C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
11/2004
11/24/2004	CN1548261A Making process of composite iron-in-copper powder
11/24/2004	CN1177091C Process for batch-plating aramid fibers
11/24/2004	CN1176873C Continuous chemical powder plating method and apparatus
11/23/2004	US6821909 Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
11/23/2004	US6821324 Cobalt tungsten phosphorus electroless deposition process and materials
11/23/2004	US6821323 Process for the non-galvanic tin plating of copper or copper alloys
11/18/2004	WO2004100257A1 Method to form selective cap layers on metal features with narrow spaces
11/18/2004	WO2004099467A1 Compositions for the currentless deposition of ternary materials for use in the semiconductor industry
11/18/2004	WO2004099466A2 Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation
11/18/2004	WO2004099465A1 Composition for coating metals to protect against corrosion
11/18/2004	WO2004099464A1 Method for forming ferrite film
11/18/2004	WO2004099459A2 Enhanced metal ion release rate for anti-microbial applications
11/18/2004	WO2004098795A1 Corrosion protection on metals
11/18/2004	US20040229447 Process for producing luminescent silicon nanoparticles
11/18/2004	US20040229068 Nodular nickel boron coating
11/18/2004	US20040229034 exposing substrates to metal ions, then to basic environments to form thin films comprising antimicrobially active oxidized silver; medical equipment
11/18/2004	US20040229023 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates
11/18/2004	US20040226817 Electrolytic electrode and process of producing the same
11/18/2004	US20040226407 Method and apparatus for converting metal ion in solution to the metal state
11/18/2004	DE10320779A1 Korrosionsschutz auf Metallen Corrosion protection on metals
11/18/2004	DE10238284B4 Verfahren zum Herstellen einer schaumförmigen Metallstruktur, Metallschaum sowie Anordnung aus einem Trägersubstrat und einem Metallschaum A method of manufacturing a foam-like metal structure, metal foam as well as arrangement of a supporting substrate and a metal foam
11/18/2004	DE10052960B4 Bleifreie Chemisch-Nickellegierung und Verfahren zu Ihrer Herstellung Lead-free electroless nickel alloy and process for their preparation
11/18/2004	CA2564919A1 Enhanced metal ion release rate for anti-microbial applications
11/17/2004	EP1477585A2 Electrolytic electrode and process of producing the same
11/17/2004	CN1546727A Chemical plating nickel conductive film on polymer thin film surface and method for preparing the same
11/17/2004	CN1546726A Method for chemical plating nickel phosphor alloy
11/17/2004	CN1546725A Method of forming texture epitaxial film on metallic substrate
11/17/2004	CN1546724A Method for preparing ferroelectric thin film / thick film
11/17/2004	CN1176246C Method of lowering crystallization temperature of chemical plated nickel alloy
11/17/2004	CN1176234C High temperature resistant anti-oxidant base metal copper-silver alloy composition and its producing method
11/16/2004	US6818840 Method for manufacturing raised electrical contact pattern of controlled geometry
11/16/2004	US6818313 To be deposited onto steel or cast iron surfaces for enhanced corrosion protection
11/16/2004	US6818252 Method of reducing corrosion in gas turbine engines
11/16/2004	CA2460585A1 Deposition products, composite materials and processes for the production thereof
11/11/2004	WO2004097929A2 Method and apparatus for reduction of defects in wet processed layers
11/11/2004	WO2004097854A1 Liquid composition for forming ferroelectric thin film and method for forming ferroelectric thin film
11/11/2004	WO2004096937A1 Adhesive for nonelectrolytic plating and process for the preparation thereof
11/11/2004	WO2004001099A3 Complexing agent for treating metallic and plastic surfaces
11/11/2004	US20040224537 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
11/11/2004	US20040224497 Method to form selective cap layers on metal features with narrow spaces
11/11/2004	US20040224252 comprises catalyst precursor (alkyl, alkenyl, alkynyl-carboxylic acid metal salt) with metal-deposition catalytic activity suitable for electroless metal plating
11/11/2004	US20040224169 high plating strength; does not require an etching treatment by chromic acid; safety is higher and drainage treatment is easy; improved adhesion strength of a plating layer
11/11/2004	US20040224094 Method of forming a silicon oxide layer in a semiconductor manufacturing process
11/11/2004	US20040223238 Forming a silver coating on a vitreous substrate
11/11/2004	US20040222558 Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer
11/11/2004	US20040222103 Process for the direct metal-plating of a plastic substrate
11/11/2004	US20040222100 Process and system for providing electrochemical processing solution with reduced oxygen and gas content
11/11/2004	US20040221812 Method and apparatus for processing materials by applying a controlled succession of thermal spikes or shockwaves through a growth medium
11/11/2004	US20040221765 Polytetrafluoroethylene dispersion for electroless nickel plating applications
11/11/2004	US20040221619 Manufacture of planar waveguides using sol-gel techniques
