Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
---|
03/24/1999 | EP0902854A2 Process for making thermally stable metal coated polymeric monofilament or yarn |
03/24/1999 | EP0866735A4 USE OF PALLADIUM IMMERSION DEPOSITION TO SELECTIVELY INITIATE ELECTROLESS PLATING ON Ti AND W ALLOYS FOR WAFER FABRICATION |
03/24/1999 | CN1042658C Method of promoting decomposition of silicon compounds in process for depositing silicon upon metal surface |
03/23/1999 | US5885648 Process for making stoichiometric mixed metal oxide films |
03/23/1999 | US5885462 Process for reducing the concentration of multivalent cations in aqueous solutions |
03/23/1999 | US5884398 Mounting spring elements on semiconductor devices |
03/18/1999 | WO1999013696A1 Method for metallization of a substrate containing electric non-conductive surface areas |
03/17/1999 | EP0865515A4 Electroless deposition of metallic coatings on non-conducting substances |
03/16/1999 | US5882802 Noble metal coated, seeded bimetallic non-noble metal powders |
03/16/1999 | US5882773 Optical coatings of variable refractive index and high laser-resistance from physical-vapor-deposited perfluorinated amorphous polymer |
03/16/1999 | US5882736 palladium layers deposition process |
03/16/1999 | US5882723 Durable electrode coatings |
03/11/1999 | WO1998046806A3 Coating method for elongated metal blanks |
03/11/1999 | DE19738880A1 Method and apparatus for coating a substrate with a metal |
03/09/1999 | US5879811 Oxide thin film having quartz crystal structure |
03/09/1999 | US5879762 Method for forming electromagnetic wave-shielding film on a panel used in a cathode ray tube |
03/09/1999 | CA2102145C Substrate for magnetic disk |
03/04/1999 | WO1999010916A2 Copper electroless deposition on a titanium-containing surface |
03/04/1999 | WO1998055669A3 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same |
03/04/1999 | DE19731346A1 Wiring trace, especially fine structure, adhering firmly to insulating flat or three-dimensional substrate |
03/02/1999 | US5876795 Method for producing a low-stress electrolessly deposited nickel layer |
03/02/1999 | US5876480 Unpolymerized vesicles with a lipid bylayer membrane having a catalytic metal ionically bonded |
03/02/1999 | US5876017 Plumbing fixture carrying drinking water comprised of a copper alloy |
02/25/1999 | WO1999009794A1 The production of three-dimensional printed-circuit boards |
02/25/1999 | WO1999008803A2 Method for forming a metallic film using non-isothermal plasma |
02/25/1999 | DE19736093A1 Production of conductive metallized three-dimensional polymer article |
02/24/1999 | EP0897998A2 Reductive nickel bath |
02/24/1999 | EP0897901A1 Solution for forming ferroelectric film and method for forming ferroelectric film |
02/24/1999 | EP0897759A2 Process for imparing a metal appearance to articles |
02/24/1999 | EP0843597A4 Electroless plating of a metal layer on an activated substrate |
02/24/1999 | EP0706678B1 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material |
02/23/1999 | US5874154 For subsequent plating of metals from an electroless plating bath, improved adhesion and etchability, for electronic components |
02/23/1999 | US5874125 Activating catalytic solution for electroless plating and method of electroless plating |
02/23/1999 | CA2136022C A method and an apparatus for precipitation coating of internal surfaces in tanks and pipe systems |
02/17/1999 | CN1208442A Removal of orthophosphite ions from electroless nickel plating baths |
02/17/1999 | CN1208368A Fabricating interconnects and tips using sacrificial substrates |
02/16/1999 | US5871853 Metal oxide crystal for thin film capacitors |
02/16/1999 | US5871816 Metallized textile |
02/16/1999 | US5871810 Plating on nonmetallic disks |
02/11/1999 | WO1998046805A3 Method of deposition of a metal on a metal surface and the product thereof |
02/10/1999 | EP0895508A1 Process for producing tungsten oxide |
02/09/1999 | US5869141 Surface pretreatment for sol coating of metals |
02/09/1999 | US5869140 Degreasing, cleaning with alkaline cleaner, etching with alkaline etchant, desmutting with solution containing nitric acid, sulfuric acid, ammonium bifluoride |
02/09/1999 | CA1340386C Selective catalytic activation of polymeric films |
02/04/1999 | WO1999005895A1 Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same |
02/04/1999 | WO1999005712A1 Process for fabricating layered superlattice materials and abo3, type metal oxides and making electronic devices including same without exposure to oxygen |
02/03/1999 | EP0894156A1 Removal of orthophosphite ions from electroless nickel plating baths |
02/03/1999 | EP0894155A1 Composition and process for fabricating metal oxide films |
02/02/1999 | US5866202 Fine particles of amino resin |
02/02/1999 | US5865894 Megasonic plating system |
02/02/1999 | US5865881 Mixture of potassium iridium chloride and reducing agents |
02/02/1999 | US5864946 Method of making contact tip structures |
