| Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392) |
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| 02/02/2006 | US20060021974 Method and composition for polishing a substrate |
| 02/02/2006 | US20060021972 Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride |
| 02/01/2006 | EP1620881A1 Method for texturing surfaces of silicon wafers |
| 02/01/2006 | CN1729269A Aqueous phosphoric acid compositions for cleaning semiconductor devices |
| 02/01/2006 | CN1727436A Chemical method for etching insulating-film for flexible printed circuit, and etching solution |
| 02/01/2006 | CN1727435A Cement dipping liquid in use for anchor pole made from glass fiber reinforced plastic |
| 01/26/2006 | US20060016785 Composition for removing photoresist and/or etching residue from a substrate and use thereof |
| 01/25/2006 | CN1238442C Resin material for decoration and swellant for deterging and eliminating the resin material |
| 01/24/2006 | US6989108 Etchant gas composition |
| 01/24/2006 | US6989088 Perfluorocyclicamine, constant boiling composition and process for producing the same |
| 01/19/2006 | US20060011588 Silicon wafer etching process and composition |
| 01/19/2006 | US20060011584 Etchant and etching method |
| 01/19/2006 | US20060011579 Etchant composed of a carrier gas; CH2F2; CF4; and C4F6 and/or C5F8; good selectivity to both nitrides and field oxides; integrated circuits produced using these etchants are less likely to be defective due to photoresist mask misalignment |
| 01/18/2006 | CN1721052A Waterpower liquid |
| 01/18/2006 | CN1236845C Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods thereof |
| 01/17/2006 | US6986358 Contacting the surface with tris(hydroxymethyl)phosphine or tetrakis(hydroxymethyl)phosphonium salt and an amine, ammonium derivative, or ammonia in the presence of an aqueous solvent |
| 01/12/2006 | US20060009136 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 01/12/2006 | US20060009004 Method of forming trench isolation within a semiconductor substrate |
| 01/12/2006 | US20060006142 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry |
| 01/11/2006 | CN1720313A Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
| 01/11/2006 | CN1718672A Saturant for friction material containing friction modifying layer |
| 01/05/2006 | US20060003675 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 01/05/2006 | US20060000808 Polishing solution of metal and chemical mechanical polishing method |
| 12/29/2005 | US20050284844 Cleaning composition for semiconductor components and process for manufacturing semiconductor device |
| 12/28/2005 | EP1609847A1 Cleaning composition for semiconductor components and process for manufacturing semiconductor device |
| 12/28/2005 | CN1712506A Cleaning composition for semiconductor components and process for manufacturing semiconductor device |
| 12/22/2005 | US20050282387 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method |
| 12/22/2005 | US20050279253 Resin surface treating agent and resin surface treatment |
| 12/21/2005 | EP1607435A1 Treatment of resin surfaces with aqueous Cerium solutions |
| 12/21/2005 | CN1709949A Resin surface treating agent and resin surface treatment |
| 12/15/2005 | DE102005004401A1 Korrosionshemmende Reinigungszusammensetzungen für Metallschichten und Muster an Halbleitersubstraten The corrosion inhibiting compositions for cleaning metal layers and patterns on semiconductor substrates |
| 12/14/2005 | EP0852615B1 Chemical mechanical polishing composition and process |
| 12/13/2005 | US6974970 Semiconductor device |
| 12/08/2005 | US20050269295 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
| 12/07/2005 | CN1705733A Slurry for chemical-mechanical polishing copper damascene structures |
| 12/07/2005 | CN1230491C Preparing method for dipping solution |
| 12/07/2005 | CN1230480C Polishing composition and polishing method of substrate for memory and hard disk |
| 12/01/2005 | US20050266689 Chemical mechanical polishing composition and process |
| 12/01/2005 | US20050263739 Method and composition to decrease iron sulfide deposits in pipe lines |
| 12/01/2005 | US20050263489 Ruthenium silicide wet etch |
| 12/01/2005 | US20050263483 Modifying the viscosity of etchants |
| 11/24/2005 | US20050261152 Cleaning composition |
| 11/23/2005 | EP1383939B1 Use of perfluoroketones as vapor reactor cleaning, etching, and doping gases |
| 11/22/2005 | US6967169 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| 11/16/2005 | CN1696349A Etching liquid for removing oxyde film, and its prepn. method and method of mfg. semiconductor device |
| 11/10/2005 | US20050247674 Etching pastes for silicon surfaces and layers |
| 11/09/2005 | CN1694940A Fluorinated surfactants for aqueous acid etch solutions |
| 11/09/2005 | CN1694939A Fluorinated surfactants for buffered acid etch solutions |
| 11/03/2005 | US20050245091 Passivation for cleaning a material |
