Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392)
05/2009
05/20/2009CN101434894A Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
05/14/2009WO2009061487A1 Tetrafluoroborate compounds, compositions and related methods of use
05/14/2009US20090124172 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing
05/14/2009US20090124091 Etching solution composition for metal films
05/14/2009US20090121178 Polishing Slurry
05/14/2009US20090120999 High tin solder etching solution
05/14/2009CA2705052A1 Tetrafluoroborate compounds, compositions and related methods of use
05/13/2009CN101432390A Selective removal chemistries for semiconductor applications, methods of production and uses thereof
05/12/2009US7531105 Chemical-mechanical polishing mixture of a cationic abrasive, a cationic acrylamide-diallyldimethylammonium chloride copolymer and water; pH of 6 or less
05/07/2009US20090117829 Polishing slurry for metal, and polishing method
05/06/2009EP2054487A1 Solution for forming polishing slurry, polishing slurry and related methods
05/06/2009CN101423761A Silicon wafer reclamation process
04/2009
04/30/2009US20090111269 Silicon wafer reclamation process
04/30/2009US20090108231 Surface preparation compound
04/29/2009EP2052049A1 Rate-enhanced cmp compositions for dielectric films
04/28/2009US7524801 Process for removing contaminant from a surface and composition useful therefor
04/23/2009US20090104778 Polishing Composition for CMP and device wafer producing method using the same
04/23/2009US20090101864 Chemical Mechanical Polishing Paste for Tantalum Barrier Layer
04/22/2009CN101413128A Solution and method for removing chromium carbide film
04/16/2009WO2009047203A1 ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo
04/16/2009WO2006110224A3 Slurry composition and method for polishing organic polymer-based ophthalmic substrates
04/16/2009US20090095939 Slurry Composition for Chemical Mechanical Polishing of Metal and Polishing Method Using the Same
04/16/2009DE102004050358B4 Ätzzusammensetzung, Verfahren zu ihrer Herstellung und Verwendung derselben Etching composition, process for their preparation and use thereof
04/15/2009CN101410481A Composition for etching a metal hard mask material in semiconductor processing
04/09/2009US20090092757 Composition for etching treatment of resin molded article
04/09/2009US20090090889 Method and agent for chemical conversion treatment and chemically conversion-Treated members
04/08/2009EP1014433B1 Dry etching gas
04/02/2009WO2009040794A1 Etching compositions, methods and printing components
04/02/2009WO2006115581A3 Composition and method for polishing a sapphire surface
04/02/2009US20090087989 Polishing liquid and polishing method using the same
04/02/2009US20090087988 Polishing liquid and polishing method
04/02/2009US20090087967 Precursors and processes for low temperature selective epitaxial growth
04/02/2009DE112007000643T5 Zusammensetzung zum Ätzen eines Metallhartmaskenmaterials in der Halbleiterbearbeitung Composition for etching a metal hard mask material in the semiconductor processing
04/01/2009CN101397499A TaN material corrosive solution and TaN material corrosion method
03/2009
03/26/2009US20090081927 Polishing composition and method utilizing abrasive particles treated with an aminosilane
03/26/2009US20090078982 Alpha hydroxy carboxylic acid etchants for silicon microstructures
03/26/2009US20090078908 Polishing liquid
03/26/2009US20090078679 Etching solution and method for regenerating waste liquid thereof, and method for recovering valuable metals from waste liquid
03/24/2009US7507350 For radiation transparent indium tin oxide films; aqueous solution of oxalic acid, acetylene-free ethylene oxide-propylene oxide copolymer, a sulfonate type anionic surfactant, and a lower alkanol; suppressed foaming and residue formation
03/19/2009US20090075093 Method and compositions for producing optically clear photocatalytic coatings
03/19/2009US20090072190 Cleaning solution formulations for substrates
03/19/2009US20090071540 Combined etching and doping media
03/17/2009US7504044 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
03/12/2009WO2009032065A1 Copper cmp composition containing ionic polyelectrolyte and method
03/12/2009US20090068844 Etching Process
03/12/2009US20090065735 Cleaning solution formulations for substrates
03/11/2009CN100467566C Chemical method for etching insulating-film for flexible printed circuit, and etching solution
03/10/2009US7501072 Etching solution comprising hydrofluoric acid
03/05/2009WO2008144501A3 New antioxidants for post-cmp cleaning formulations