01/28/1999 | WO1999004421A1 Method for fabricating thin films of barium strontium titanate |
01/26/1999 | US5864425 Nickel phosphorus alloy adhesion layer between gold and silica; for optical fibers |
01/26/1999 | US5863836 Method of depositing thin metal films |
01/26/1999 | US5863616 Non-ionic stabilizers in composite electroless plating |
01/26/1999 | US5863615 Plating jig and plating method using the plating jig |
01/26/1999 | US5863603 Bathless electroless deposition of metal film on a substrate surface in a controlled environment using liquid organometallic compound and a reducing agent |
01/21/1999 | WO1999002762A1 Method for applying a coating to a metal substrate or repairing a coating applied to the same |
01/21/1999 | WO1999002452A1 Composition and method for reducing copper oxide to metallic copper |
01/21/1999 | CA2291096A1 Method for applying a coating to a metal substrate or repairing a coating applied to the same |
01/20/1999 | EP0891631A1 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits |
01/20/1999 | CN2304664Y Sealor for chemico-plating |
01/15/1999 | CA2242524A1 Production of thick ceramic films by metal organic decomposition |
01/14/1999 | DE19729891A1 Equipment modifying plastic surfaces using accelerated silicon carbide grit blaster followed by plasma treatment |
01/13/1999 | EP0890980A2 Method of making integrated circuit capacitors |
01/13/1999 | EP0890658A2 Megasonic plating system |
01/13/1999 | CN1204701A Zinc-tin alloy special plating solution and manufacturing method thereof |
01/13/1999 | CN1204699A Carbon nanometer pipe high wear-resistant compound cladding material on metal surface and preparation method thereof |
01/12/1999 | US5859273 Succinic acid derivative degradable chelants, uses and compositions thereof |
01/12/1999 | US5858460 Metal matrices reinforced with silver coated boron carbide particles |
01/12/1999 | US5858457 Process to form mesostructured films |
01/12/1999 | US5858073 Adding water soluble nickel salt to bath containing phosphite ions to precipitate nickel phosphite, adding sulfuric acid and, optionally, sodium sulfate to convert nickel phosphite to nickel sulfate; regenerating and reusing plating bath |
01/07/1999 | DE19824139A1 Metal coating article of elastomeric material dispersed in poly:phthalamide |
01/07/1999 | DE19728054A1 Oxidation and temperature resistant steel tube |
01/06/1999 | CN1204272A Palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication |
01/05/1999 | US5855993 Electronic devices having metallurgies containing copper-semiconductor compounds |
01/05/1999 | US5855959 Process for providing catalytically active platinum metal layers |
12/30/1998 | WO1998059091A2 Activation bath for electroless nickel plating |
12/30/1998 | EP0887394A1 Method for producing water-repellent articles |
12/30/1998 | EP0886894A2 Contact carriers (tiles) for populating larger substrates with spring contacts |
12/30/1998 | EP0886629A1 Method for the colouring of ceramic surfaces |
12/29/1998 | US5854060 Determining biodegradability of aspartic acid derivatives, degradable chelants, uses and compositions |
12/29/1998 | US5853808 Method of using siloxane polymers |
12/29/1998 | US5853500 Method for fabricating thin films of barium strontium titanate without exposure to oxygen at high temperatures |
12/29/1998 | US5852871 Method of making raised contacts on electronic components |
12/23/1998 | EP0885315A1 Misted precursor deposition apparatus and method with improved mist and mist flow |
12/16/1998 | EP0883699A1 Method and devices for the electrolytic formation of a deposit on an assembly of selected electrodes |
12/15/1998 | US5849170 Electroless/electrolytic methods for the preparation of metallized ceramic substrates |
12/15/1998 | US5849110 Sol coating of metals |
12/15/1998 | US5849071 Liquid source formation of thin films using hexamethyl-disilazane |
12/10/1998 | WO1998055669A2 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same |
12/10/1998 | DE19723734A1 Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial, insbesondere feine Leiterbahnstrukturen, und Verfahren zu ihrer Herstellung Conductor track structures on a non-conductive carrier material, in particular fine conductor track structures, and processes for their preparation |
12/08/1998 | US5846925 Succinic acid derivative degradable chelants, uses and compositions thereof |
12/08/1998 | US5846665 Method for electroplating high-impact plastics |
12/08/1998 | US5846615 Direct deposition of a gold layer |
12/08/1998 | US5846606 Process for the production of metallized materials |
12/08/1998 | US5846598 Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating |
12/08/1998 | US5846597 Liquid source formation of thin films using hexamethyl-disilazane |
12/03/1998 | WO1998054378A1 Non-electro-plating method for metallizing a substrate by reduction process of metallic salt(s) and aerosol splattering |