Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
04/2014
04/02/2014CN103703047A Epoxy resin, epoxy resin composition, prepreg, and curing product of each
04/02/2014CN103694905A Fast curing dual-component adhesive
04/02/2014CN103694861A Dual-modified and dual-cured epoxy acrylate coating material
04/02/2014CN103694642A Thermosetting resin composition and application thereof
04/02/2014CN103694641A Buoyance material for curing modified arylamine and preparation method of buoyance material
04/02/2014CN103694640A Preparation method of conductive thermo-cured epoxy resin system
04/02/2014CN103694638A Halogen-free epoxy resin applicable to liquid oxygen environment and preparation method thereof
04/02/2014CN103694637A High-tenacity vacuum slow epoxy resin for wind power blade and preparation method thereof
04/02/2014CN103694636A Electric insulating epoxy resin composition, preparation method and use of composition
04/02/2014CN103694635A Room-temperature rapid self-repairing composite material based on microencapsulated epoxy resin and super-strong-acid curing agent
04/02/2014CN103694632A Preparation method of epoxy resin composite material
04/02/2014CN103694631A Halogen-free epoxy resin composition and cover film prepared by using halogen-free epoxy resin composition
04/02/2014CN103694456A Epoxy resin curing agent and epoxy resin coating material
04/02/2014CN103694455A Blending method of epoxy resin applicable to preparing carbon fiber preimpregnated material by medium-temperature heat melting method
04/02/2014CN103694454A Epoxy resin medium-temperature latent curing agent and epoxy resin coating material
04/02/2014CN103694453A Epoxy resin curing agent
04/02/2014CN103694452A Epoxy resin toughening curing agent and preparation method thereof
04/02/2014CN103694451A Epoxy resin curing agent preparation method
04/02/2014CN103694450A Fire retardation epoxy resin and preparation method thereof
04/02/2014CN103694430A Preparation method of biomedical polymer material of polyunsaturated acid gallic acid epoxy ester
04/02/2014CN102731967B Adhesive for road antiskid layer and preparation method of adhesive
04/02/2014CN102535249B Novel wet strengthening agent for papermaking and preparation method and application thereof
04/02/2014CN102449020B Resin composition for semiconductor encapsulation, and semiconductor device
04/02/2014CN102356109B Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
04/02/2014CN101932631B Silicon-containing particle, process for producing the same, organic-polymer composition, ceramic, and process for producing the same
04/01/2014US8686108 Aluminum chelate latent curing agent and production method thereof
04/01/2014US8686104 Ladder polymers with instrinsic microporosity and process for production thereof
04/01/2014US8686069 Solvent resistance of epoxy resins toughened with polyethersulfone
03/2014
03/27/2014WO2014046828A1 Supramolecular initiator for latent cationic epoxy polymerization
03/27/2014WO2014046095A1 Epoxy and alkoxy silyl group-containing silsesquioxane and composition thereof
03/27/2014WO2014044851A1 Prepolymer impact resistor for crack-resistant adhesives for windmills
03/27/2014US20140088289 Bisphenol a (bpa) free epoxy resins
03/27/2014US20140088282 Supramolecular initiator for latent cationic epoxy polymerization
03/27/2014US20140088223 Thermoset/supramolecular hybrid composites and resins that can be hot-formed and recycled
03/26/2014EP2710075A2 Epoxy resin compound and radiant heat circuit board using the same
03/26/2014EP2710049A1 Novel structural adhesive and use thereof
03/26/2014CN103687897A Compound comprising isocyanuric skeleton, epoxy groups, and organopolysiloxane or silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for op
03/26/2014CN103687889A Polyetheramines used as accelerating agents in epoxy systems
03/26/2014CN103687888A Thermoset/supramolecular hybrid composites and resins that can be hot-formed and recycled
03/26/2014CN103666356A Thermosetting conductive silver adhesive
03/26/2014CN103666195A Anti-rust iron oxide red epoxy primer for rusty steel tube
03/26/2014CN103666177A Composition and preparation method of high-weather-resistant lead-free water-based environment-friendly corrosion-resistant paint
03/26/2014CN103666027A Blended waterborne photocurable resin material and preparation method thereof
03/26/2014CN103665775A Epoxy molding compound filled with high amount of silica powder and preparation method thereof
03/26/2014CN103665774A High-strength adhesive as well as preparation method and application thereof
03/26/2014CN103665773A Halogen-free epoxy resin composition and flexible copper-clad plate prepared by using composition
03/26/2014CN103665771A Wear-resistant composition, wear-resistant gear and manufacturing method of wear-resistant gear
