Patents for C03C 15 - Surface treatment of glass, not in the form of fibres or filaments, by etching (4,356)
08/2007
08/16/2007US20070190789 Compositions and methods for CMP of indium tin oxide surfaces
08/16/2007DE10222958B4 Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element A method of manufacturing an organic electro-optical element and an organic electro-optical element
08/16/2007DE102006035797B3 Method for cleaning quartz glass surfaces used in semiconductor finishing comprises pre-cleaning in an acidic cleaning solution under the action of hydrogen peroxide and post-treating in an alkali cleaning solution
08/15/2007EP1818317A1 Method of manufacturing a glass substrate with a satin appearance
08/15/2007CN1332071C Silica glass crucible
08/15/2007CN101018734A A method for making MEMS switch, and MEM device and its making method
08/14/2007US7255943 Glass substrate for a magnetic disk, magnetic disk, and methods of producing the glass substrate and the magnetic disk
08/09/2007US20070184662 Double-side polishing carrier and fabrication method thereof
08/09/2007US20070184658 Etching Liquid for Controlling Silicon Wafer Surface Shape
08/09/2007US20070184354 Process for etching photomasks
08/09/2007US20070181851 Polishing composition and polishing method
08/09/2007US20070181535 Chemical mechanical polishing of a bimetallic substrate with a mixture of an abrasive and two polishing rate modifiers: 9,10-anthraquinone-1,8-, 1.5- or 2,6-disulfonic acid having a standard reduction potential less than 0.34 and a second agent having a standard reduction potential greater than 0.34 V
08/09/2007US20070181534 Barrier polishing liquid and chemical mechanical polishing method
08/08/2007CN1331198C Use of ammonia for etching organic low-K dielectrics
08/08/2007CN101015041A Etch and deposition control for plasma implantation
08/07/2007US7252774 Selective chemical etch method for MRAM soft layers
08/02/2007US20070178700 Compositions and methods for CMP of phase change alloys
08/02/2007US20070176140 Polishing composition and polishing method
08/02/2007US20070175864 Low Cost High Throughput Processing Platform
08/02/2007US20070175863 Single Wafer Etching Apparatus and Single Wafer Etching Method
08/02/2007US20070175857 Decorative surface treatment for metals
08/01/2007CN1329285C Method for producing a product having a structured surface
07/2007
07/31/2007US7251082 Photochromic/vitroceramic window assembly
07/31/2007US7250114 Methods of finishing quartz glass surfaces and components made by the methods
07/26/2007US20070170148 Methods for in-situ generation of reactive etch and growth specie in film formation processes
07/26/2007US20070170146 Fin structure formation
07/26/2007DE102006003606A1 Method for structuring a surface layer on a substrate used in micro-structuring comprises guiding a liquid jet directed onto the surface layer over the regions of the layer to be removed
07/25/2007CN2926220Y Circulating-glass bottle automatic montmorillonite production line
07/25/2007CN1328196C Etching solution for forming an embedded resistor
07/25/2007CN101005024A Method of treatment of porous dielectric films to reduce damage during cleaning
07/24/2007US7247250 Method for manufacturing a fast heat rise resistor
07/24/2007US7247249 Method of treating razor blade cutting edges
07/19/2007WO2007081624A2 Notch stop pulsing process for plasma processing system
07/19/2007WO2006091909A3 Etching and cleaning bpsg material using supercritical processing
07/19/2007US20070167015 Polishing method
07/19/2007US20070166520 Glass material for use at high frequencies
07/19/2007US20070163998 Composition for polishing semiconductor layers
07/19/2007US20070163996 Plasma processing apparatus and plasma processing method
07/19/2007US20070163993 Planarization with reduced dishing
07/19/2007US20070163992 Method and device for contacting semiconductor chips
07/18/2007CN1326791C Method for processing micro slot array on borosilicate glass surface
07/18/2007CN100999386A Method of manufacturing glass microractor by etching
07/17/2007US7244311 Heat transfer system for improved semiconductor processing uniformity
07/12/2007WO2006081149A3 Novel polishing slurries and abrasive-free solutions having a multifunctional activator
07/12/2007US20070161247 Etching method of single wafer
07/12/2007US20070158309 Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same
07/12/2007US20070158308 Method for manufacturing single-side mirror surface wafer
07/12/2007US20070158306 Method of forming a metal line and method of manufacturing display substrate having the same
07/12/2007US20070158302 Systems and methods for gas assisted resist removal
07/11/2007CN1997771A Methods for the optimization of substrate etching in a plasma processing system
07/05/2007WO2007073664A1 A process for producing hurricane-resistant glass
07/05/2007US20070155181 Method and system for etching high-k dielectric materials
07/05/2007US20070151951 Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method
07/05/2007US20070151948 Method of selectively stripping a metallic coating
