Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
04/2014
04/23/2014CN103739827A Resin composition
04/23/2014CN102942891B Epoxy potting resin for bus ducts, and preparation method and application thereof
04/23/2014CN102702688B Preparation method of bisphenol-A epoxy resin/attapulgite nano composite material
04/23/2014CN102617364B Hydroxymethyl diamine compound and preparation method and application thereof
04/23/2014CN102574987B Solvent-free and one-pack type cyanic ester/epoxy composite resin composition
04/23/2014CN102522344B Epoxy glue curing process for automobile rectifier
04/23/2014CN102341424B Hexafluoropropylene oxide polymer compositions and a preparing method of hexafluoropropylene oxide polymer using hexafluoropropylene oligomer
04/23/2014CN101842407B Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same
04/22/2014US8703882 Phosphorus-containing benzoxazine-based bisphenols, derivatives thereof, and preparing method for the same
04/22/2014US8703862 Reinforced thermoplastic molding compositions based on polyarylene ethers
04/22/2014US8703845 Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
04/22/2014US8703844 Low-viscosity epoxy resin composition with low blushing
04/22/2014US8703379 Chemical binding of renewable oils to polyester emulsion
04/22/2014US8703010 Curing agent for epoxy resins and epoxy resin compositions
04/22/2014US8702943 Electrocoat composition and process replacing phosphate pretreatment
04/17/2014WO2014058523A1 Coating/sealant systems, aqueous resinous dispersions, methods for making aqueous resinous dispersions, and methods of electrocoating
04/17/2014WO2014057871A1 Glycidyl ether compound, liquid crystal sealant, and method for producing glycidyl ether compound
04/17/2014WO2014057689A1 Thermal expansion resin composition
04/17/2014WO2014057686A1 Thermal expansion resin composition
04/17/2014US20140107255 Blends comprising epoxy resins and mixtures of amines with guanidine derivatives
04/16/2014EP2720294A1 Separator for non-aqueous electrolyte accumulators, non-aqueous electrolyte accumulator and manufacturing methods therefor
04/16/2014EP2720290A1 Separator for nonaqueous electrolyte electricity storage devices, nonaqueous electrolyte electricity storage device, method for producing separator for nonaqueous electrolyte electricity storage devices, and method for manufacturing nonaqueous electrolyte electricity storage device
04/16/2014EP2718399A1 Production of hardened epoxy resins having flame-retarding phosphonates
04/16/2014EP2718384A2 Aqueous adhesive composition based on epoxide resin
04/16/2014CN103732697A Coating system comprising high acid resin
04/16/2014CN103732659A Curable resin compositions
04/16/2014CN103732658A Sheet-shaped epoxy resin composition, and sealing sheet containing same
04/16/2014CN103732648A Liquid methylenedianiline compositions
04/16/2014CN103732647A Toughener and toughened epoxy adhesive
04/16/2014CN103725184A High-activity vinyl ester resin gel coat and preparation method thereof
04/16/2014CN103725166A Steel structure protective paint
04/16/2014CN103725164A Raw oil-resistant coating composition
04/16/2014CN103724999A Cyanate resin composition and application thereof
04/16/2014CN103724998A Cyanate resin composition and application thereof
04/16/2014CN103724945A Halogen-free epoxy resin composition and application thereof
04/16/2014CN103724944A Halogen-free epoxy resin composition and application thereof
04/16/2014CN103724938A Method for preparing nano-copper/epoxy resin composite material
04/16/2014CN103724597A Modified epoxy impregnating resin with high heat resistance and preparation method thereof
04/16/2014CN103724596A Epoxy resin composition and condensate
04/16/2014CN103724575A Preparation method of phosphorus-containing bisphenol A phenol formaldehyde resin
04/16/2014CN103221442B Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-p film
04/16/2014CN103013421B Solvent-free polyurethane compound adhesive and preparation method thereof
04/16/2014CN102925094B Ultraviolet light polymerization adhesive and preparation method thereof
04/16/2014CN102731350B Sulfhydryl compound containing beta-ester groups and acetyl-transferred synthesis method thereof
04/16/2014CN102702743B High-toughness high-heat-conduction epoxy-imine resin system and preparation method and application thereof
04/16/2014CN102417758B Liquid photoreceptive solder resist ink
04/16/2014CN102408366B Sulfur-containing compositions and processes for making same
04/16/2014CN102298265B Photoetching dielectric compositions and electrical or electronic device
04/16/2014CN102224140B Curable composition comprising a thermolatent base