03/05/2009US20090061576 Manufacturing method for compound semiconductor device and etching solution
03/04/2009EP2031088A2 Wet clean process for recovery of chamber parts
03/03/2009US7497967 Compositions and methods for polishing copper
03/03/2009US7497966 Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor
02/2009
02/26/2009US20090053896 Copper polishing slurry
02/19/2009WO2009023628A2 Chromium-free pickle for plastic surfaces
02/19/2009WO2009023073A1 Microetching composition and method of using the same
02/19/2009US20090047790 Selective Wet Etching of Hafnium Aluminum Oxide Films
02/19/2009US20090047787 Slurry containing multi-oxidizer and nano-abrasives for tungsten CMP
02/19/2009US20090045169 Mirror etching composition
02/18/2009EP2025708A1 Chromium-free etchant for plastic surfaces
02/18/2009CN100462403C High temperature resisting dipping glue and application thereof
02/18/2009CN100462384C Preparation method of vacuum pressurized impregnating epoxy resin
02/12/2009WO2009021005A1 Compositions and methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
02/12/2009WO2008145098A3 Method for the wet-chemical etching of tio2 thin-films and tio2 particles and etching reagent
02/12/2009US20090042997 For lowering surface tension; improve surfactant or surface treating agent performance and to increase the fluorine efficiency; lower proportion of the expensive fluorine component is required to achieve desired levels of performance
02/12/2009US20090042996 reduced fluorine content increases cost efficiency
02/12/2009US20090042401 Compositions and methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
02/12/2009US20090042390 Etchant for silicon wafer surface shape control and method for manufacturing silicon wafers using the same
02/12/2009US20090039312 Etching Of Solar Cell Materials
02/12/2009US20090039311 Difluoride composition, method of preparation, and use for frosting glass
02/11/2009CN100461486C Oriented polymer used for organic TFT
02/11/2009CN100460478C Polishing composition for magnetic disk
02/05/2009US20090032766 Composition and method for selectively etching gate spacer oxide material
02/05/2009US20090032765 Selective barrier polishing slurry
02/05/2009US20090032497 System and method for controlling the application of acid etchers or cleaners by means of color-changing dye
02/05/2009US20090031636 Polymeric barrier removal polishing slurry
02/04/2009CN100457660C Etching agent of motor-driven vehicle glass
01/2009
01/29/2009US20090029553 Free radical-forming activator attached to solid and used to enhance CMP formulations
01/29/2009US20090029551 Pad and method for chemical mechanical polishing
01/28/2009EP2019420A1 Device for texturising surfaces of silicon discs and uses of this device
01/28/2009CN100456429C Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
01/27/2009US7481949 Polishing composition and rinsing composition
01/22/2009US20090023265 Etching solution for removal of oxide film, method for preparing the same, and method of fabricating semiconductor device
01/20/2009US7479474 post-etch resist residue removal using H2SiF6 or HBF4; N-methyl-2-pyrroldione an organic solvent; an amine e.g. ethanolamine, nitrilotris(methylene phosphonic acid) a corrosion inhibitor and water; pH less than 7; environmental friendly
01/20/2009US7479462 Thin films and methods for the preparation thereof
01/15/2009US20090017636 Titanium nitride-stripping liquid, and method for stripping titanium nitride coating film
01/15/2009US20090017626 Semiconductor wet etchant and method of forming interconnection structure using the same
01/15/2009US20090014683 Selective polish for fabricating electronic devices
01/15/2009US20090013609 Polymeric Microgels for Chemical Mechanical Planarization (CMP) Processing
01/14/2009EP1255797A4 Method for roughening copper surfaces for bonding to substrates
01/08/2009WO2008133767A3 Polysilicon planarization solution for planarizing low temperature polysilicon thin film panels
01/08/2009US20090008601 Potassium monopersulfate solutions
01/08/2009US20090008600 Method and composition for polishing a substrate
01/08/2009US20090008366 Etching composition and method for etching a substrate
01/08/2009US20090008365 Microtextured Implants and Methods of Making Same
01/08/2009US20090008361 Oxidant and passivant composition and method for use in treating a microelectronic structure
01/07/2009EP2010695A2 Recyclable etching solution
01/06/2009US7473380 Etching liquid
01/01/2009US20090004863 Polishing liquid and polishing method using the same
01/01/2009US20090001340 Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
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