Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
10/2008
10/02/2008WO2008117403A1 Insulating spacer for plating inner surface and auxiliary anode unit
10/02/2008WO2007111729A3 An apparatus and a method for electrochemical mechanical processing with fluid flow assist elements
10/02/2008US20080237437 Support For Part To Be Coated By Electrolytic Deposition
10/02/2008US20080237048 To selectively electrodeposit or electrofill conductive materials in deep features such as, 3-D vias and trenches formed on semiconductor wafers to manufacture 3-D integration structures or through wafer conductive structures; not cause defects such as voids in the large vias
10/02/2008DE102007015641A1 Electroplating apparatus for circuit boards has anode which consists of sheet metal and is mounted on adjusting screws, allowing its shape to be changed to provide desired current density between it and boards at different points
10/02/2008DE102007015361A1 Conductive support for flat articles during electrolytic coating has insulating component between it and article
10/01/2008CN201125276Y Improved anode hang tool
10/01/2008CN101275268A Method for fabricating plated product
10/01/2008CN101275267A Thickness evenness-improved electroplating apparatus and electroplating method
10/01/2008CN101275258A Manufacturing method of resin plated product and resin molded product to be plated used by the method
10/01/2008CN100422389C Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment
09/2008
09/25/2008WO2005076977A3 Plating apparatus and method
09/25/2008US20080230390 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating
09/25/2008US20080230377 Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers
09/25/2008US20080230097 Methods for Processing Wafer Surfaces Using Thin, High Velocity Fluid Layer
09/25/2008DE202008006785U1 Dialysezellenanordnung in Tauchbeschichtungsanlagen Dialysis cell array in dip coating
09/24/2008CN201121219Y Improved structure of plating clamping apparatus
09/24/2008CN201121218Y Hook structure of electroplating rack
09/24/2008CN101270496A Large-scale great current mixed mode cathode roll
09/24/2008CN100420774C Zinc alloy slide fastener electroplating device
09/23/2008US7427345 Cleaning; reducing , disposal of liquid wastes; applying voltage
09/23/2008US7427339 Heat conducting metal layer for ion conductor stack
09/23/2008US7427338 Flow diffuser to be used in electro-chemical plating system
09/17/2008CN201116313Y Hanger for anodic oxidation
09/17/2008CN201116312Y Pre-plated copper electrode protecting device
09/17/2008CN201116311Y Wafer bump manufacturing hanger
09/17/2008CN101265606A Apparatuses for electrochemical deposition, and method for forming conductive layer
09/16/2008US7425256 Selective shield/material flow mechanism
09/16/2008US7425250 Electrochemical mechanical processing apparatus
09/12/2008WO2008108341A1 Production method and device of surface roughened copper plate, and surface roughened copper plate
09/12/2008WO2008080515A3 Set for creating a process reactor for forming metallic layers on at least one substrate
09/11/2008US20080217167 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/11/2008US20080217166 Apparatus and methods for electrochemical processsing of microelectronic workpieces
09/11/2008US20080217165 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/11/2008US20080217164 Electrolytic Processing Apparatus
09/11/2008DE102007022016B3 Galvanizing assembly holds flat wafers or other substrate by Bernoulli chuck during treatment
09/11/2008DE102007011032A1 Holding device for galvanically coating common rail lines comprises a contact bolt for contacting with a holding unit of a galvanizing device, a holding dome molded to the contact bolt for fixing a cover and a contact spring
09/10/2008CN101260554A Metal foil band electroplating system and application thereof
09/10/2008CN101260550A Technique and device for manufacturing electroplating copper cathode baffle
09/09/2008US7422673 Membrane electrode assemblies and electropaint systems incorporating same
09/09/2008US7422516 Conductive polishing article for electrochemical mechanical polishing
09/04/2008US20080213995 Ultrasonic electropolishing of conductive material
09/04/2008US20080210568 Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer having Low Particle Adhesion Plated with said Method and Anode
09/04/2008US20080210562 Plating method and plating apparatus
09/04/2008US20080210554 Method for treating the surface of object and apparatus thereof
09/04/2008US20080210552 Small portable electrolytic sodium hypochlorite on site generators
09/03/2008EP1964945A2 System and method for electroplating metal components
09/03/2008EP1963549A1 A device and a method for metal plating
09/03/2008EP1521868B1 Device and method for monitoring an electrolytic process
09/03/2008CN101258270A Method using a coating for making electrical contact
