Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
12/2009
12/03/2009US20090298388 Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die
12/03/2009US20090298387 Polishing end point detection method
12/02/2009CN201353717Y Leveling device for artificial quartz crystal plate
12/02/2009CN101590622A Panel rounding R angle machining abrading machine for a plane display and machining method
12/01/2009US7625495 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
11/2009
11/26/2009US20090291619 Grindstone contact sensing method and its device, and honing method and honing machine
11/26/2009US20090291618 Tire grinding method and grinding device
11/25/2009EP2123399A2 Grindstone contact sensing method and its device and honing method and honing machine
11/25/2009CN101585165A Grindstone contact sensing method and its device, and honing method and honing machine
11/25/2009CN101585164A Polishing apparatus
11/24/2009US7621798 Reducing polishing pad deformation
11/19/2009WO2009140622A2 Polishing pad with endpoint window and systems and method using the same
11/19/2009US20090286453 Method and apparatus for chemical-mechanical polishing
11/18/2009EP1981674B1 Method for machining bevel gears in a pitching method with complete pitch error compensation
11/18/2009CN101579842A Tool sharpener grinding wheel position measurement method and device thereof
11/18/2009CN100561182C Polishing endpoint detection system using friction sensor
11/12/2009WO2009137685A2 Configuring of lapping and polishing machines
11/12/2009WO2009081357A3 Pick and place tool grinding
11/12/2009US20090280721 Configuring of lapping and polishing machines
11/12/2009US20090280580 Cmp pad thickness and profile monitoring system
11/11/2009CN201342618Y Real time auxiliary measuring instrument for cylindrical grinding
11/11/2009CN100559553C Chemico-mechanical polishing end-point detection method for integrated circuit device
11/10/2009US7614936 Spectrum based endpointing for chemical mechanical polishing
11/10/2009US7614935 Apparatus for machining a workpiece
11/10/2009US7614934 Double-side polishing apparatus
11/10/2009US7614933 Polishing pad assembly with glass or crystalline window
11/10/2009US7614932 Method and system for endpoint detection
11/05/2009US20090275265 Endpoint detection in chemical mechanical polishing using multiple spectra
11/05/2009US20090275264 System and method for optical endpoint detection during cmp by using an across-substrate signal
11/04/2009EP1917123B1 Precision machining apparatus and precision machining method
10/2009
10/29/2009US20090270014 Method and apparatus for stripping holes in a metal substrate
10/29/2009US20090269861 Device and method for manufacturing a semiconductor wafer
10/28/2009CN201333655Y 打磨机 Grinders
10/28/2009CN101564820A Rolling equipment and rolling method
10/27/2009US7607970 Planing and polishing machine
10/27/2009US7607969 Grinding apparatus for a pin for use in power transmission chain and manufacture method of a pin for use in power transmission chain
10/27/2009US7607968 Apparatus on a flat card or roller card for grinding a fibre processing clothing disposed on a rotating cylinder or a card flat
10/27/2009US7607967 Substrate processing method and substrate processing apparatus
10/27/2009US7607239 Apparatus for checking diametral dimensions of cylindrical parts rotating with an orbital motion
10/21/2009CN201329544Y Universal driving device for detecting oil groove positions of inner and outer valve housings
10/21/2009CN101559578A Coreless abrasive machining measurement and control system and corresponding coreless abrasive machining method
10/21/2009CN101559572A Method and device for automatic alignment and on-line real-time detection in grinding of ball valve
10/21/2009CN100551627C Method and device for controlling polishing temperature of freezing fixed abrasive
10/21/2009CN100551617C Surface finishing apparatus and related method
10/21/2009CN100551615C Process and testing method for PCB drilling machine drill chuck
10/20/2009US7604729 Methods and apparatus for selectively removing conductive material from a microelectronic substrate
10/20/2009US7604527 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
10/20/2009US7603762 Optical lapping guide for use in the manufacture of perpendicular magnetic write heads
10/16/2009CA2627706A1 Perfect edge
10/15/2009US20090258573 Chemical Mechanical Polishing Method
10/15/2009DE102008060199A1 Verfahren zum Beurteilen der Bearbeitungsgüte für Waferschleifmaschine und Waferschleifmaschine Method for assessing the quality of surface finish for wafer grinding and wafer grinding machine
10/14/2009CN201327557Y Abrasive grain stroboscopic photographic device
