| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 10/28/2004 | US20040211998 Lanthanide series layered superlattice materials for integrated circuit applications |
| 10/28/2004 | US20040211941 Composition for forming a transparent conducting film, solution for forming a transparent conducting film and method of forming a transparent conducting film |
| 10/28/2004 | CA2523009A1 Use of an article as moulding tool |
| 10/28/2004 | CA2522647A1 Use of an object as an electronic component |
| 10/28/2004 | CA2522644A1 Use of an article as decorative structural part |
| 10/28/2004 | CA2522641A1 Article with layers of composite material of a first non-metallic layer and a second metallic layer applied to the first layer |
| 10/28/2004 | CA2522504A1 Rapid prototyping process |
| 10/27/2004 | EP1471167A2 Electroless plating method |
| 10/27/2004 | EP1471084A2 Polymers for metal coating and method for the preparation thereof |
| 10/27/2004 | EP1470571A2 Electroless deposition apparatus and method |
| 10/27/2004 | EP1470198A2 Polymer derivatives for the treatment of metals |
| 10/27/2004 | EP1218315B1 Process for making chemically bonded sol-gel ceramics |
| 10/27/2004 | CN1541143A Nickel plating solution and process for its use |
| 10/27/2004 | CN1540810A Metal coated carbon brush |
| 10/27/2004 | CN1540692A 镀覆接线端 Plated terminals |
| 10/27/2004 | CN1539744A Composite powder of stannic oxide Nano crystal with silver being covered |
| 10/27/2004 | CN1173401C Method for preparing non-electroplating more than two layers of metal convex blocks |
| 10/27/2004 | CN1173073C Hardness increasing method for chemical nickel boron alloy cladding |
| 10/26/2004 | US6809029 Semiconductor production device and production method for semiconductor device |
| 10/21/2004 | WO2004069948A3 Method for adhesively coating a substrate with a metal layer |
| 10/21/2004 | US20040209485 Fabrication of pure and modified Ta2O5 thin film with enhanced properties for microwave communication, dynamic random access memory and integrated electronic applications |
| 10/21/2004 | US20040209188 Solvents and photoresists compositions for short wavelength imaging |
| 10/21/2004 | US20040209004 apparatus comprising a coater for coating a liquid that reacts with an ultraviolet ray to deposit metal on the substrate, and an ultraviolet irradiating means; wiring pattern formed by ink jet printing of good adhesion |
| 10/21/2004 | US20040208992 Method for producing conductive particles |
| 10/21/2004 | US20040208817 Direct surface patterning of carbon |
| 10/21/2004 | US20040206267 Aluminum phosphate coatings |
| 10/20/2004 | EP1469099A1 A process to obtain chromium-plated effect coatings and a composition to carry out such process |
| 10/20/2004 | CN1539028A Patterning method |
| 10/20/2004 | CN1538523A Heavy current medium film and its manufadturng method, heavy-curent medium storage, pizeoelectric element |
| 10/20/2004 | CN1537971A Electroplating pretreatment solution and electroplating pretreatment method |
| 10/19/2004 | US6806224 Reducing metal halide in liquid phase in the presence of support material, an organic base and a reducing agent |
| 10/19/2004 | US6806210 Tantalum oxide film, use thereof, process for forming the same and composition |
| 10/19/2004 | US6805915 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 10/19/2004 | US6805911 Method and apparatus for improving interfacial chemical reactions |
| 10/14/2004 | WO2004087992A2 Method for the formation of a coating of metal oxides on an electrically-conducting substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal chlorides |
| 10/14/2004 | WO2004032831A3 Metalization of microtubules |
| 10/14/2004 | US20040203221 Electronic device manufacturing method |
| 10/14/2004 | US20040202958 an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid; pretreating an insulating film to remove residual metals exposed by etching |
| 10/14/2004 | US20040202861 Molybdenum disulfide coated with metal that softens or melts; preventing heat decomposition during application of thick solid lubricant layer |
| 10/14/2004 | US20040201446 Conductive substrate with resistance layer, resistance board, and resistance circuit board |
| 10/14/2004 | US20040200725 Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| 10/14/2004 | DE10315738A1 Device for stabilizing tin baths for tin plating circuit boards comprises a horizontal drum having openings for removing slurry and for introducing tin balls and bath liquid |
| 10/14/2004 | DE10313517A1 Lösung zum Ätzen von Kupferoberflächen und Verfahren zum Abscheiden von Metall auf Kupferoberflächen Solution for etching copper surfaces and methods for depositing metal on copper surfaces |
| 10/13/2004 | EP1466353A1 Contamination suppression in chemical fluid deposition |
| 10/13/2004 | CN1536100A Environment-protecting catalytic liquor for chemically-plating copper, nikel and phosphorus three-element alloy and its preparation method |
| 10/13/2004 | CN1535934A Ceramic material and its mfg. method |
| 10/12/2004 | US6803134 Paraelectric thin film material and method statement of government interest |
| 10/12/2004 | US6802985 Method for fabricating metal wirings |
| 10/07/2004 | WO2004085706A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 10/07/2004 | US20040198190 Method and apparatus for reduction of defects in wet processed layers |
