Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09K - Materials for applications not otherwise provided for; Applications of materials not otherwise provided for › C09K 13 - Etching, surface-brightening or pickling compositions
Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392)
01/2009
01/01/2009US20090001339 Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
01/01/2009US20090001315 Alkaline aqueous solution composition used for washing or etching substrates
01/01/2009US20090001314 aqueous acidic solution for cleaning the surface of a semiconductor wafer to remove photoresist material and dielectric trimethylsilane or dimethylsilane material to render an oxide-free substrate; comprising hydrofluoric acid, ammonium fluoride and citric acid, acetic acid; without leave gummy residues
01/01/2009US20090001051 Slurry compositions for polishing metal, methods of polishing a metal object and methods of forming a metal wiring using the same
12/2008
12/31/2008EP1475822B1 Cleaning gas and etching gas
12/30/2008US7470628 Etching dielectrics using fluorohydrocarbon gas mixture; integrated circuits will free of defects due to photoresist mask misalignment, performed at low power; etching of semiconductor contact holes through insulating oxide layers
12/30/2008US7470623 Method of forming a platinum pattern
12/25/2008US20080318427 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
12/25/2008US20080315193 Oxide-based thin film transistor, method of fabricating the same, zinc oxide etchant, and a method of forming the same
12/25/2008US20080315154 Polishing fluids and methods for cmp
12/25/2008US20080315153 Polishing fluids and methods for cmp
12/25/2008US20080314872 Chemical-Mechanical Polishing Compositions Containing Aspartame And Methods Of Making And Using The Same
12/24/2008EP2006892A1 An acid corrosion soluton for preparing polysilicon suede and the applied method of it
12/24/2008DE20321702U1 Vorrichtung zum Texturieren von Oberflächen von Silizium-Scheiben Apparatus for texturing surfaces of silicon wafers
12/24/2008CN101331595A Microetching composition and method of using the same
12/24/2008CN101331195A Fluorinated surfactants
12/24/2008CN101328409A Oxide-based thin film transistor, zinc oxide etchant, and a method of forming the same
12/17/2008CN101326262A In situ fluoride ion-generating compositions and uses thereof
12/11/2008DE102005037335B4 Rückstandsfrei abnehmbares Beizmittel Cleanly removable mordant
12/10/2008CN101319172A Alkaline aqueous solution composition used for washing or etching substrates
12/04/2008WO2008145098A2 Method for the wet-chemical etching of tio2 thin-films and tio2 particles and etching reagent
12/04/2008US20080299741 Etching solution, method of surface modification of semiconductor substrate and method of forming shallow trench isolation
11/2008
11/27/2008WO2008144501A2 New antioxidants for post-cmp cleaning formulations
11/27/2008US20080292877 Method of Cleaning Gaas Substrate, Method of Producing Gaas Substrate, Method of Fabricating Epitaxial Susbstrate, and Gaas Wafer
11/27/2008US20080290317 Pyrogenically prepared silicon dioxide with a low thickening effect
11/25/2008US7456140 Stripping formulation for photoresists containing ammonium difluoride or ammonium fluoride, a sulfone or sulfoxide solvent and a basic amine
11/25/2008US7456114 Microetching composition and method of using the same
11/20/2008US20080286701 bidentate or tridentate copper complexants such as amino acids, aminophosphonic acids, di-and tricarboxylic acids, di-and triphosphonic acids, carboxyphosphonic acids; peroxy compound, buffer, ing compounds, peroxide stabilizer, and water; semiconductors; packaging
11/20/2008US20080283796 Compositions for Dissolution of Low-K Dielectric Films, and Methods of Use
11/20/2008US20080283502 Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates
11/19/2008EP1991637A2 Selective removal chemistries for semiconductor applications, methods of production and uses thereof
11/19/2008CN101307455A Cleaning brightener for metal ornaments and method for preparing same
11/19/2008CN100435292C Non-selective etched process for GaAs/AlGaAs crystal material
11/19/2008CN100434568C Corrosion liquid for InGaP/ AIGaInP crystal material
11/18/2008US7452481 Polishing slurry and method of reclaiming wafers
11/13/2008US20080277381 Etching Solutions
11/11/2008US7449127 Cleaning method and solution for cleaning a wafer in a single wafer process
11/06/2008WO2008134412A1 Selective etch of tiw for capture pad formation
11/06/2008WO2008132926A1 Etching solution, and method for metallization of plastic surface employing the method
11/06/2008WO2008080096A3 Compositions and methods for the selective removal of silicon nitride
11/06/2008US20080274618 Removal silicon in preference to silica in semiconductor manufacturing aqueous dispersion containing ceria abrasive; adjusting pH with acid; adding polyethylenimine
11/06/2008US20080274334 Dry Etching Gas and Method of Dry Etching
11/06/2008US20080272088 Polishing compound and polishing method
11/06/2008CA2685275A1 Polysilicon planarization solution for planarizing low temperature polysilicon thin film panels
11/05/2008EP1828070A4 Selective high dielectric constant material etchant
11/05/2008CN101298322A Purification of phosphoric acid rich streams
10/2008
10/30/2008US20080268652 Solution used in the fabrication of a porous semiconductor material, and a method of fabricating said material
10/30/2008US20080265205 Polishing Composition
