Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
05/2014
05/07/2014EP2726529A1 Hybrid epoxy resins
05/07/2014CN1960997B 可用于制造无卤素抗引燃聚合物的含磷化合物 Phosphorus-containing compounds may be used in the manufacture of halogen-free ignition resistant polymer
05/07/2014CN103781870A 密封剂组合物 Sealant composition
05/07/2014CN103781821A 聚合物和含有该聚合物的组合物以及粘合剂用组合物 Polymers and compositions containing the polymer and the adhesive composition
05/07/2014CN103781815A 光半导体元件密封用固化性树脂组合物及其固化物 An optical semiconductor element is sealed with a curable resin composition and a cured product
05/07/2014CN103781814A 光固化性树脂组合物以及新型硅氧烷化合物 Light-curable silicone resin compositions and novel compounds
05/07/2014CN103781813A 混杂的环氧树脂加合物 Mixed epoxy adduct
05/07/2014CN103781772A 三环氧化合物及其制备方法 Three epoxy compound and its preparation method
05/07/2014CN103774273A 一种抗蠕变聚酯的抗芯吸型工业丝及其制备方法 An anti-creep resistant wicking polyester industrial yarn and its preparation method
05/07/2014CN103773300A 一种可返修底部填充胶及其制备方法 One kind can rework underfill and its preparation method
05/07/2014CN103772912A 低温长效热熔预浸料用环氧树脂膜及其制备方法 Low long-term hot-melt prepreg epoxy resin film and method
05/07/2014CN103772649A 辐射或热可固化的防渗密封胶 Radiation or heat curable impermeable sealant
05/07/2014CN103772648A 部分酯化环氧树脂及应用其制成的树脂组合物及其制法 Partially esterified epoxy resin composition and application of which is made of Jiqizhifa
05/07/2014CN103194166B 光热二重固化导电胶及其制备方法 Light and heat curing conductive adhesive double its preparation method
05/07/2014CN102675886B 一种纤维增强的环氧沥青材料及制备方法 A fiber-reinforced epoxy asphalt materials and preparation methods
05/07/2014CN102648244B 多元羧酸组合物及其制造方法以及含有该多元羧酸组合物的可固化树脂组合物 Polycarboxylic acid composition and its manufacturing method, and a curable resin composition containing the polycarboxylic acid composition of the
05/07/2014CN102459397B 半导体密封用树脂组合物、以及半导体装置 The semiconductor encapsulating resin composition and semiconductor device
05/06/2014CA2664927C Composite materials with improved performance
05/01/2014WO2014066718A1 Curable compositions comprising 1,3-dioxiranylcyclopentane epoxide compounds and thermosets prepared therefrom
05/01/2014WO2014066456A2 Adduct curing agents
05/01/2014WO2014066450A2 Weatherable coatings
05/01/2014WO2014066388A2 Ethyleneamine epoxy hardener
05/01/2014WO2014066386A1 Polyamide hardeners for epoxy resins
05/01/2014WO2014065407A1 Binder for lithium cell, composition for producing electrode, and electrode
05/01/2014WO2014065152A1 Epoxy resin composition, method for producing epoxy resin cured product, and semiconductor device
05/01/2014WO2014065100A1 Non-photosensitive resin composition
05/01/2014WO2014064200A2 Epoxy resins crosslinkable at room temperature
05/01/2014US20140121299 Adducts as tougheners in thermosettable epoxy systems
05/01/2014US20140120334 Method and apparatus for producing porous thermosetting resin sheet, porous thermosetting resin sheet, and porous thermosetting resin sheet roll
04/2014
04/30/2014EP2723812A1 Pressure-sensitive adhesives with onium-epoxy resin crosslinking system
04/30/2014EP2723796A1 Thermosetting composition and process for preparing fiber-reinforced composites
04/30/2014EP2723795A1 Novel liquid curing agents and surfactants
04/30/2014EP2723794A1 Novel polymers and polymer compositions
04/30/2014EP2723793A1 Epoxy resin compositions
04/30/2014EP2723787A1 Pressure-sensitive adhesives with onium-epoxy crosslinking system
04/30/2014CN103764771A High solids antifouling paint composition
04/30/2014CN103764713A Resin composition, resin sheet, resin sheet with metal foil, hardened resin sheet, structure, and semiconductor device for power or light source
04/30/2014CN103764712A Novel liquid curing agents and surfactants
04/30/2014CN103764711A Novel polymers and polymer compositions
04/30/2014CN103764710A Resin film
04/30/2014CN103764709A Process for the impregnation of air core reactors, impregnated air core reactor and use of an impregnation system
04/30/2014CN103764708A Photopolymerizable composition, photopolymerizable coating agent, laminate, and polarizing plate
04/30/2014CN103764707A Epoxy compound, epoxy compound mixture, curable composition, and connecting structure
04/30/2014CN103764706A Curable resin compositions
04/30/2014CN103764705A Ester type curable compound, composition containing same, cured product, and method for producing ester type curable compound
04/30/2014CN103756615A Polyolefin polymer modified binder material for organic electroluminescent device
04/30/2014CN103756260A Biomass modified thermosetting resin and preparation method thereof
04/30/2014CN103756258A Preparation method of Ti3AlC2 epoxy resin conductive composite material
04/30/2014CN103756257A Thermosetting epoxy resin composition and use thereof
04/30/2014CN103756254A Epoxy resin used for liquid oxygen environment, preparation method and application thereof
04/30/2014CN103756252A Thermosetting-resin-based heat-conductive composite material, and preparation method and application thereof