11/11/2004	DE10317797A1 Production of mold tools for rapid prototyping comprises roughening of the surface without chemical pretreatment, application of an intermediate copper or nickel layer and application of a metallic or ceramic covering by thermal spraying
11/11/2004	DE10317796A1 Object used e.g. as a roller for film, paper, textiles has a boundary layer between a substrate and a metallic layer with a specified a calcium content
11/10/2004	EP1474546A2 High resolution patterning method
11/10/2004	EP1474545A2 Plating device and method
11/10/2004	CN1545728A Semiconductor device, method for manufacturing the same, and plating solution
11/10/2004	CN1544696A Bronze plating additive, method for making same and use in bronze plating on tread band steel wire
11/10/2004	CN1544695A Chemical replacement silver plating additive, method for making same and use thereof
11/10/2004	CN1544694A Process for making copper-plated and nickel-plated wire
11/10/2004	CN1544693A Process for making nickel coated iron belt and dedicated nickel plating apparatus therefor
11/10/2004	CN1544692A Process for preparing tin oxide nanocrystalline thin films
11/10/2004	CN1544691A Preparation of low-resistance / high-resistance composite film through ultrasonic spray pyrolysis
11/10/2004	CN1544690A Process for preparing single crystal silicon substrate surface self-assembly rare earth nano-film
11/10/2004	CN1544689A Multiple sheet large area chemical bath deposition apparatus
11/09/2004	US6815357 Process and apparatus for manufacturing a semiconductor device
11/09/2004	US6815349 Electroless copper deposition apparatus
11/04/2004	WO2004095603A2 Method of producing membrane electrode assemblies
11/04/2004	WO2004094682A2 Improved coating for silver plated circuits
11/04/2004	WO2004040034A3 Method of preparing a solution and application of this solution to prepare functional oxide layers
11/04/2004	WO2004038504A3 Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrication
11/04/2004	US20040219783 Copper dual damascene interconnect technology
11/04/2004	US20040219377 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
11/04/2004	US20040219375 Bonding layer for bonding resin on copper surface
11/04/2004	US20040219374 A nonconductor product is soaked in a solution suspending semiconducting powder and is subjected to light irradiation in the solution so that the polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed
11/04/2004	US20040219372 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
11/04/2004	US20040219298 Substrate processing method and substrate processing apparatus
11/04/2004	DE102004016149A1 Metallbeschichtete Kohlebürste Metal-coated carbon brush
11/04/2004	CA2521079A1 Method of producing membrane electrode assemblies
11/03/2004	CN1543293A Methods for forming wiring and electrode
11/03/2004	CN1542547A Photosensitive resin composition and method for the formation of a resin pattern using the composition
11/03/2004	CN1542164A Method for preventing magnesium and its alloy parts from corrosion and wearing
11/03/2004	CN1542163A Method for preparing corrosion-proof wear-resistant nickel plating coat on the surface of magnesium and its alloy parts
11/03/2004	CN1542073A Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
11/03/2004	CN1542072A Bonding layer for bonding resin on copper surface
11/03/2004	CN1174474C Method for depositing copper on barrier layer
11/03/2004	CN1174473C Process for fabricating layered superlattice material and ABO3 type metal oxide material
11/03/2004	CN1174118C Method for metal plating, pretreating agent, and semiconductor wafer and semiconductor device using same
11/03/2004	CN1173784C Mirror and making method and apparatus for improving silver surface corrosion-resistance
11/02/2004	US6811885 Acid stable aqueous dispersion of metal particles and applications
11/02/2004	US6811828 Mixture of gold compound, reducing agent and water soluble amine
11/02/2004	US6811819 Aqueous alkaline zincate solutions and methods
10/2004
10/28/2004	WO2004092452A1 Two-layer flexible copper-clad laminate and method for manufacturing the two-layer flexible copper-clad laminate
10/28/2004	WO2004092446A1 Process for painting metal parts
10/28/2004	WO2004092445A1 Use of an object as a decorative component
10/28/2004	WO2004092444A2 Use of an object as an electronic component
10/28/2004	WO2004092436A2 Object
10/28/2004	WO2004091907A1 Rapid prototyping process
10/28/2004	WO2004091906A2 Use of an object as shaping tool
10/28/2004	US20040213912 adhering a catalytic metal as electroless plating catalyst onto the insulating body and the conductive pattern, selectively forming a protection film or selectively oxidizing the catalytic metal, electroless plating metal on the conductive pattern; selectivity prevents short-circuiting
10/28/2004	US20040213906 including catalyzed oxidation; brakes and brake components; water, a nonaqueous polar liquid, or a mixture thereof; phosphoric acid or an acid phosphate salt; an aluminum salt; and at least one additional metal salt
10/28/2004	US20040212272 Metal coated carbon brush

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