Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
03/2011
03/10/2011US20110056732 Flex-rigid wiring board and method for manufacturing the same
03/08/2011US7901551 Substrate holder and plating apparatus
03/03/2011WO2011024443A1 Ni-plated steel sheet for battery can having excellent pressability
03/03/2011US20110053465 Method and apparatus for local polishing control
03/03/2011US20110050376 Laminate Stack Comprising Individual Soft Magnetic Sheets, Electromagnetic Actuator, Process for Their Manufacture and Use of a Soft Magnetic Laminate Stack
03/03/2011US20110048956 Electrodeposition method for the production of nanostructured zno
03/03/2011US20110048953 Metal wire structure with high-melting-point protective layer and its manufacturing method
03/03/2011DE19820878B4 Verfahren zum Abscheiden einer Materialschicht auf einem Substrat A method of depositing a material layer on a substrate
03/03/2011DE102009038674A1 Trägervorrichtung, Anordnung mit einer solchen Trägervorrichtung sowie Verfahren zur Strukturierung eines mindestens eine keramische Schicht umfassenden Schichtstapels Support apparatus, arrangement with such a support device and method for structuring a comprehensive least a ceramic layer layer stack
03/02/2011EP2290132A1 Copper foil for printed circuit board and copper clad laminate plate for printed circuit board
03/02/2011EP2290128A2 Enhanced method of forming nickel silicides
03/02/2011CN201753368U Micro-via electroplating device for multilayer rigid-flex printed circuit boards
03/02/2011CN101294294B Processing method for printed circuit board before plating
03/01/2011US7897027 Plating apparatus, plating method and multilayer printed circuit board
02/2011
02/24/2011US20110045316 Method for producing a hardened profiled structural part
02/24/2011US20110042222 Cathodic electrodeposition paint containing metal-organic compound
02/23/2011EP2287365A1 Copper zinc alloy electroplating bath and plating method using same
02/23/2011CN101981235A Connecting component metal material and manufacturing method thereof
02/23/2011CN101981234A Tinned copper alloy bar with excellent abrasion resistance, insertion properties, and heat resistance
02/23/2011CN101981230A Copper foil for printed circuit board and copper clad laminate plate for printed circuit board
02/17/2011WO2011019055A1 Heat-resistant copper foil and method for producing same, circuit board, and copper-clad laminate board and method for manufacturing same
02/17/2011WO2011019042A1 Copper alloy material for electrical/electronic components
02/17/2011WO2011018478A1 Electrolyte and method for the electroplating of copper on a barrier layer, and semiconductor substrate obtained with said method
02/17/2011US20110036722 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
02/16/2011EP1912785B1 Electrodeposition of biaxially textured layers on a substrate
02/16/2011CN101978562A Metallic material for connector and process for producing the metallic material for connector
02/16/2011CN101978561A Terminal for connector and method of producing the same
02/16/2011CN101978101A Improved back contact in thin solar cells
02/16/2011CN101977704A Method for cr-plating of mandrel bars, the mandrel bar, and process for producing seamless tubes using the method and the mandrel bar
02/16/2011CN101975807A Three-dimensional Pt-Pb nano floricome type enzyme-free glucose sensor electrode as well as preparation and application thereof
02/16/2011CN101395304B Surface-treated electro-deposited copper foil and method for manufacturing the same
02/15/2011CA2609461C Separator for fuel cell and method for manufacturing the same
02/10/2011WO2010147508A3 Method for etching the surface of an elongated metal article
02/10/2011US20110031183 Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers
02/10/2011US20110030795 Methods and articles for cis and cigs photovoltaics
02/10/2011DE102008000995B4 Kugelgelenk und Verfahren zur Oberflächenbeschichtung eines Kugelgelenkes Ball joint and method for surface coating a ball joint
02/09/2011EP2281642A1 METHOD FOR PLATING MANDREL BAR WITH Cr, MANDREL BAR, AND PROCESS FOR PRODUCING SEAMLESS PIPE USING THE METHOD AND THE MANDREL BAR
02/09/2011EP2173927B1 Equipment and method for electrolytic tinning of steel strips using a non soluble anode
02/09/2011CN201738029U Electrogalvanizing and color coating continuous production line
02/09/2011CN201738028U Contact wire tinning treatment device for contact net of electrified railway
02/09/2011CN201738027U Anode plate power supply device of electrolytic copper foil surface treatment system
02/09/2011CN101970892A 轴承 Bearing
02/09/2011CN101968079A Multi-layer multi-component electroplating high-strength bearing bush, shaft sleeve and bush and processing methods thereof
02/09/2011CN101967670A Horizontal closed double-rod chroming plating machine
02/09/2011CN101967666A Electrolytic phosphorization pool for electrolytic phosphorization of steel wire
02/03/2011WO2011013445A1 Bead wire manufacturing method and manufacturing apparatus
