Patents for C03C 15 - Surface treatment of glass, not in the form of fibres or filaments, by etching (4,356)
02/2007
02/06/2007US7172839 Preventing surface damage; coarse focused ion etching followed by gas assisted electron beam removal of thin film contaminated with gallium
02/01/2007WO2007012378A1 Etching media for oxidic, transparent, conductive layers
02/01/2007US20070027018 Optical member made of synthetic quartz glass, and process for its production
02/01/2007US20070026682 Method for advanced time-multiplexed etching
02/01/2007US20070026240 chemical vapor deposition of tin oxide; hydrogen chloride serves to prevent the oxidation reaction from occurring between tin tetrachloride and water vapor; crystallization in multi-steps
02/01/2007US20070023396 Etch compositions and methods of processing a substrate
02/01/2007US20070023395 Production method for semiconductor wafer
02/01/2007US20070023391 Temperature exchanging element made by extrusion, and its applications
02/01/2007US20070023390 Cluster tool and method for process integration in manufacturing of a photomask
01/2007
01/31/2007CN1297504C Method for fabricating deep etching glass capable of changing patterns along with visual angles
01/30/2007US7169540 Method of treatment of porous dielectric films to reduce damage during cleaning
01/30/2007US7169317 Removing native titanium oxide layer from titanium bone implant, acid etching surface to form a uniform surface roughness, depositing a layer of hydroxyapatite on acid-etched surface; enhanced bonding
01/25/2007WO2007009546A1 Printable etching media for silicon dioxide and silicon nitride layers
01/25/2007US20070020944 Selective etch process of a sacrificial light absorbing material (slam) over a dielectric material
01/25/2007US20070017901 Method and apparatus for etching disk-like member
01/25/2007US20070017900 edge region with no defects larger than or equal to 0.3 .mu.m
01/25/2007US20070017899 Method of controlling the critical dimension of structures formed on a substrate
01/24/2007EP1451861A4 Apparatus and method for reactive atom plasma processing for material deposition
01/24/2007CN1902045A Method of fabricating low-warp flat glass
01/24/2007CN1899996A Glass composition exclusively consisting of oxides which already at low temperatures form volatile fluorides by reaction with fluorine and its use
01/23/2007US7166186 Laser decapsulation apparatus and method
01/18/2007WO2007006381A1 Combined etching and doping media for silicon dioxide layers and subjacent silicon
01/18/2007US20070014949 Localized surface annealing of components for substrate processing chambers
01/18/2007US20070012653 Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
01/18/2007DE102005033724A1 Druckfähige Ätzmedien für Siliziumdioxid-und Siliziumnitridschichten Printable etchants for silicon dioxide and silicon nitride layers
01/16/2007US7163641 Method of forming high aspect ratio apertures
01/11/2007WO2007003255A1 Medium for etching oxidic transparent conductive layers
01/11/2007US20070007248 Compositions and methods for chemical mechanical polishing silica and silicon nitride
01/11/2007US20070007247 Processing method for semiconductor wafer
01/11/2007US20070007246 Manufacture of semiconductor device with CMP
01/11/2007US20070007240 Wafer-level, polymer-based encapsulation for microstructure devices
01/11/2007US20070007237 Method for self-assembling microstructures
01/10/2007CN1891652A Mask for glass etching and its use for glass etching
01/10/2007CN1891651A Glass digitalized etching method
01/10/2007CN1891646A Normal temperature bonding method for quartz microflow control chip and pressurizing mould
01/10/2007CN1891645A Glass/quartz microflow control chip and its packaging method
01/10/2007CN1294015C Liquid spray nozzle
01/09/2007US7160479 Method and apparatus for evaluating panel drip tests
01/04/2007WO2006071556A3 Methods for removing black silicon and black silicon carbide from surfaces of silicon and silicon carbide electrodes for plasma processing apparatuses
01/04/2007US20070003844 Method for adjusting dimensions of photomask features
01/04/2007US20070003796 Method for manufacturing magnetic disk glass substrate and method for manufacturing magnetic disk
01/04/2007US20070000874 Method and apparatus for polishing a substrate
01/04/2007US20070000873 Substrate processing method and semiconductor device manufacturing method
01/04/2007US20070000872 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
01/04/2007US20070000869 Etching method in a semiconductor processing and etching system for performing the same
01/04/2007US20070000613 Electric field mediated chemical reactors
01/02/2007US7157016 Etching process for micromachining crystalline materials and devices fabricated thereby
12/2006
12/28/2006US20060289389 Poly etch without separate oxide decap
12/28/2006US20060289388 Forming indentations on a chromium alloy implant by etching with a methanol-free fluid, preferably containing hydrohalic acid, an oxidant and a chloride salt, and incubating at 10-100 degrees C.; enhances adhesion of coatings or cells, improves retention of proteins, and encourages bone in-growth
12/28/2006US20060289387 Non-aqueous lapping composition and method using same
12/28/2006US20060289381 Including selectively etching an exposed portion of the top magnetic layer, and underlying portions of the tunnel barrier and the pinned bottom magnetic film layer using an etchant solution containing an arylsulfonic acid and an aliphatic or alicyclic amine.