| 10/07/2004 | US20040198081 Microelectronic spring contact elements |
| 10/07/2004 | US20040197973 Component formation via plating technology |
| 10/07/2004 | US20040197541 Selective electroless deposition and interconnects made therefrom |
| 10/07/2004 | US20040197485 plating bath of a double bath structure including an inner bath holding a plating solution, and an outer bath surrounding the inner bath and is in communication with it; and a heater in the outer bath; uniform temperature control; especially for electroless deposition of copper or silver |
| 10/07/2004 | US20040197478 After molding thermoplastic with a shear strength of 50 MPa or more, the surfaces are subjected to liquid honing treatment with an aluminum abrasive so that the surface roughness Rz is 10 mu m or more, adding catalyst, activation, and electroless plating |
| 10/07/2004 | US20040197476 Process for producing aluminum oxide films at low temperatures |
| 10/07/2004 | US20040194698 Plating apparatus |
| 10/07/2004 | US20040194667 Aqueous sodium and potassium silicate blend; maintaining metallurgical strength properties and dimensions of parts |
| 10/07/2004 | US20040194535 Nanodisk sensor and sensor array |
| 10/06/2004 | EP1464410A1 Low dielectric materials and methods for making same |
| 10/06/2004 | EP1332244A4 Method for enhancing the solderability of a surface |
| 10/05/2004 | US6800121 Mixtures of nickel salts of alkylsulfonic acid and reducing agents such as hypophosphorous acid, used for coating alloy substrates |
| 10/05/2004 | US6800111 Concentrating the catalytic metal colloid on a filter; removing the catalytic metal of the catalytic metal colloid from the filter with an oxidizer; collecting the catalytic metal |
| 09/30/2004 | WO2004084286A1 Film forming mehtod and film forming apparatus for semiconductor device |
| 09/30/2004 | WO2004084285A1 Film forming method and film forming apparatus for semiconductor device |
| 09/30/2004 | WO2004084284A1 Film forming method and apparatus |
| 09/30/2004 | US20040192038 Methods for forming wiring and electrode |
| 09/30/2004 | US20040191575 Servo pattern formation via transfer of sol-gel layer and magnetic media obtained thereby |
| 09/30/2004 | US20040191423 spin coating amorphous films of silver-containing precursors such as silver trifluoroacetylacetonate on surfaces of substrates and irradiating to form electroconductive or semiconductor layers; microelectronics |
| 09/29/2004 | EP1462544A2 Methods for forming wiring and electrode |
| 09/29/2004 | EP1462230A1 Honeycomb structural body forming ferrule, and method of manufacturing the ferrule |
| 09/29/2004 | EP1461471A2 Polymer derivatives for treating metals |
| 09/29/2004 | EP1461345A2 Copper deposition using copper formate complexes |
| 09/29/2004 | EP1461165A1 Metallic structures incorporating bioactive materials and methods for creating the same |
| 09/29/2004 | CN1533448A Jet plating apparatus |
| 09/29/2004 | CN1168850C Method for providing metal surface with vitreous layer |
| 09/28/2004 | US6798127 Enhanced field emission from carbon nanotubes mixed with particles |
| 09/28/2004 | US6798032 Metal film pattern and manufacturing method thereof |
| 09/28/2004 | US6797531 Process for producing microlens array, array master, electrolytic solution and microlens array resin material therefor and apparatus for producing master |
| 09/28/2004 | US6797312 Electroless plating solution and process |
| 09/28/2004 | US6797278 Film exhibits a log kill rate for klebsiella pneumoniae of >/= .5 as measured under a modified plate contact method |
| 09/28/2004 | US6796870 Field emission type cold cathode device, manufacturing method thereof and vacuum micro device |
| 09/23/2004 | WO2004081261A2 Plating apparatus |
| 09/23/2004 | WO2004081256A1 Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/ passivation layer on copper |
| 09/23/2004 | WO2004081255A1 Semiconductor device |
| 09/23/2004 | WO2004072357A3 Fiber and sheet equipment wear surfaces of extended resistance and methods for their manufacture |
| 09/23/2004 | US20040186008 Catalyst-imparting treatment solution and electroless plating method |
| 09/23/2004 | US20040185295 Applying protective diffusion aluminide coatings; gas turbines |
| 09/23/2004 | US20040184691 Lightweight bearing and wave gear drive |
| 09/23/2004 | US20040182714 Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
| 09/23/2004 | US20040182713 Article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental meta; additional conductive material may then be deposited onto the elemental metal to produce a microstructure |
| 09/23/2004 | US20040182694 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes |
| 09/23/2004 | US20040182277 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
| 09/22/2004 | EP1460049A2 Method of manufacturing ceramic film and pressure heat treatment device used therefor |
| 09/22/2004 | EP1459367A2 Method for defining a source and a drain and a gap inbetween |
| 09/22/2004 | EP1458905A2 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes |
| 09/22/2004 | CN1531749A Method for multilevel copper interconnects for ultra large scale integration |
| 09/22/2004 | CN1531036A Producing method for ceramic membrane pressurized heat treater therefor |
| 09/22/2004 | CN1530464A Method for producing molded goods plating |
| 09/22/2004 | CN1168125C Copper deposit process |