Patents for C23F 1 - Etching metallic material by chemical means (16,062)
12/2010
12/14/2010US7850817 Polishing device and substrate processing device
12/14/2010US7850174 Plasma processing apparatus and focus ring
12/09/2010WO2010139902A1 Method for regenerating a solution used for pickling or chemically milling titanium
12/09/2010WO2010138999A1 Plasma etching of chalcogenides
12/09/2010US20100311247 Method and Device for Treating Silicon Wafers
12/09/2010US20100310830 Etching Mask, Base Material Having Etching Mask, Finely Processed Article, And Method For Production Of Finely Processed Article
12/09/2010US20100310828 Substrate processing method and substrate processed by this method
12/09/2010US20100308463 Interfacial capping layers for interconnects
12/09/2010US20100308015 Superfine-patterned mask, method for production thereof, and method employing the same for forming superfine-pattern
12/09/2010US20100308014 Method and apparatus for etching
12/09/2010US20100308010 Composite micromechanical component and method of fabricating the same
12/09/2010US20100308009 Nanoimprint resist, nanoimprint mold and nanoimprint lithography
12/09/2010US20100308008 Nanoimprint resist, nanoimprint mold and nanoimprint lithography
12/09/2010US20100307687 Internal member of a plasma processing vessel
12/09/2010US20100307686 Substrate processing apparatus
12/09/2010US20100307685 Microwave plasma processing apparatus
12/09/2010DE102009024320A1 Coating comprises corroded nanoparticular metal-/silicon oxide layers, in whose surface, fluorine compounds are bounded, or silica, silicon oxide compound, alumina and/or titania or mixed oxides of titania/silica
12/08/2010CN101910468A Etchant for copper or copper alloy, liquid for etching pretreatment, and etching method
12/08/2010CN101908576A Method for manufacturing textured surface of monocrystalline silicon solar cell
12/08/2010CN101904774A Metal implant and surface processing method thereof
12/08/2010CN101904766A Silicon blades for surgical and non-surgical use
12/07/2010US7846348 Manufacturing method of semiconductor device
12/07/2010US7846345 Method of manufacturing an imprinting template using a semiconductor manufacturing process and the imprinting template obtained
12/07/2010US7846291 Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film
12/07/2010US7846255 Processing equipment for object to be processed
12/07/2010US7846254 Heat transfer assembly
12/07/2010US7845310 Wide area radio frequency plasma apparatus for processing multiple substrates
12/07/2010US7845309 Ultra high speed uniform plasma processing system
12/02/2010US20100304573 Stabilized etching solutions for cu and cu/ni layers
12/02/2010US20100304572 Plasma processing apparatus and plasma processing method
12/02/2010US20100304571 Film adhesive for semiconductor vacuum processing apparatus
12/02/2010US20100304146 Enhancing plasma surface modification using high intensity and high power ultrasonic acoustic waves
12/02/2010US20100304061 Fabrication of high aspect ratio features in a glass layer by etching
12/02/2010US20100303673 Solar energy powered molecular engine
12/02/2010US20100302616 Illumination devices and methods of fabrication thereof
12/02/2010US20100301013 Method for laser ablation
12/02/2010US20100301012 Device and method for producing microwave plasma with a high plasma density
12/02/2010US20100301011 Apparatus and method for downstream pressure control and sub-atmospheric reactive gas abatement
12/02/2010US20100301010 ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo
12/02/2010US20100301009 Method for forming electrode pattern of ceramic substrate
12/02/2010US20100301006 Method of Manufacturing an Electrical Component on a Substrate
12/02/2010US20100300623 Plasma etching apparatus
12/02/2010US20100300622 Circular ring-shaped member for plasma process and plasma processing apparatus
12/02/2010US20100300621 Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor
12/01/2010CN201663760U Automatic feeding device of etching solution additive for printed circuit board production line
12/01/2010CN101903988A Etching agent, etching method and liquid for preparing etching agent
12/01/2010CN101901743A Cleaning process and apparatus for silicate materials
12/01/2010CN101899666A Stabilization and regeneration method of aluminum and aluminum alloy chemical milling solution
12/01/2010CN101899665A Method for recycling copper from acid copper chloride etching liquid
12/01/2010CN101592469B Method and device for measuring damaged layer thickness and minority carrier lifetime of solar cell silicon chip
12/01/2010CN101530679B Solid phase micro-extraction stainless steel fiber and preparation method thereof
12/01/2010CN101307453B Technology of silicon nano-wires without electrodeposit nickel and thermoelectric power device based on the technology