04/30/2014CN103755925A Halogen-free nitrogen-phosphorus-containing curing agent and preparation method thereof
04/30/2014CN103755924A Production method of brominated epoxy resin flame retardant
04/30/2014CN103755923A Low-temperature-cured aliphatic amide polyamine epoxy resin curing agent and preparation method thereof
04/30/2014CN103755922A Latent curing agent with fire resistance and preparation method thereof
04/30/2014CN103755921A Resin composition, resin sheet, and cured resin material and method for producing the same
04/30/2014CN103755575A Ether amine preparation method
04/30/2014CN103753905A Halogen-free flame-retardant resin matrix sandwich structure body and preparation method thereof
04/30/2014CN103753904A High-toughness resin-based aramid fiber composite material and production method thereof
04/30/2014CN102675602B Biomimetic monolithic material with affine selectivity similar to that of protein A and preparation method and application thereof
04/30/2014CN102558501B Film forming agent for fiberglass roving and preparation method of film forming agent
04/30/2014CN101939377B Vibration dampening compositions
04/29/2014US8710158 Epoxy composition for encapsulating an optical semiconductor element
04/29/2014US8710121 Biaxially oriented hydrolysis-stable polyester film comprising epoxidized fatty acid derivatives and a chain extender, and process for production thereof and use thereof
04/29/2014US8710119 Process for producing polyphenylene ether composition
04/29/2014US8709587 Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device
04/29/2014US8709201 Method for gluing components, forming a temperature-resistant adhesive layer
04/24/2014WO2014062903A1 Polymer particle dispersions with polyols
04/24/2014WO2014062895A1 Polymer particle dispersions with epoxy hardeners
04/24/2014WO2014062891A1 Polymer particle dispersions with divinylarene dioxides
04/24/2014WO2014062530A2 Toughened epoxy thermosets containing core shell rubbers and polyols
04/24/2014WO2014062409A2 Low odor epoxy resin systems based on nadic anhydride-type harneders
04/24/2014WO2014061812A1 Resin composition, prepreg, laminate, and printed wiring board
04/24/2014WO2014061811A1 Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board
04/24/2014WO2014061767A1 Resin composition, adhesive sheet, dicing tape-integrated type adhesive sheet, back grind tape-integrated type adhesive sheet, back grind tape/dicing tape-integrated type adhesive sheet, and electronic device
04/24/2014WO2014061648A1 Curable resin composition, and cured product thereof
04/24/2014WO2014061450A1 Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film
04/24/2014WO2014061420A1 Cationic polymerization initiator, curing agent composition, and epoxy resin composition
04/24/2014WO2014061062A1 Sulfonium salt, photoacid generator, curable composition, and resist composition
04/24/2014WO2014059654A1 Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same
04/24/2014WO2014059653A1 Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same
04/24/2014WO2014023661A3 Dual-hardening solvent-free one-component compositions and the use thereof
04/24/2014WO2014003208A8 Water-based epoxy resin emulsion
04/24/2014US20140114047 Hybrid epoxy resins
04/24/2014US20140113994 Partially esterified epoxy resin and epoxy resin composition applied with the same, and method for preparing the composition
04/24/2014US20140110055 Curing Agents Providing a Low Ratio of Thin-Film Cure Time to Gel Time
04/23/2014CN103748516A Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist
04/23/2014CN103748167A Thermally cationically polymerizable composition, anisotropic conductive adhesive film, connected structure and manufacturing process therefor
04/23/2014CN103748131A Resin composition for resists
04/23/2014CN103748130A Cyclic carbonate monomers and polymers prepared therefrom
04/23/2014CN103748129A Polyepoxides and epoxy resins and methods for the manufacture and use thereof
04/23/2014CN103740124A Environment-friendly wallboard and preparation method thereof
04/23/2014CN103740103A Aramid fiber/epoxy resin composite material and preparation method thereof
04/23/2014CN103740061A Flame-retardant epoxy presoak glue and preparation method thereof, GHG prepreg and preparation method thereof
04/23/2014CN103740060A Low-halogen underfill adhesive and preparation method thereof
04/23/2014CN103740058A Normal temperature fast curing pouring material and preparation method thereof
04/23/2014CN103740057A Reactive resin adhesive and synchronous rubble scattering machine
04/23/2014CN103740055A Thermosetting resin composition and application thereof
04/23/2014CN103740054A Preparation method of thermosetting shape memory resin with two glass transition temperatures
04/23/2014CN103739828A Preparation method of cardanol-based high temperature-resistant epoxy resin curing agent
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