03/26/2014CN103665767A Epoxy resin and preparation method thereof
03/26/2014CN103665765A Black flexible halogen-free flame-retardant epoxy resin composition
03/26/2014CN103665762A Thermosetting resin composition, b graded resin film, metal foil, copper-clad board and multi-layer lamination substrate
03/26/2014CN103665761A Composition used for printed circuit board and printed circuit board including the composition and a sheet-shaped film
03/26/2014CN103665760A Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board
03/26/2014CN103665759A Preparation method of modified epoxy resin system
03/26/2014CN103665758A Modified epoxy resin system for carbon fiber boards for pultrusion structure reinforcement
03/26/2014CN103665757A Preparation of high-strength low-modulus composite electronic molding compound
03/26/2014CN103665327A Prepolymer containing m-xylene diamine and preparation method of prepolymer
03/26/2014CN103665326A Thermosetting cyanate/bismaleimide resin composition
03/26/2014CN103665325A Epoxy resin and preparation method thereof
03/26/2014CN103665324A Epoxy latent curing agent and corresponding epoxy resin coating
03/26/2014CN103665323A Novel latent curing agent of epoxy resin
03/26/2014CN103665322A Resin composition for thermal radiation board and thermal radiation board comprising the same
03/26/2014CN103665321A Bisphenol A formaldehyde epoxy resin preparation method and copper-clad laminate
03/26/2014CN103665320A Preparation method of epoxy resin
03/26/2014CN103665271A Acrylic acid-epoxy ester hybrid resin and coatings thereof
03/26/2014CN103052667B Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
03/26/2014CN102775737B Solvent-free elastic epoxy grouting material and preparation method and application thereof
03/26/2014CN102762627B Two-liquid mixing first and second liquids and method for producing printed circuit board
03/26/2014CN102690496B Nano modified epoxy vacuum pressure impregnation resin and preparation method thereof
03/26/2014CN102633988B Modified lauryl amine hardener, manufacturing method and application of modified lauryl amine hardener
03/26/2014CN102604044B Thiourea modified low temperature curing agent and preparation method thereof
03/26/2014CN102516500B Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
03/26/2014CN102369229B Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof
03/26/2014CN102143986B Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element
03/25/2014US8679632 Fusion bonded epoxy coating compositions that include magnesium oxide
03/25/2014CA2753899C Polyalkylene glycol with moiety for conjugating biologically active compounds
03/20/2014WO2014043434A2 Polyepoxide-polyacid coating compositions, related coating processes and coated substrates
03/20/2014WO2014040262A1 Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
03/20/2014WO2014040261A1 Epoxy resin compound, and, prepreg and clad copper laminate manufactured using the compound
03/19/2014EP2708567A1 Epoxy resin composition for fiber-reinforced composite material
03/19/2014EP2707413A1 Thermoset/supramolecular hybrid composites and resins that can be hot-formed and recycled
03/19/2014EP2707412A1 Insulation formulations
03/19/2014EP2707411A1 Insulation formulations
03/19/2014CN103649825A Liquid crystal sealant and liquid crystal display cell using same
03/19/2014CN103649219A Resin composition for printed wiring boards
03/19/2014CN103649218A Curable epoxy resin composition
03/19/2014CN103649217A Curable epoxy resin composition
03/19/2014CN103649216A Resin composition for sealing optical semiconductor, and optical semiconductor device using same
03/19/2014CN103649212A Pressure-sensitive adhesives with onium-epoxy resin crosslinking system
03/19/2014CN103649161A Hardener for epoxy resins
03/19/2014CN103649160A Insulation formulations
03/19/2014CN103649159A Epoxy polymerizable composition and organic el device
03/19/2014CN103649158A Insulation formulations
03/19/2014CN103649157A Coating compositions with improved adhesion to containers
03/19/2014CN103649156A Coating compositions for containers
03/19/2014CN103649154A Adducts as tougheners in thermosettable epoxy systems
03/19/2014CN103649042A Low-emission hardener for epoxy resins
03/19/2014CN103643527A Preparation method of ring-shaped silicone softener
03/19/2014CN103642199A Reversible covalent crosslinked polyurethane and epoxy resin composite and preparation method thereof
03/19/2014CN103642175A Normal-temperature fast curing epoxy resin crack pouring agent for roads and bridges
03/19/2014CN103642174A High-temperature resistant and high-performance attenuating epoxy matrix and application thereof, and preparation method of composite material of matrix
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