| 11/02/2005 | CN1690183A Cleaning solution and manufacturing method for semiconductor device |
| 11/02/2005 | CN1690120A Resin compositions with high vibration damping ability |
| 10/27/2005 | US20050236367 Methylbenzyl alcohol or N-methylpyrrolidone, a low molecular weight aliphatic alcohol, isoproyl alcohol, or lactone, and water; removing the strippable layers |
| 10/27/2005 | US20050236362 Cleaning solution and manufacturing method for semiconductor device |
| 10/27/2005 | DE102005012356A1 Wet-etch composition for manufacturing e.g. electrode of a capacitor for semiconductor device comprises peracetic acid and fluorinated acid |
| 10/20/2005 | WO2005098921A1 Alkaline etchant for controlling surface roughness of semiconductor wafer |
| 10/20/2005 | WO2005096747A2 Highly selective silicon oxide etching compositions |
| 10/20/2005 | US20050233578 Method and composition for polishing a substrate |
| 10/20/2005 | US20050230354 Method and composition of post-CMP wetting of thin films |
| 10/13/2005 | US20050227473 Etching composition and method for etching a substrate |
| 10/13/2005 | US20050224459 Etching solution, etched article and method for etched article |
| 10/12/2005 | CN1682355A Etchant and etching method |
| 10/12/2005 | CN1682354A Polishing compound composition, method for producing same and polishing method |
| 10/06/2005 | WO2005093009A1 Etched dielectric film in microfluidic devices |
| 10/06/2005 | US20050218373 Etching methods |
| 10/06/2005 | US20050218372 Modifying the viscosity of etchants |
| 10/06/2005 | DE102005012608A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method |
| 10/05/2005 | CN1679147A Etching pastes for silicon surfaces and layers |
| 10/05/2005 | CN1679146A Acid etching mixture having reduced water content |
| 10/05/2005 | CN1678714A Etching pastes for titanium oxide surfaces |
| 10/05/2005 | CN1676563A Compositions and methods for chemical mechanical planarization of tungsten and titanium |
| 10/05/2005 | CN1221632C Dipping solution and preparing method thereof |
| 09/29/2005 | WO2005091347A1 SiN FILM SELECTIVE ETCHING SOLUTION AND ETCHING METHOD |
| 09/29/2005 | WO2005091070A1 Surface treating agent for substrate for use in lithography |
| 09/29/2005 | US20050215446 Mixture of fluorine compound, amine compound and chelate compound in aqueous solution; semiconductor wafer cleaning compound |
| 09/29/2005 | US20050214449 Solvent swell for texturing resinous material and desmearing and removing resinous material |
| 09/29/2005 | US20050211952 Compositions and methods for chemical mechanical planarization of tungsten and titanium |
| 09/29/2005 | US20050211672 Etch-processing apparatus |
| 09/29/2005 | US20050211375 Method of manufacturing a semiconductor device |
| 09/28/2005 | CN1673862A Etching composition and method for etching a substrate |
| 09/22/2005 | US20050209119 Etching liquid composition |
| 09/22/2005 | US20050205837 Polishing composition and polishing method |
| 09/22/2005 | US20050205836 Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method |
| 09/22/2005 | US20050205515 Process for producing structural body and etchant for silicon oxide film |
| 09/21/2005 | EP1576072A2 Aqueous phosphoric acid compositions for cleaning semiconductor devices |
| 09/21/2005 | EP1055016A4 Method for etching |
| 09/21/2005 | CN1671821A Composition and process for wet stripping removal of sacrificial anti-reflective material |
| 09/21/2005 | CN1670115A Polishing composition and polishing method |
| 09/21/2005 | CN1670114A Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method |
| 09/20/2005 | US6946402 Fabricating method of polycrystalline silicon thin film transistor with improved electrical characteristics |
| 09/15/2005 | WO2005086551A1 Etching solution, method of etching and printed wiring board |
| 09/15/2005 | US20050202987 Stripping formulation for photoresists containing ammonium difluoride or ammonium fluoride, a sulfone or sulfoxide solvent and a basic amine |
| 09/15/2005 | US20050199588 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 09/14/2005 | EP1572833A1 Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal |
| 09/14/2005 | EP1501916A4 Non-corrosive cleaning compositions for removing etch residues |
| 09/14/2005 | EP1337601A4 Slurry for chemical-mechanical polishing copper damascene structures |
| 09/09/2005 | WO2005083685A1 Etched dielectric film in hard disk drives |
| 09/09/2005 | CA2557127A1 Etched dielectric film in hard disk drives |
| 09/08/2005 | US20050194565 Polishing compound, its production process and polishing method |
| 09/08/2005 | US20050194564 Remove titanium thin film formed on a semiconductor wafer; acidic aqueous solution of sodium fluoride, trivalent titanium or divalent iron ions, copper corrosion inhibitor; high etching rate for titanium while suppressing corrosion of solder alloy, tin |
| 09/07/2005 | EP1354017A4 Ready-to-use stable chemical-mechanical polishing slurries |