04/16/2014CN101910236B Polymerizable epoxy composition, and sealing material composition comprising the same
04/16/2014CN101824205B Integrated molding, fiber-reinforced composite material board and housing for electric/electronic device
04/16/2014CN101787099B Encapsulant compositions and method for fabricating encapsulant materials
04/16/2014CN101550265B Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound
04/15/2014US8697864 Flame retardant compositions with a phosphorated compound
04/15/2014US8697834 Polyalkylenepolyamines by homogeneously catalyzed alcohol amination
04/15/2014US8697768 Energy curable overprint varnish and coated product
04/15/2014US8697237 Thermosetting resin composition, method of manufacturing the same and circuit board
04/15/2014CA2641847C Humidifier and evaporation mat contained therein
04/10/2014WO2014054547A1 Resin composition, resin cured product, transparent composite, display-element substrate, and surface-light-source substrate
04/10/2014WO2014003544A3 Curable coating composition
04/10/2014WO2013155173A3 Methods and compositions relating to biodegradable epoxy elastomers
04/10/2014US20140099508 Water-Based Amine Curing Agents for Curable Resin Systems
04/09/2014EP2717097A1 Photosensitive resin composition for forming biochip, and biochip
04/09/2014EP2716710A1 Resin composition and prepreg and metal foil clad laminate using same
04/09/2014EP2716676A1 Resin composition, prepreg and laminate
04/09/2014EP2714818A1 Coating system comprising high acid resin
04/09/2014EP2714765A1 Coating compositions for containers
04/09/2014EP2714764A1 Coating compositions with improved adhesion to containers
04/09/2014EP2714763A1 Epoxy resins with high thermal stability and toughness
04/09/2014CN103718108A Photosensitive resin composition and cured product thereof
04/09/2014CN103718107A Negative-type photosensitive resin composition, resin film, and electronic component
04/09/2014CN103717635A Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
04/09/2014CN103717634A Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and method for producing semiconductor device
04/09/2014CN103709984A In-situ thread adhesive for fiber reinforced plastic pipeline
04/09/2014CN103709815A Water dispersible super-amphiphobic microsphere, preparation method and application thereof
04/09/2014CN103709608A Electric-insulation epoxy resin castable for outdoor mutual inductor
04/09/2014CN103709605A Epoxy resin composition, preparation method thereof and plugging aluminum plate
04/09/2014CN103709602A Toughening aging-resistant epoxy resin composition for pultrusion molding and preparation method thereof
04/09/2014CN103709377A Preparation method of autocatalytic cardanol mannich amide curing agent
04/09/2014CN103709376A Preparation method of bisphenol-based epoxy resin curing agent
04/09/2014CN103709375A High-performance epoxy-resin composition containing dicyclopentadiene alicyclic structure
04/09/2014CN103709374A Preparation method of flame-retardant silane coupling agent
04/09/2014CN103709365A High refractive resin containing silicon and preparation method of resin
04/09/2014CN103709281A Fluorine-containing nano-microsphere/fluorine-containing epoxy resin hybrid, preparation method and application thereof
04/09/2014CN103709082A Hydrazine thioamide compound as well as preparation method and application thereof
04/09/2014CN102504493B Epoxy resin composition applicable to pre-encapsulation of inner interconnection framework system
04/09/2014CN102449018B Epoxy resin composition, prepreg and fiber-reinforced composite material
04/08/2014US8691920 Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom
04/08/2014US8691044 Epoxide-based fixing mortar having silane additions
04/08/2014US8690978 Liquid resin composition for abrasive articles
04/03/2014WO2014052319A2 Adduct compositions
04/03/2014WO2014051241A1 Thermosetting epoxy resin composition having good impact resistance
04/03/2014WO2014050978A1 Polycarboxylic acid resin and epoxy resin composition
04/03/2014WO2014050420A1 Epoxy resin, curable resin composition, cured product thereof, and printed circuit board
04/03/2014WO2014050419A1 Epoxy resin, curable resin composition, cured product thereof, and printed circuit board
04/03/2014WO2014050155A1 Conductive composition and conductive molded body
04/03/2014WO2014050034A1 Prepreg, metal-clad laminated sheet, printed wiring board
04/03/2014WO2014049602A1 An epoxy resin formulation for large and thick composite structures
04/03/2014WO2014049028A2 Resin composition and composite structure containing resin
04/02/2014CN103703048A Curable epoxy resin composition
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