10/30/2008US20080264898 SELECTIVE ETCH OF TiW FOR CAPTURE PAD FORMATION
10/28/2008US7442652 Method for removing contamination and method for fabricating semiconductor device
10/28/2008US7442324 Etching reagent, and method for manufacturing electronic device substrate and electronic device
10/28/2008US7442323 Potassium monopersulfate solutions
10/23/2008US20080261400 Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit
10/22/2008EP1982670A1 Process for providing a topography to the surface of a dental implant
10/22/2008CN101289625A Production process of dipping agent bitumen
10/16/2008US20080254629 Composition and method used for chemical mechanical planarization of metals
10/15/2008EP1980607A1 Solution used in the production of a porous semi-conductor material and method of manufacturing said material
10/14/2008US7435356 For polishing metal interconnects on semiconductor wafers in the presence of dielectrics and barrier materials; oxidizer, an inhibitor for the nonferrous metal, water soluble modified cellulose, phosphorus compound, dodecylmercaptan-trminated acrylic acid block copolymer
10/09/2008US20080248653 Includes PF3 and oxidizing agent; uniformly removing the late transition metal structure or its portion with increased etch rate and decreased etch temperature
10/08/2008EP1620881B1 Method for texturing surfaces of silicon wafers
10/02/2008US20080242091 Mixture of tetrazole compound and abrasive grains with oxidizer
10/02/2008US20080242090 Metal-polishing liquid and polishing method
10/02/2008US20080242061 Precursor gas mixture for depositing an epitaxial carbon-doped silicon film
10/02/2008US20080237535 Fumed silica particles produced by wet grinding having a specific surface area of 50 to 200 m2/g, an average particle diameter of 10 to 50 nm, and an average ratio A/B of the major axis A to the minor axis B of the fumed silica particles of 1.2 to 2.0
10/02/2008DE102007015085A1 Verfahren zur Entfernung von Korrosionsschichten A process for the removal of corrosion layers
10/01/2008EP1974370A2 Microetching composition and method of using the same
10/01/2008EP1366510B1 Ruthenium silicide wet etch
09/2008
09/25/2008US20080230741 Polishing inhibiting layer forming additive
09/24/2008EP1689825A4 Removal of mems sacrificial layers using supercritical fluid/chemical formulations
09/23/2008US7427361 Chemical mechanical polishing slurry for semiconductors
09/18/2008US20080227296 Acidic aqueous solution, amphoteric surfactant/corrosion inhibitor; glycol selected from diethylene glycol, ethylene glycol, and polyoxyethylene glycol; hydrogen peroxide, benzoyl peroxide, barium peroxide, calcium peroxide or sodium peroxide; applied to tungsten layer
09/18/2008US20080224093 a mixture of phosphoric acid, nitric acid, acetic acid, water and a stabilizer agent comprising a metal oxyhydride inorganic acid
09/18/2008US20080224092 Etchant for metal
09/18/2008US20080223819 Method and etchant for removing glass-coating from metal wires
09/11/2008US20080217576 Etching Media for Oxidic, Transparent, Conductive Layers
09/11/2008DE102008010038A1 Verfahren zum Verbessern der Haftung zwischen einer Formgedächtnislegierung und einem Polymer A method for improving the adhesion between a shape memory alloy and a polymer
09/10/2008EP1966410A2 Ultrapure colloidal silica for use in chemical mechanical polishing applications
09/10/2008CN101263582A Process and system for etching doped silicon using SF6 based chemistry
09/04/2008US20080214006 Including amino phosphonates, polyamines and/or polycarboxylic acids in aqueous oxide and metal etchant solution
09/04/2008US20080214002 Cleaning solution and manufacturing method for semiconductor device
09/04/2008US20080210900 Selective Wet Etchings Of Oxides
09/04/2008US20080210660 Medium For Etching Oxidic, Transparent, Conductive Layers
09/03/2008EP1963444A1 Fluorinated surfactants
08/2008
08/28/2008US20080206995 Metal-polishing liquid and polishing method therewith
08/28/2008US20080203354 Polishing liquid
08/28/2008US20080203353 Dry-etching gas for semiconductor process
08/26/2008US7417167 Process for producing carbonyl difluoride
08/26/2008US7416681 Etching solution for multiple layer of copper and molybdenum and etching method using the same
08/26/2008US7416680 a mixture of carrier fluids, colloidal particles, etchants and surfactants comprising sodium octyl sulfate, used for cleaning or polishing glass or ceramic disks used in data storage devices
08/21/2008WO2008098593A1 Titanium etchant composition
08/21/2008WO2007136549A3 Composition for treatment of roadway
08/21/2008US20080200036 Manufacturing solar cells; forming extremely fine structures selectively without damaging or attacking adjacent areas; simple, low cost
08/21/2008US20080197112 Chemical assisted lapping and polishing of metals
08/20/2008EP1957609A1 In situ fluoride ion-generating compositions and uses thereof
08/20/2008EP1576072B1 Aqueous phosphoric acid compositions for cleaning semiconductor devices
08/20/2008EP1572833B1 Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal
08/14/2008US20080191163 Laser-Assisted Etching Using Gas Compositions Comprising Unsaturated Fluorocarbons
08/13/2008CN101243159A Improved microetching solution
08/13/2008CN100411113C Etching method, method of manufacturing semiconductor device, and semiconductor device
08/13/2008CN100410357C Cleaning composition for semiconductor components and process for manufacturing semiconductor device
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