Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392) |
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08/12/2010 | US20100203729 Composition for chemical mechanical polishing |
08/12/2010 | US20100200802 Oxidation-stabilized cmp compositions and methods |
08/11/2010 | CN101331595B Microetching composition and method of using the same |
08/05/2010 | WO2010086745A1 Method of etching lanthanum-containing oxide layers |
08/05/2010 | US20100197201 Polishing liquid for metal and method of polishing |
08/05/2010 | US20100193728 Chemical Mechanical Polishing Composition |
08/05/2010 | US20100193470 Polishing composition for nickel-phosphorous memory disks |
08/04/2010 | CN101796160A Copper CMP composition containing ionic polyelectrolyte and method |
08/04/2010 | CN101792667A Low tension ITO etchant |
08/04/2010 | CN101235290B Acidic etching liquid |
07/29/2010 | WO2010084213A1 Means, process and device for superficial treatment of surfaces of parts of gold or alloys thereof |
07/29/2010 | US20100190339 Compositions and methods for chemical-mechanical polishing of phase change materials |
07/29/2010 | US20100187470 Fine cerium oxide powder and preparing method the same and cmp slurry comprising the same |
07/27/2010 | CA2690697A1 Selective etching and formation of xenon difluoride |
07/22/2010 | US20100184292 Systems, methods and slurries for chemical-mechanical rough polishing of gaas wafers |
07/22/2010 | US20100184291 Aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method |
07/22/2010 | US20100181525 Compositions comprising silane modified metal oxides |
07/21/2010 | EP2207756A1 Etching compositions, methods and printing components |
07/21/2010 | EP1124912B1 A chemical mechanical polishing slurry system having an activator solution |
07/15/2010 | US20100178768 Controlling passivating film properties using colloidal particles, polyelectrolytes, and ionic additives for copper chemical mechanical planarization |
07/15/2010 | US20100178767 Chemical-mechanical polishing composition comprising metal-organic framework materials |
07/15/2010 | US20100178765 Metal Polishing Slurry and Method of Polishing a Film to be Polished |
07/15/2010 | US20100176336 Systems, methods and solutions for chemical polishing of GaAs wafers |
07/15/2010 | US20100176335 CMP Slurry Composition for Copper Damascene Process |
07/15/2010 | US20100176082 Compositions and methods for the selective removal of silicon nitride |
07/14/2010 | CN101778923A Microetching composition and method of using the same |
07/13/2010 | US7754098 Chemical-mechanical polishing composition and method for using the same |
07/08/2010 | US20100171069 Dispersion comprising cerium oxide, silicon dioxide and amino acid |
07/07/2010 | CN101768445A Environment-friendly sull etching paste |
07/01/2010 | US20100167547 Polishing liquid |
07/01/2010 | US20100167546 Method and Composition for Chemical Mechanical Planarization of A Metal or A Metal Alloy |
07/01/2010 | US20100167545 Method and Composition for Chemical Mechanical Planarization of A Metal |
07/01/2010 | US20100164106 CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method |
07/01/2010 | US20100163788 Liquid cleaner for the removal of post-etch residues |
07/01/2010 | US20100163787 Polishing composition |
07/01/2010 | US20100163786 Polishing composition for semiconductor wafer |
07/01/2010 | US20100163785 Dispersion comprising cerium oxide, silicon dioxide and amino acid |
07/01/2010 | US20100163784 Polishing Composition for Planarizing Metal Layer |
06/30/2010 | CN101760201A Single-liquid type acid etching liquid |
06/30/2010 | CN101760200A Alkaline etching solution |
06/30/2010 | CN101760199A Two-liquid acid etching liquid oxidant |
06/29/2010 | US7744769 etching gas COMPRISING HYPOFLUORITE WHICH DISSOCIATES MORE EASILY THAN, FOR EXAMPLE, EACH OF CF4, C2F6, C4F8, AND NF3 |
06/29/2010 | US7743615 Buffered heat transfer fluid for secondary refrigeration systems comprising a formate salt |
06/24/2010 | US20100159807 Polymeric barrier removal polishing slurry |
06/24/2010 | US20100159698 Combination, Method, and Composition for Chemical Mechanical Planarization of A Tungsten-Containing Substrate |
06/24/2010 | US20100159624 Etchant for etching double-layered copper structure and method of forming array substrate having double-layered copper structures |
06/24/2010 | US20100155655 Polishing composition |
06/24/2010 | US20100155654 Polishing Composition |
06/17/2010 | US20100152077 Process for Solvent Shifting a Nanoparticle Dispersion |
06/17/2010 | US20100151684 Slurry composition for primary chemical mechanical polishing and chemical mechanical polishing method |
06/17/2010 | US20100148113 Method for preparing cerium carbonate powder |
06/17/2010 | US20100147803 Process for removing metallic material from casted substates, and related compositions |
06/15/2010 | US7736530 CMP slurry and method for polishing semiconductor wafer using the same |
06/09/2010 | EP2194570A1 Materials for polishing liquid for metal, polishing liquid for metal, mehtod for preparation thereof and polishing method using the same |