11/2010
11/30/2010US7844559 Method and system for predicting process performance using material processing tool and sensor data
11/30/2010US7842223 Plasma process for removing excess molding material from a substrate
11/30/2010US7842158 Multiple zone carrier head with flexible membrane
11/25/2010WO2010133787A1 Method for etching a material in the presence of solid particles
11/25/2010WO2010133786A1 Method for etching a material in the presence of a gas
11/25/2010WO2010114420A3 Method for producing a relief pattern
11/25/2010WO2010060408A4 Pickling method and pickling plant
11/25/2010US20100297850 Selective self-aligned double patterning of regions in an integrated circuit device
11/25/2010US20100297788 Arrangements and methods for improving bevel etch repeatability among substrates
11/25/2010US20100297787 System and method for backside circuit editing on full thickness silicon device
11/25/2010US20100296986 Microscreen for filtering particles in microfluidics applications and production thereof
11/25/2010US20100294710 Method for producing a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, and component
11/25/2010US20100294654 Micro-metal-mold with patterns of grooves, protrusions and through-openings, processes for fabricating the mold, and micro-metal-sheet product made from the mold
11/25/2010US20100294433 Plasma processing apparatus
11/25/2010US20100294431 Equipment for producing semiconductors, corresponding pumping device and substrate holder
11/24/2010EP2253740A1 Etchant for copper or copper alloy, liquid for etching pretreatment, and etching method
11/24/2010EP2253739A1 Etching method
11/24/2010EP2253583A2 Method of harvesting nanostructures from a substrate
11/24/2010EP2252725A1 Single phase fluid imprint lithography method
11/24/2010CN201648520U Spraying device for etching PCB
11/24/2010CN1584129B Method for separating copper from copper-containing waste liquid
11/24/2010CN101894790A Preparation method of semiconductor chip
11/24/2010CN101894779A A method and apparatus for semiconductor processing
11/24/2010CN101894778A A method and apparatus for semiconductor processing
11/24/2010CN101891948A Super hydrophobic polyurethane film with wear resistance property and preparation method thereof
11/23/2010US7837889 Methods of etching nanodots, methods of removing nanodots from substrates, methods of fabricating integrated circuit devices, methods of etching a layer comprising a late transition metal, and methods of removing a layer comprising a late transition metal from a substrate
11/23/2010US7837799 Arrangement for transporting a flat substrate in a vacuum chamber
11/23/2010US7837798 Semiconductor processing apparatus with a heat resistant hermetically sealed substrate support
11/18/2010WO2010130705A1 Process for the recovery of phosphate values from a waste solution
11/18/2010US20100288731 Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material
11/18/2010US20100288730 Vacuum Processing Apparatus And Vacuum Processing Method Using The Same
11/18/2010US20100288729 Methods for Manufacturing a Microstructure
11/18/2010US20100288728 Apparatus and method for processing substrate
11/18/2010US20100288727 Method for manufacturing substrate for biochip
11/18/2010US20100288542 Embedded Substrate Having Circuit Layer Element With Oblique Side Surface and Method for Making the Same
11/17/2010EP1015669B1 Electroplating method for forming a multilayer structure
11/17/2010CN201634764U Device for regenerating waste acidic etching liquid and recovering copper
11/17/2010CN201634763U Metal layer planarization system
11/17/2010CN101889106A A method of manufacturing a press plate, a press plate, a method of embossing a floor panel, and a floor planel
11/17/2010CN101886266A Etchant and method of manufacturing an array substrate using the same
11/17/2010CN101886265A Etching solution for copper-containing multilayer film
11/17/2010CN101886264A Surface treatment method for metal implant
11/17/2010CN101886263A Blowing corrosion machine and method for corrosion and cleaning
11/17/2010CN101886262A Wet etching machine bench and method for eliminating silicon wafer etching difference
11/16/2010US7833405 doped areas are first selectively anodized (porous etching), which is carried out locally by means of a monocrystalline cover layer, e.g., an epitaxial layer, followed by a time-controlled switch to selective electropolishing of doped layer buried under the membrane to produce a cavity under cover layer
11/16/2010US7833382 Vacuum processing apparatus
11/16/2010US7833381 Optical emission interferometry for PECVD using a gas injection hole
11/16/2010US7833351 Batch processing platform for ALD and CVD
1 ... 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 ... 161