| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 06/09/1999 | EP0921169A1 Barrier coating composition for plastic articles |
| 06/09/1999 | EP0921168A1 Radiation curable products based on epoxy(meth)acrylates |
| 06/09/1999 | EP0921158A2 Poly(phenylene ether) thermoset compositions |
| 06/09/1999 | EP0921146A1 Polyamide curing agents based on mixtures of polyethelene-amines, piperazines and deaminated bis-(p-amino-cyclohexyl) methane |
| 06/09/1999 | EP0921142A1 Improved curing catalysts for curing epoxy resins |
| 06/09/1999 | EP0921141A1 Process for producing compound having epoxy group |
| 06/09/1999 | EP0626424B1 Thermoplastic resin composition |
| 06/08/1999 | US5910548 Process for producing modified epoxy resin, modified epoxy resin produced, and epoxy resin composition thereof |
| 06/08/1999 | US5910542 Adhesives and sealants based on telechelic polymers and heterotelechelic block polymers with dual cure systems |
| 06/08/1999 | US5910541 Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems |
| 06/02/1999 | EP0919873A1 Photo curable resin composition and photosensitive element |
| 06/02/1999 | EP0919601A1 Curable coating compositions having improved effect pigment orientation and a method using the same |
| 06/02/1999 | EP0721477B1 Flexibilised light-curing epoxy resin compounds, their production and use |
| 06/02/1999 | EP0531510B1 Post-extended anionic polyurethane dispersion |
| 06/02/1999 | CN1218484A Process for making high-performance polytherester resins and thermosets |
| 06/02/1999 | CN1218080A Sealing agent and liquid crystal display element using the same |
| 06/02/1999 | CN1218073A Poly (phenylene ether) thermoset compositions |
| 06/01/1999 | US5908943 Prepared by (i) reacting an allyl derivative of an active hydrogen-containing compound with (ii) a peroxygen-containing compound. |
| 06/01/1999 | US5908902 Self-emulsifying aqueous epoxy resin dispersions |
| 06/01/1999 | US5908901 Gelled reactive resin compositions |
| 06/01/1999 | US5908883 Epoxy resin component which includes approximately 17 percent by weight of an epoxy resin, 82 percent by weight of powdered barium sulfate, and 0.15 percent by weight expanded aramid fiber; and a curing component comprising a curing agent. |
| 06/01/1999 | US5908882 Epoxy resin composition |
| 06/01/1999 | US5908881 Heat-conductive paste |
| 06/01/1999 | US5908880 Aggregate grains, a polysulfide-modified epoxy resin and a curing agent for the polysulfide-modified epoxy resin. |
| 06/01/1999 | CA2253699A1 Curable coating compositions having improved effect pigment orientation and a method of using the same |
| 05/27/1999 | WO1999025769A1 Ultra low stress method for epoxy resins: stress-transfer |
| 05/27/1999 | WO1999025768A1 Water compatible curing agents for epoxy resins |
| 05/27/1999 | WO1999009089A3 Aqueous dispersions of epoxy resins |
| 05/27/1999 | DE19750147A1 One-component epoxy resin for coating electronic components |
| 05/26/1999 | EP0918071A1 Polyamide curing agents based on mixtures of polyethyleneamines and piperazine derivatives |
| 05/26/1999 | EP0917547A1 Polyglycidyl ethers of secondary alcohols |
| 05/26/1999 | EP0799261B1 Process for preparation of allyl ether, thioether and amine compounds |
| 05/25/1999 | US5907333 Ink jet print head containing a radiation curable resin layer |
| 05/25/1999 | US5907020 Two component powder coating system and method for coating wood therewith |
| 05/25/1999 | US5906864 Aqueous coating composition and its use to produce filler coats |
| 05/25/1999 | US5906784 Curable epoxy resin compositions |
| 05/25/1999 | CA2039050C Curing resin composition and its cured product |
| 05/25/1999 | CA1340560C Colour-changeable adhesive |
| 05/20/1999 | WO1999024515A1 Conductive organic coatings |
| 05/20/1999 | WO1999024508A1 Crystallization resistant amidoamine compositions |
| 05/19/1999 | EP0916709A2 A one-component, low temperature curable coating powder |
| 05/19/1999 | EP0916691A2 Process for molding and shaping of polymer blends |
| 05/19/1999 | EP0916688A1 Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device |
| 05/19/1999 | EP0824563A4 Silicone aminopolyalkyleneoxide block copolymers |
| 05/19/1999 | EP0438524B1 Flame retardant epoxy molding compound, method and enscapsulated device |
| 05/19/1999 | CN1217005A UV curable composition |
| 05/19/1999 | CN1043416C Porous, absorbent, polymeric macrostructures and method for making same |
| 05/18/1999 | US5905119 Thermosetting powder-type coating compositions |
| 05/18/1999 | US5905103 Bisphenol-epichlorohydrin copolymer with hydroxyalkylamine and with formaldehyde and amines for pigment pastes |
| 05/18/1999 | US5904984 Electrical insulation using liquid crystal thermoset epoxy resins |
| 05/18/1999 | US5904888 Curable compositions |
| 05/18/1999 | CA2052677C Curable composition |