06/08/2010 | US7731864 slurry comprising precipitated silica abrasive having diameter of 100 nm, a chelating buffer system comprising citric acid and oxalic acid to provide a pH of the slurry in an approximate range of 1.5 to 4.0, and a reactive silanol agent comprising tetraethylorthosilicate to act as an interference agent |
06/03/2010 | US20100133466 Cerium carbonate powder, method for preparing the same, cerium oxide powder made therefrom, method for preparing the same, and CMP slurry comprising the same |
06/02/2010 | EP2190947A1 Copper cmp composition containing ionic polyelectrolyte and method |
06/02/2010 | CN101720352A New antioxidants for post-cmp cleaning formulations |
06/02/2010 | CN101717645A Etching plaster for metal and metal oxide transparent conducting layer and etching process |
06/01/2010 | US7727415 comprising at least one of hydrogen fluoride, nitric acid, ammonium fluoride and ammonium chloride; makes fine treatment on multilayer film, including tungsten film and a silicon oxide film, possible by controlling the etching rate |
05/27/2010 | US20100130013 Slurry composition for gst phase change memory materials polishing |
05/27/2010 | US20100129750 Dispersible nanoparticles |
05/27/2010 | US20100127203 Inorganic foams |
05/27/2010 | US20100126961 Polysilicon Planarization Solution for Planarizing Low Temperature Poly-Silicon Thin Film Panels |
05/27/2010 | US20100126762 Method for manufacturing a printed circuit board and a printed circuit board obtained by the manufacturing method |
05/20/2010 | WO2010056051A2 Etching solution for a transparent conductive film |
05/18/2010 | US7718084 via phosphoric acid containing solutions; improved geometry of integrated circuits |
05/14/2010 | WO2010052545A1 Additive for alkaline etching solutions, in particular for texture etching solutions, and process for producing it |
05/13/2010 | US20100120250 Metal polishing slurry and polishing method |
05/13/2010 | US20100120248 Etching solution and etching method |
05/13/2010 | US20100120209 Etchant composition, and method of fabricating metal pattern and thin film transistor array panel using the same |
05/13/2010 | US20100117024 Lapping composition and method using same |
05/13/2010 | US20100116784 Mesa etch method and composition for epitaxial lift off |
05/13/2010 | US20100116781 Etchant and array substrate having copper lines etched by the etchant |
05/12/2010 | EP2183335A1 Microetching composition and method of using the same |
05/12/2010 | CN1670114B Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method |
05/12/2010 | CN101705096A Etching solution for use in wet etching of bismuth-based thin films |
05/12/2010 | CN101704959A Method for recovering waste plastic and etching waste liquid |
05/11/2010 | CA2407530C Etching pastes for inorganic surfaces |
05/06/2010 | US20100112821 Etching solution |
05/06/2010 | US20100112728 Methods for stripping material for wafer reclamation |
05/06/2010 | US20100111831 Compositions and methods for surface abrasion with frozen particles |
05/05/2010 | CN101701156A Method for restraining adhesion and removing the surface pollutant during chip scribing and the composition adopted by the method |
05/04/2010 | US7709277 PAA-based etchant, methods of using same, and resultant structures |
05/04/2010 | US7708904 lapping fluid contains very small amount of water, a Lewis acid and a Lewis base ; heat transfer; resist to corrosion and oxidation, prevent electrostatic build-up; use for cleaning the surface of the tooled articles |
04/29/2010 | US20100102268 Dispersion comprising cerium oxide and colloidal silicon dioxide |
04/22/2010 | US20100099260 Aqueous dispersion for chemical mechanical polishng and chemical mechanical polishing method for semiconductor device |
04/22/2010 | US20100099259 Polishing composition and method for manufacturing semiconductor integrated circuit device |
04/22/2010 | US20100096584 Polishing Composition and Polishing Method Using the Same |
04/22/2010 | US20100096360 Compositions and methods for barrier layer polishing |
04/21/2010 | EP1354018B1 Azeotrope-like composition of 1,2,2-trichloro-1,3,3,3-tetrafluoropropane and hydrogen fluoride |
04/20/2010 | US7700534 Process for removing contaminant from a surface and composition useful therefor description |
04/15/2010 | US20100092366 Water-based polishing slurry for polishing silicon carbide single crystal substrate, and polishing method for the same |
04/15/2010 | US20100090159 Semiconductor polishing composition |
04/15/2010 | US20100090158 Alkaline aqueous solution composition for treating a substrate |
04/15/2010 | US20100090157 Adhesive composition for hard tissue |
04/15/2010 | US20100089872 Etching liquid for conductive polymer, and method for patterning conductive polymer |
04/08/2010 | US20100087065 Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications |
04/06/2010 | US7691287 Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization |
04/01/2010 | WO2008144501A8 New antioxidants for post-cmp cleaning formulations |