09/03/2008CN101255595A Electroplating device and method with zero-discharge of sewage water
09/03/2008CN101255594A Environment-protection electroplating production technique and equipment
09/03/2008CN100415943C Workpiece wet processing
09/02/2008CA2490464C Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
08/2008
08/28/2008WO2008101740A1 Device and method for the electrolytic plating of metal
08/28/2008US20080206899 Measurement reflection of semiconductor substrate with concave segments; calibration; vapor deposition; forming metal film
08/27/2008EP1961842A1 Device and method for the electrolytic plating of a metal
08/27/2008EP1961841A1 Method for electroplating of catalyst particles on substrates containing carbon fibres and device therefor
08/27/2008CN101250743A Anode box
08/27/2008CN101250736A Continuous electroplating apparatus
08/27/2008CN100414001C Method and apparatus for preparing coating or film by microwave hydrothermal electrodeposition
08/26/2008US7416647 Plating processing device
08/21/2008DE102007043975B3 Electroplating plant making automatic, pneumatically-operated contact with object supports, includes switch lever between contact planes to control contact closure
08/20/2008CN201102993Y Acid plated sink roller flange capable of convenient replacing
08/20/2008CN101248499A Multilayer electronic component and its manufacturing method
08/20/2008CN101248220A 表面处理电极 Surface treatment electrode
08/19/2008US7413644 Installation for the cataphoretic dip coating of articles
08/19/2008US7413638 Nanolithography and microlithography devices and method of manufacturing such devices
08/14/2008WO2008097218A1 Heat spreader plating methods and devices
08/14/2008WO2008096235A1 An apparatus for electrophoretic painting of metal objects, in particular lids for containers for food use
08/14/2008US20080190761 Technique and apparatus for depositing thin layers of semiconductors for solar cell fabrication
08/13/2008CN201099706Y Piston ring three-sided chrome plating jigs
08/13/2008CN201099705Y Steel belt molding bushing ring chrome plating special fixture
08/13/2008CN101240443A Electroplating apparatus and electroplating method and plating jig
08/13/2008CN101240441A Electrophoresis painting clamp and using method thereof
08/12/2008US7410557 Hydrogen activating apparatus
08/07/2008WO2007118875A3 Electroplating device and method
08/07/2008DE202008006707U1 Vorrichtung zum Glavanisieren von Werkstücken Apparatus for Glavanisieren of workpieces
08/06/2008EP1859079B1 Cylindrical electrode
08/05/2008US7406972 Substrate proximity processing structures
07/2008
07/31/2008US20080179279 Method for Electrochemical Fabrication
07/31/2008US20080179192 Anodes, each with different types of soluble metals, avoiding the need for periodic plating bath replacement, allowing the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals
07/31/2008US20080179180 Apparatus and methods for electrochemical processing of microfeature wafers
07/31/2008US20080178800 Substrate processing unit and substrate processing apparatus
07/30/2008EP1948852A1 Master electrode and method of forming the master electrode
07/30/2008CN101230473A Bimetal leaf treatment process and film-plating bimetal leaf
07/29/2008US7404886 Removing additives adsorbed on the top and cavity portions to allow plating to take place before the additive fully re-adsorbs onto the top portion so it is plated more than the cavity
07/24/2008WO2008066571A3 Reducing formation of tin whiskers on a tin plating layer
07/24/2008DE102006062553B3 Structural unit for production of adaptable for deposition of metal layers substrates useful in semiconductor technology, production of microstructural components and CDs DVDs gives homogeneous and uniform coatings
07/23/2008CN201089801Y Drilling tool thread electric spraying profiling anode assembly
07/23/2008CN201089800Y Elastic hook type electroplating rack
07/22/2008US7402234 Polymeric hydrogen diffusion barrier, high-pressure storage tank so equipped, method of fabricating a storage tank and method of preventing hydrogen diffusion
07/22/2008US7402229 Fabrication and use of semipermeable membranes and gels for the control of electrolysis in a microfluidic device
07/22/2008US7402227 Plating apparatus and method
07/16/2008CN101223304A Electrode arrangement and method for the electrochemical coating of a workpiece surface
07/16/2008CN101220500A Wafer convex point producing hanging fixture
07/16/2008CN101220499A Copper pre-plating conductive pole protecting equipment
07/16/2008CN101220498A Multiple-grooved type coil stock continuously plating product line frame
07/16/2008CN101220492A Proximity processing using controlled batch volume with an integrated proximity head
07/16/2008CN100402705C Electrolytic electrode and process of producing the same
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