07/05/2007US20070151947 Method for setting plasma chamber having an adaptive plasma source, plasma etching method using the same and manufacturing method for adaptive plasma source
07/05/2007US20070151944 providing an acidic mixed solution includes nitric acid and ammonium fluoride, free of hydrofluoric acid; and a mixture of phosphoric acid, sulfuric acid and acetic acid; immersing the silicon wafer in the acidic mixed solution; and etching; stable, controllable and less hazardous for environment
07/04/2007CN1993298A Process for manufacturing glass substrate for magnetic recording medium and glass substrate for magnetic recording medium obtained by the process
07/04/2007CN1990402A Hurricane-proof glass manufacturing technique
06/2007
06/28/2007US20070148978 Slurry compositions, methods of polishing polysilicon layers using the slurry compositions and methods of manufacturing semiconductor devices using the slurry compositions
06/28/2007US20070145014 Polishing composition for glass substrate
06/28/2007US20070145013 Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device
06/28/2007US20070145012 Slurry and method for chemical-mechanical polishing
06/28/2007US20070145011 Chemical mechanical polishing system and process
06/28/2007US20070145010 Removal rate estimating method of a chemical mechanical polishing process under mixed products or mixed layers
06/28/2007US20070145008 Techniques Of Anisotropic Wet Etch Micromachining For Comb Drive Transducers And Resonance Frequency Reduction
06/28/2007US20070145002 Multi-printed etch mask process to pattern features
06/26/2007US7235137 Conductor treating single-wafer type treating device and method for semi-conductor treating
06/21/2007WO2007070353A2 Methods and apparatus for processing a substrate
06/21/2007US20070141850 Wet Treatment of Hafnium Containing Materials
06/21/2007US20070141847 Notch stop pulsing process for plasma processing system
06/21/2007US20070141845 Apparatus and method for supplying chemicals
06/21/2007US20070141349 Alkaline glasses with modified glass surfaces and process for the production thereof
06/21/2007US20070138141 Method of polishing a semiconductor-on-insulator structure
06/21/2007US20070138140 Method for controlling polishing process
06/21/2007US20070138139 Method of manufacturing semiconductor device, acid etching resistance material and copolymer
06/21/2007US20070138138 formed by dipping, picking; high silicon content, high strength; free from bald spots; conversion coatings with improved adhesion, corrosion resistance; for automobile chassis parts
06/21/2007US20070138137 Method for patterning low dielectric layer of semiconductor device
06/21/2007US20070138131 Method of forming a patterned layer on a substrate
06/21/2007US20070138130 Method for manaufacturing glass substrate having uneven surface
06/21/2007US20070138129 Method for manufacturing field emission cathode
06/21/2007US20070138126 Methods of forming a conductive structure
06/14/2007US20070134923 Method to form topography in a deposited layer above a substrate
06/14/2007US20070131654 Methods and apparatus for processing a substrate
06/14/2007US20070131653 Methods and apparatus for processing a substrate
06/14/2007DE102005058713A1 Verfahren zur trockenchemischen Behandlung von Substraten, sowie dessen Verwendung A process for the dry-chemical treatment of substrates, and the use thereof
06/07/2007WO2007062694A1 Internal treatment process and device for the internal treatment of glass containers
06/07/2007US20070128873 Aqueous dispersion for cmp, polishing method and method for manufacturing semiconductor device
06/07/2007US20070125751 Stripping device and stripping apparatus
06/07/2007US20070125747 Process for polishing glass substrate
06/07/2007CA2631346A1 Inner treatment method and device for the inner treatment of glass containers
06/06/2007EP1791794A2 Composite, ordered material having sharp surface features
06/06/2007CN1976880A Method for producing a hydrophobic coating, device for implementing said method and support provided with a hydrophobic coating
06/06/2007CN1974458A Corrosion deactivating process of treating surface microcrack in glass medium as laser work matter
05/2007
05/31/2007WO2007061579A2 Chamber components with polymer coatings and methods of manufacture
05/31/2007WO2007061018A1 Method of glass substrate working and glass part
05/31/2007US20070123052 Process sequence for photoresist stripping and cleaning of photomasks for integrated circuit manufacturing
05/31/2007US20070123049 Semiconductor process and method for removing condensed gaseous etchant residues on wafer
05/31/2007US20070123047 Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device
05/31/2007US20070122745 Surface formed by a hydrophilic addition polymer such as polyacrylamide having alkoxysilylalkylthio- end groups crosslinked with a Si, Al, Ti or Zr alkoxide or aryl oxide; improved resistance to stains during printing
05/31/2007US20070119817 Manufacturing method of silicon wafer
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