045A Edge termination with improved breakdown voltage
01/11/2012CN102318044A Layered structures comprising silicon carbide layers, a process for their manufacture and their use
01/11/2012CN102318043A Plasma etching apparatus
01/11/2012CN102318042A Polishing agent for copper polishing and polishing method using same
01/11/2012CN102318041A Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
01/11/2012CN102318040A Process for forming an electroactive layer
01/11/2012CN102318039A Method for manufacturing gallium nitride compound semiconductor, and semiconductor light emitting element
01/11/2012CN102318038A Method and device for measuring temperature during deposition of semiconductor
01/11/2012CN102318037A CD bias loading control with ARC layer open
01/11/2012CN102318036A Scrubber clean before oxide chemical mechanical polish (CMP) for reduced microscratches and improved yields
01/11/2012CN102317748A Substrate fitted with sensor and method for manufacturing substrate fitted with sensor
01/11/2012CN102317501A Heat treatment apparatus, and method for controlling the same
01/11/2012CN102317499A Method for forming cu film and storage medium
01/11/2012CN102317498A Sputtering target and method for processing sputtering target
01/11/2012CN102317036A Three-dimensional network in cmp pad
01/11/2012CN102317030A Laser machining device and laser machining method
01/11/2012CN102316967A Fluid control method and fluid control device
01/11/2012CN102316668A Substrate with fine metal pattern, print circuit board and semiconductor device, and production method of substrate with fine metal pattern, print circuit board and semiconductor device
01/11/2012CN102315313A Shadow frame and making method thereof
01/11/2012CN102315281A Schottky diode and manufacture method thereof
01/11/2012CN102315280A Schottky diode with combined field plate and guard ring
01/11/2012CN102315279A Thin film transistor and manufacturing method thereof as well as array substrate and liquid crystal display device
01/11/2012CN102315273A Hyperconjugation LDMOS (Laterally-Diffused Metal-Oxide Semiconductor) and manufacturing method thereof
01/11/2012CN102315271A Semiconductor device and making method thereof
01/11/2012CN102315270A Power semiconductor structure with field effect rectifier element and making method for power semiconductor structure
01/11/2012CN102315269A Semiconductor device and forming method thereof
01/11/2012CN102315268A Semiconductor device and making method thereof
01/11/2012CN102315267A Semiconductor device and forming method thereof
01/11/2012CN102315266A Semiconductor structure and making method thereof
01/11/2012CN102315265A Semiconductor device and making method thereof
01/11/2012CN102315264A Power device using spherical groove and making method for the power device
01/11/2012CN102315263A Semiconductor and making method thereof
01/11/2012CN102315262A Semiconductor device and making method thereof
01/11/2012CN102315261A Semiconductor device and making method thereof
01/11/2012CN102315252A Flash memory unit for shared source line and forming method thereof
01/11/2012CN102315251A Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
01/11/2012CN102315250A High-voltage bipolar transistor with trench field plate
01/11/2012CN102315248A Semiconductor device and method of manufacturing the same
01/11/2012CN102315246A Relaxation SiGe virtual substrate and preparation method thereof
01/11/2012CN102315245A Transistor structure and light emitting apparatus
01/11/2012CN102315240A High-voltage nitride LED (Light-Emitting Diode) circuit and corresponding high-voltage nitride LED device
01/11/2012CN102315230A Array substrate, method of manufacturing the array substrate, and display apparatus including the array substrate
01/11/2012CN102315228A Array substrate for display device and method of fabricating the same
01/11/2012CN102315227A Thin film transistor (TFT) array substrate and manufacturing method thereof and detection method
01/11/2012CN102315226A Flash memory unit and forming method thereof
01/11/2012CN102315225A Semiconductor storage device and manufacturing method thereof
01/11/2012CN102315224A Nonvolatile storage device making using of Fin FET (Field Effect Transistor) and manufacturing method thereof
01/11/2012CN102315223A High-performance plane floating gate flash memory device structure and making method thereof
01/11/2012CN102315221A Semiconductor memory device and method for fabricating the same
01/11/2012CN102315220A Semiconductor integrated circuit and manufacturing method thereof
01/11/2012CN102315219A Semiconductor device and its production method
01/11/2012CN102315216A Device for controlling light emitting diode by MOS (Metal Oxide Semiconductor) transistor, array and manufacturing method of device
01/11/2012CN102315214A Array baseplate and manufacturing method thereof as well as display panel using same
01/11/2012CN102315202A Substrate strip with circuit and making method for substrate strip
01/11/2012CN102315201A Semiconuctor structure, method for manufacturing the same and resistor
01/11/2012CN102315200A Chip-packaging structure, packaging method and electronic equipment
01/11/2012CN102315198A Structure with alignment mark and manufacture method for stacking device
01/11/2012CN102315197A Three-dimensional (3D) integrated circuit structure and method for detecting alignment of chip structures
01/11/2012CN102315196A Multigrain stack encapsulation structure
01/11/2012CN102315195A Semiconductor package substrate and manufacturing method of the same
01/11/2012CN102315194A Microstructure and microstructure production method
01/11/2012CN102315193A Forming method for light-emitting device chip package and supporting structure
01/11/2012CN102315188A Forming method for semiconductor pipe core and conductive pillar
01/11/2012CN102315186A Semiconductor device packaged with printing bonding materials and manufacturing method thereof
01/11/2012CN102315183A Semiconductor device comprising through hole vias having a stress relaxation mechanism
01/11/2012CN102315182A 半导体芯片及其制造方法 The method of manufacturing a semiconductor chip and