| Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392) |
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| 05/20/2004 | US20040097091 Gas for removing deposit and removal method using same |
| 05/20/2004 | US20040094510 Fluorinated surfactants for aqueous acid etch solutions |
| 05/19/2004 | CN1497066A Wet chemical processing method and device of silicon |
| 05/13/2004 | US20040089840 Fluorinated surfactants for buffered acid etch solutions |
| 05/13/2004 | DE10026030B4 Ätzverfahren, seine Anwendung und Ätzmittel Etching method, its application and abrasives |
| 05/12/2004 | CN1495865A Etching liquid reproducing method, etching method and system |
| 05/06/2004 | DE10248481A1 Process for the wet chemical treatment of silicon, e.g. wafers, comprises using an etching liquid containing water, nitric acid and hydrofluoric acid |
| 05/04/2004 | US6730239 Ethylene oxide-propylene oxide copolymer and an etherified eo-po copolymer in a water solution with a hydroxide |
| 04/28/2004 | EP1413650A1 Metal surface protection film forming agent and application thereof |
| 04/28/2004 | EP1412453A1 Process for removing contaminant from a surface and composition useful therefor |
| 04/27/2004 | US6727178 Etchant and method of etching |
| 04/22/2004 | US20040077168 Etchant and method for fabricating a semiconductor device using the same |
| 04/22/2004 | US20040075078 Method for producing highly pure solutions using gaseous hydrogen fluoride |
| 04/20/2004 | US6723394 Aligned polymers for an organic TFT |
| 04/15/2004 | WO2004032218A1 Etching pastes for silicon surfaces and layers |
| 04/15/2004 | WO2003107400A3 Acid etching mixture having reduced water content |
| 04/15/2004 | US20040072444 Etchant for wire, method of manufacturing wire using etchant, thin film transistor array panel including wire and manufacturing method thereof |
| 04/15/2004 | US20040072439 Chemical mechanical polishing composition and process |
| 04/15/2004 | US20040072437 Production method for silicon wafer and silicon wafer and soi wafer |
| 04/14/2004 | CN1489783A Method for manufacturing silicon swfer, silicon wafer and SOI wafer |
| 04/08/2004 | WO2004030062A1 Polishing compound composition, method for producing same and polishing method |
| 04/08/2004 | WO2004030041A2 High selectivity and high planarity dielectric polishing |
| 04/07/2004 | CN1487987A Azeotrope-like composition of 1,2,2-trichloro-1,3,3,3-tetrafluoropropane and hydrogen fluoride |
| 04/07/2004 | CN1487051A Oil-keeping treating agent, oil-keeping treating method and treated colck and watch by the same method |
| 04/07/2004 | CN1145203C Cleaning agent for semiconductor device and manufacturing method of semiconductor device |
| 04/01/2004 | US20040063326 Semiconductor etching paste and the use thereof for localized etching of semiconductor substrates |
| 04/01/2004 | US20040061092 Wet etch for selective removal of alumina |
| 04/01/2004 | US20040060502 Slurry for chemical mechanical polishing comprising bulk solution, plurality of particles and self-assembling adsorption additive of zwitterionic, anionic, nonionic, or cationic surfactant; semiconductors |
| 03/31/2004 | EP1403907A1 Regeneration process of etching solution, etching process, and etching system |
| 03/25/2004 | WO2004025718A1 Etchant and etching method |
| 03/18/2004 | DE10241300A1 Etching for silicon surfaces and layers, used in photovoltaic, semiconductor and high power electronics technology, for producing photodiode, circuit, electronic device or solar cell, is thickened alkaline liquid |
| 03/11/2004 | WO2004020551A1 Etching pastes for titanium oxide surfaces |
| 03/11/2004 | US20040048486 Method for roughening copper surfaces for bonding to substrates |
| 03/11/2004 | US20040046148 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| 03/11/2004 | US20040045930 Method for etching |
| 03/11/2004 | US20040045830 Compositions and processes for format flexible, roll-to-roll manufacturing of electrophoretic displays |
| 03/11/2004 | DE10239656A1 Ätzpasten für Titanoxid-Oberflächen Etching pastes for titanium oxide surfaces |
| 03/10/2004 | EP1396557A1 Metal cleaning composition and process |
| 03/10/2004 | CN1141207C Manufacturing method of antiskid brick |
| 03/09/2004 | US6703319 Compositions and methods for removing etch residue |
| 03/03/2004 | CN1479773A Liquid crystal polymers for flexible circuits |
| 03/03/2004 | CN1478745A Ground processing method of fish scale veins on surface of glass container |
| 02/26/2004 | US20040035354 Process for removing contaminant from a surface and composition useful therefor |
| 02/25/2004 | EP1390134A2 Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| 02/24/2004 | US6696163 Liquid crystal polymers for flexible circuits |
| 02/19/2004 | US20040033366 Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| 02/05/2004 | US20040020134 Cmp slurry composition and a method for planarizing semiconductor device using the same |
| 02/04/2004 | EP1386351A1 Method of wet etching a silicon and nitrogen containing material |
| 02/04/2004 | EP1386350A1 Method of wet etching an inorganic antireflection layer |
| 01/29/2004 | WO2004009730A1 Composition and process for wet stripping removal of sacrificial anti-reflective material |
| 01/29/2004 | US20040016904 Composition and process for wet stripping removal of sacrificial anti-reflective material |