12/27/2006EP1735825A2 Highly selective silicon oxide etching compositions
12/21/2006WO2006135098A1 Method of finishing pre-polished glass substrate surface
12/21/2006US20060283840 second slurry comprising a resin particle having a primary particle diameter ranging from 0.05 to 5 mu m, and a surfactant having a hydrophilic moiety to greatly minimize the number of defects that may be caused due to the residue of resist
12/21/2006US20060283839 Polishing equipment having a longer operating time length
12/21/2006US20060283838 Chemical mechanical polish process and method for improving accuracy of determining polish endpoint thereof
12/21/2006US20060283834 Method of manufacturing ZnO substrate from ZnO crystal formed by hydrothermal synthesis method
12/20/2006CN1290787C Method for making glass rear cover of organic electroluminescence display
12/14/2006US20060278611 Method and device for flattening surface of solid
12/14/2006US20060278607 Method for fabricating semiconductor device with step gated asymmetric recess structure
12/14/2006US20060278535 Apparatus and methods for removing tungsten-containing coatings from a metal component
12/14/2006DE4318676B4 Verfahren zur Verringerung einer teilchenförmigen Konzentration in Arbeitsfluiden A method for reducing a particulate concentration in working fluids
12/13/2006EP1729978A2 Method of dry plasma etching semiconductor materials
12/13/2006CN1290085C Substrate for magnetic recording medium, magnetic recording medium and its mfg method
12/12/2006US7147974 Methods for converting reticle configurations
12/07/2006US20060276041 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
12/07/2006US20060273070 Photoresist polymer, photoresist composition and method for manufacturing semiconductor device
12/07/2006US20060273069 Forming a conductive pattern on a substrate
12/07/2006US20060273066 Method for manufacturing a magnetic sensor having an ultra-narrow track width
11/2006
11/30/2006US20060270236 Semiconductor device and manufacturing method thereof
11/30/2006US20060266736 Detecting particle agglomeration in chemical mechanical polishing slurries
11/30/2006US20060266734 Device, method, and system for pattern forming
11/29/2006CN2841654Y Sand-finished glass pickling machine
11/29/2006CN1871530A Optical element having antireflection structure, and method for producing optical element having antireflection structure
11/28/2006US7140203 Method for manufacturing glass substrate of information recording medium
11/23/2006US20060261042 Forming a trench in the wafer of crystalline material on a first side of a crystalline material, the trench comprising blade profile of a blade; isotropically etching
11/23/2006US20060261041 Method for manufacturing metal line contact plug of semiconductor device
11/23/2006US20060261040 Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
11/23/2006US20060261039 Molding a raw material resin; carbonizing molding; roughening simultaneously the inner and outer surfaces, purification, mechanical surface roughening and chemical surface etching; improved adhesion to CVD deposit film and also has a high degree of roundness
11/23/2006US20060260745 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device
11/23/2006DE102006003604A1 Verfahren zur Mikrostrukturierung von Festkörperoberflächen Process for microstructuring of solid surfaces
11/21/2006US7138066 Gear surface treatment procedure
11/16/2006US20060257757 Methods for converting reticle configurations
11/16/2006US20060255505 Imprint templates for imprint lithography, and methods of patterning a plurality of substrates
11/16/2006US20060255016 Method for polishing copper on a workpiece surface
11/16/2006US20060255014 Etching method and apparatus for semiconductor wafers
11/15/2006EP1721873A1 Method for producing glass substrate having concave and convex portions in surface thereof
11/15/2006EP1720834A1 Ionic liquids of heterocyclic amines
11/15/2006CN1864235A Transparent base with transparent conductive film, method for producing same, and photoelectric converter comprising such base
11/09/2006WO2006072021A3 Processes for forming electronic devices and electronic devices formed by such processes
11/09/2006US20060252268 Useful in chemical-mechanical polishing or chemical mechanical procedures; oxidizes copper and a material of the barrier layer at substantially the same rates
11/09/2006US20060252267 Topology-selective oxide CMP
11/09/2006US20060252266 Cmp process of high selectivity
11/09/2006US20060249723 Planarization process for semiconductor substrates
11/09/2006DE102005020510A1 Verbundelement, insbesondere Fensterscheibe Composite element, in particular windowpane
11/08/2006CN1858013A Automobile glass etching glue
11/07/2006US7132034 Apparatus for etching a glass substrate
11/02/2006WO2006115581A2 Composition and method for polishing a sapphire surface
11/02/2006US20060246724 Method for polishing wafer
11/02/2006US20060243714 Selective processing of laminated target by laser
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