| 05/14/1999 | WO1999023134A1 Hydroxy ether polymers as thermoplastic barrier resins |
| 05/12/1999 | EP0915118A1 Epoxy resin composition and semiconductor device encupsulated therewith |
| 05/12/1999 | EP0914936A2 Cationic catalysts for epoxy resin formulations in pultrusion molding systems |
| 05/12/1999 | EP0914398A1 Heat-setting single-component lva (low-viscosity adhesive) system with improved storage properties |
| 05/12/1999 | EP0914362A1 Modified epoxysiloxane condensate, process for producing the same and its use as low-stress casting resins in the electronic and electrotechnical industry |
| 05/12/1999 | EP0914259A2 Thermal transfer compositions, articles and graphic articles made with same |
| 05/12/1999 | EP0782593A4 Layered silicate-epoxy nanocomposites |
| 05/12/1999 | EP0770101B1 Catalytic compositions and coatings made therefrom |
| 05/12/1999 | DE19851810A1 Curable resin material, e.g. for printed circuit boards |
| 05/12/1999 | CN1216555A Improved process for the preparation of advanced resins |
| 05/12/1999 | CA2253622A1 Cationic catalysts for epoxy resin formulations in pultrusion molding systems |
| 05/11/1999 | US5902755 Acid resistant, reinforced composite of at least one thermoplastic and thermosetting matrix resin for heat resistance; high tensile fibers, sodium tetraborate or borosilicate glass particles |
| 05/11/1999 | US5902643 Multilayer packaging material having aminoepoxy gas barrier coating |
| 05/11/1999 | US5902473 Electrodepositing a coating solution containing epoxy resin and carbamate containing crosslinker which is a reaction product of polyamine containing two primary and atleast one secondary amine, a cyclic carbonate and polyepoxide |
| 05/11/1999 | CA2253099A1 Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device |
| 05/11/1999 | CA2052286C Flexible intumescent coating composition |
| 05/11/1999 | CA2050024C Improved aqueous emulsion dispersion adhesives based on a polyol and a hindered isocyanate compound |
| 05/06/1999 | WO1999021917A1 Hardener for anhydride group-containing polymers |
| 05/06/1999 | WO1999021907A1 Epoxy resin mixture, composites produced therefrom and the use thereof |
| 05/06/1999 | WO1999021900A1 High modulus polymers and composites from plant oils |
| 05/06/1999 | EP0912649A1 Heat-setting single-component lva (low-viscosity adhesive) system for bonding in the micro-range |
| 05/06/1999 | EP0779904B1 Epoxy resin mixtures for prepregs and composites |
| 05/06/1999 | DE19748764A1 Leitfähige, organische Beschichtungen Conductive organic coatings |
| 05/04/1999 | US5900469 Storage-stable, phosphorus-modified epoxy resins |
| 05/04/1999 | US5900468 Epoxy resin composition |
| 05/04/1999 | US5900461 Conjugation |
| 05/04/1999 | US5900447 Composition for forming high thermal conductivity polybenzoxazine-based material and method |
| 05/04/1999 | US5900286 Method of producing an attenuating structure on a surface wave component |
| 05/04/1999 | CA2168390C Curable coating composition and method of forming a top coat |
| 05/04/1999 | CA2044987C Cationic microgels and their use in electrodeposition |
| 05/04/1999 | CA2009303C Polymeric reaction product that becomes waterthinnable on protonation with an acid |
| 04/29/1999 | WO1999020702A1 Coating composition and method for coating therewith |
| 04/29/1999 | WO1999020674A1 Novel resin-curing process enabling the actinic radiation cure of resins containing shieldings against actinic radiations; composition for the process, moldings, and molding process |
| 04/29/1999 | WO1999020673A1 Thermally stable polyetheramines |
| 04/29/1999 | DE19747553A1 Epoxy resin mixture for fire-resistant composites |
| 04/29/1999 | CA2307100A1 A coating composition and a method for coating thereof |
| 04/28/1999 | EP0911353A1 Adhesive resin composition and adhesive film |
| 04/28/1999 | EP0911326A1 Diglycidyl ethers |
| 04/28/1999 | EP0910612A1 Curing process for cationically photocurable formulations |
| 04/28/1999 | EP0910600A1 Flexibilized epoxy resins |
| 04/27/1999 | US5898045 Neutralized, free-radical polymerized addition copolymer as clear protective coatings for automobiles with improved acid resistance and scratch resistance, yellowing resistance |
| 04/22/1999 | WO1999019407A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material |
| 04/22/1999 | WO1999019389A1 Conductive thermoset molding composition and method for producing same |
| 04/22/1999 | CA2306144A1 Conductive thermoset molding composition and method for producing same |
| 04/21/1999 | EP0909773A2 Stabilized cationically-curable compositions |
| 04/21/1999 | EP0909407A1 Photopolymerizable thermosetting resin composition |
| 04/21/1999 | EP0909287A1 Cross-linked tannin/inorganic oxide composites |
| 04/21/1999 | CN1214706A In situ emulsified reactive epoxy polymer compositions |