| 01/28/2004 | EP1383939A1 Use of perfluoroketones as vapor reactor cleaning, etching, and doping gases |
| 01/22/2004 | US20040014318 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten |
| 01/22/2004 | US20040012089 Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications |
| 01/21/2004 | EP1381656A1 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| 01/15/2004 | WO2004005211A1 Compositions for removing etching residue and use thereof |
| 01/14/2004 | CN1468446A Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| 01/13/2004 | US6677286 Water, solvent, dicarboxylic acid, base, and source of fluoride; cleaning compound for microelectronics |
| 01/13/2004 | US6676484 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 01/07/2004 | EP1378947A1 Semiconductor etching paste and the use thereof for localised etching of semiconductor substrates |
| 01/07/2004 | CN1133600C Selective etching of silicate |
| 01/06/2004 | US6673262 Comprising hypofluorite which dissociates more easily than, for example, each of cf4, c2f6, c4f8, and nf3 |
| 12/31/2003 | WO2004000972A1 An etchant for a wiring, a method for manufacturing the wiring using the etchant, a thin film transistor array panel including the wiring, and a method for manufacturing the same |
| 12/31/2003 | CN1132795C Frosting chemical for silicate glass |
| 12/30/2003 | US6669857 Etching solution containing from fluoride source, nitric acid, water is contacted with substrate having bismuth-oxide containing film so as to etch oxide film; removing etching solution from substrate |
| 12/25/2003 | US20030235996 Non-corrosive cleaning compositions for removing etch residues |
| 12/25/2003 | US20030235986 Silicon oxide etching compositions with reduced water content |
| 12/24/2003 | WO2003107400A2 Acid etching mixture having reduced water content |
| 12/18/2003 | WO2003104350A1 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method |
| 12/18/2003 | US20030230548 Etching a silicon substrate using an aqueous acid mixture comprising hydrofluoric acid, reducing water content by adding fluorosulfonic acid, controlling the concentration of hydrogen fluoride |
| 12/17/2003 | CN1131125C Composition and slurry used for metal CMP |
| 12/09/2003 | US6660639 Method of fabricating a copper damascene structure |
| 12/09/2003 | US6660632 Applying amorphous film of metal complex to substrate, converting to metal or its oxides by thermal, photochemical or electron beam irradiation |
| 12/04/2003 | US20030222241 Removing organometallic and organosilicate residues remaining after a dry etch process from semiconductor substrates. The substrate is exposed to a conditioning solution of phosphoric acid, hydrofluoric acid, and a carboxylic acid, such as acetic |
| 12/03/2003 | EP1366510A2 Ruthenium silicide wet etch |
| 12/02/2003 | US6656895 For removing a photoresist; for removing a residue of a semiconductor element generated in semiconductor treatment |
| 12/02/2003 | US6656022 Abrasive grains having remained after polishing are easily removed |
| 12/02/2003 | US6656021 Process for fabricating a semiconductor device |
| 11/26/2003 | CN1128852C Preparation of asphalt soaker resulting in high charcoal yield |
| 11/25/2003 | US6653267 Compound having a heterocycle (preferably quinaldic acid, benzotriazole or benzimidazole), surfactant and an oxidizing agent |
| 11/25/2003 | US6652981 Etching process for making electrodes |
| 11/20/2003 | US20030216042 CMP slurry for oxide film and method of forming semiconductor device using the same |
| 11/13/2003 | US20030211747 Shallow trench isolation polishing using mixed abrasive slurries |
| 11/13/2003 | US20030209514 Etching composition and use thereof with feedback control of HF in BEOL clean |
| 11/12/2003 | EP1360077A1 Compositions for cleaning organic and plasma etched residues for semiconductor devices |
| 11/12/2003 | CN1127552C Soaking solution and its preparation |
| 11/11/2003 | US6645051 Water, ethylene oxide-propylene oxide copolymer, acid and abrasive; uniform smoothing of edges and flat surface of magnetic disks |
| 11/06/2003 | WO2003091796A1 Compositions and processes for format flexible, roll-to-roll manufacturing of electrophoretic displays |
| 11/06/2003 | WO2003091377A1 Non-corrosive cleaning compositions for removing etch residues |
| 11/06/2003 | US20030207513 Etchant and method of etching |
| 11/06/2003 | US20030205689 Aqueous mixture of chlorine- and fluorine-containing chemicals, especially hydrofluoric acid and potassium hypochlorite; the mixture reacts with the ruthenium silicide to produce water-soluble reaction products. |
| 11/05/2003 | CN1453829A Etching agent and etching method |
| 11/05/2003 | CN1453620A Component and method for producing electrophoretic display device by specification diverSified roller-to-roller |
| 11/05/2003 | CN1127121C Detergent for producing process of semiconductor device or liquid crystal device |
| 10/30/2003 | US20030203635 Polishing composition for metal CMP |
| 10/30/2003 | US20030203624 Manufacturing method of semiconductor device |
| 10/23/2003 | WO2002071447A8 Ruthenium silicide wet etch |
| 10/22/2003 | EP1354018A2 Azeotrope-like composition of 1,2,2-trichloro-1,3,3,3-tetrafluoropropane and hydrogen fluoride |
| 10/22/2003 | EP1354017A2 Ready-to-use stable chemical-mechanical polishing slurries |
| 10/22/2003 | EP0835333B9 Pickling solution used for removing scales on iron-based alloys |