02/03/2011US20110024299 Method for the Electrochemical Coating of a Workpiece
02/03/2011US20110024040 Deposit protection cover and plasma processing apparatus
02/03/2011DE112009000629T5 Lager Stock
02/02/2011EP2279290A2 Electroplating composition and process for coating a semiconductor substrate using said composition
02/02/2011CN201729900U Plating bath for high-speed plating of microelectronic element framework
02/02/2011CN201729899U Lead frame electroplating anti-adhesion device
02/02/2011CN1962962B Plating tank
02/02/2011CN101578397B Roll unit dipped in surface treatment liquid
02/02/2011CN101281858B Substrate holder and plating apparatus
02/02/2011CN101248499B Multilayer electronic component and its manufacturing method
01/2011
01/27/2011WO2011010540A1 Resin composite electrolytic copper foil, copper-clad laminate, and printed wiring board
01/27/2011DE4225961C5 Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände Apparatus for electroplating, in particular copper plating, flat plate or sheet-like objects
01/26/2011CN201722440U Galvanized ammonium salt solvent bath solution analyzer
01/26/2011CN201722439U Pull plating device
01/26/2011CN201722421U Improved structure for silverware surface
01/26/2011CN1530469B High efficient copper foil and producing method thereof
01/26/2011CN101956227A Automatic querying method for controlling gold-plating current of chip capacitor
01/26/2011CN101956221A Continuous plating device for films and method for performing continuous plating on films
01/26/2011CN101954762A Steel strip plated with composite film containing cobalt nanowires and preparation method thereof
01/26/2011CN101523522B An electroplating method in the manufacture of the surface mount precision metal resistor
01/25/2011US7875158 Plating apparatus
01/20/2011WO2011007704A1 Copper foil with resistive layer, production method therefor, and layered substrate
01/20/2011US20110011746 Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper
01/20/2011US20110011744 Novel method to reduce void formation during trapezoidal write pole plating in perpendicular recording
01/19/2011EP2275590A1 Slide member fabrication method, slide member, and slide member base material
01/19/2011CN201713591U Plating equipment for electrode of silicon solar battery plate
01/19/2011CN101950603A Interlinked strip/busbar for solar energy photovoltaic module and manufacturing method thereof
01/19/2011CN101949050A Electroplating support system for mandrel workpieces
01/19/2011CN101573477B Roll unit for use in surface treatment of copper foil
01/19/2011CN101528981B Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c
01/19/2011CN101331247B Plating apparatus and plating method
01/18/2011US7872130 3'-N,N-dimethylamino-3,8'-dimethyl-8-(N-methylamino)-7'-oxo-10,5'-diphenyl-5',7'-dihydro-[2,2']biphenazinyl-10-ium chloride; copper plating bath for bright, ductile copper coating, contains as an additive a mixture of oligomeric phenazinium compound (containing two and three monomeric units)
01/13/2011US20110008916 Proximity Head Heating Method and Apparatus
01/13/2011US20110008647 High-strength cold-rolled steel sheet, high-strength galvanized steel sheet, and high-strength alloyed hot-dip galvanized steel sheet having excellent formability and weldability, and methods for manufacturing the same
01/13/2011US20110008616 Support Layer for Thin Copper Foil
01/13/2011US20110008581 Fabrication of Multi-Dimensional Microstructures
01/13/2011US20110005935 Plating method for a radio frequency device and a radio frequency device produced by the method
01/13/2011US20110005586 Electrochemical Deposition Methods for Fabricating Group IBIIIAVIA Compound Absorber Based Solar Cells
01/12/2011EP2273622A1 Metallic material for connector and process for producing the metallic material for connector
01/12/2011EP2273621A1 Terminal for connector and process for producing the terminal for connector
01/12/2011EP2173928B1 Plant and process for the electrolytic tinning of steel strips, using an insoluble anode
01/12/2011EP1249517B1 METHOD OF COPPER ELECTROPLATING with pretreatment
01/12/2011CN201704425U Gold plating bath for printed circuit boards
01/12/2011CN101946028A Composite coatings for whisker reduction
01/12/2011CN101942686A Production process of coppered steel wire for enhancing rubber hose
01/12/2011CN101942685A Track trailer for mandril workpiece during electroplating
01/11/2011US7867625 Copper-tin-oxygen alloy plating
01/11/2011US7867368 Plating apparatus
01/06/2011WO2011001795A1 Metal laminate structure and process for production of metal laminate structure
01/06/2011WO2011001737A1 Electrical component and method for manufacturing electrical components
01/06/2011US20110003153 Conductive fibers and a method of manufacturing the same
01/06/2011US20110000793 Coating method for a workpiece
01/06/2011US20110000784 Method and electrode for defining and replicating structures in conducting materials
01/05/2011EP2270261A2 Strong, lightweight article containing a fine-grained metallic layer
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