10/14/2009CN100550314C Device for and method of polishing peripheral edge of semiconductor wafer
10/14/2009CN100548577C Substrate polishing method and apparatus
10/13/2009US7602985 Multi-scale enveloping spectrogram signal processing for condition monitoring and the like
10/13/2009US7601615 Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus
10/13/2009US7601049 Double side wafer grinder and methods for assessing workpiece nanotopology
10/08/2009US20090253352 Slicing Method
10/08/2009US20090253351 Friction sensor for polishing system
10/08/2009DE102008007175A1 Verfahren zum Schleifen der Haupt- und Hublager einer Kurbelwelle durch Außenrundschleifen und Vorrichtung zur Durchführung des Verfahrens Method for grinding the main and rod bearings of a crankshaft by external cylindrical grinding and apparatus for performing the method
10/07/2009EP2106880A2 Post-process sizing control device for grinding machine
10/07/2009CN101549476A Post-process sizing control device for grinding machine
10/06/2009US7599583 Sensors with modular architecture
10/01/2009WO2009079368A3 Method for processing a work-piece
10/01/2009US20090247052 Wafer grinding method and wafer grinding machine
10/01/2009US20090247051 Eyeglass lens processing apparatus
10/01/2009US20090247050 Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
10/01/2009US20090247049 Post-process sizing control device for grinding machine
10/01/2009DE19743139B4 Vorrichtung zum Durchführen eines Schleifvorganges und Verfahren dazu Apparatus for performing a grinding operation and method thereof
10/01/2009DE102009011491A1 Schleifverfahren zum Schleifen der Rückfläche eines Halbleiterwafers sowie dafür verwendete Schleifvorrichtung zum Schleifen der Rückfläche eines Halbleiters Grinding method for grinding the back surface of a semiconductor wafer and used for grinding apparatus for grinding the back surface of a semiconductor
10/01/2009DE102008063721A1 Waferschleifverfahren und Waferschleifvorrichtung Wafer grinding method and grinding device wafer
09/2009
09/30/2009CN101543974A Grinding unit and grinding method for magnetic head slider
09/24/2009US20090239449 Automatic constant pressure polishing apparatus for improving surface accuracy of lens
09/24/2009US20090239448 Machining quality judging method for wafer grinding machine and wafer grinding machine
09/24/2009US20090239447 Detecting device for abnormal workpiece rotation in non-circular workpiece grinding machine
09/24/2009US20090239446 Polishing Apparatus and Polishing Method
09/23/2009EP2103382A2 Detecting device for abnormal workpiece rotation in non-circular workpiece grinding machine
09/23/2009CN100542747C Polished state monitoring apparatus and polishing apparatus using the same
09/22/2009US7591710 Polishing machine comprising a work chamber and a platform
09/22/2009US7591709 Blasting device
09/22/2009US7591708 Method and apparatus of eddy current monitoring for chemical mechanical polishing
09/17/2009US20090233532 Substrate holding apparatus and polishing apparatus
09/17/2009US20090233525 Method for Detecting Polishing End in CMP Polishing Device, CMP Polishing Device, and Semiconductor Device Manufacturing Method
09/17/2009US20090233109 Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grinding Machine
09/16/2009CN101530983A Polishing state monitoring apparatus and polishing apparatus and method
09/16/2009CN101530976A Excircle precision grinding method and equipment capable of real-time measuring
09/16/2009CN101530975A Method for preparing high-precision arc-blade diamond lathe tool
09/15/2009US7588480 Polishing head for a polishing machine
09/10/2009US20090227182 Method for operating a gear grinding machine
09/10/2009DE10139894B4 Verfahren und Vorrichtung zum spitzenlosen Rundschleifen Method and apparatus for centerless grinding
09/09/2009EP1827756B1 Device for automatic mounting preparation of ophthalmic lenses enabling several lenses to be processed at the same time
09/09/2009CN101528417A Pre-and post-process bore gaging using a honing feed system equipped with feed force sensing
09/09/2009CN101524829A A method and device for measuring film thickness by coupling eddy current sensors
09/08/2009US7585206 Spool to spool continuous through feed system
09/08/2009US7585204 Substrate polishing apparatus
09/08/2009US7585203 Bowling ball surface treatment machine and bowling ball surface treatment method
09/08/2009US7585202 Computer-implemented method for process control in chemical mechanical polishing
09/03/2009WO2009108093A1 Electric saw communication
09/03/2009WO2007024807A9 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
09/03/2009US20090220349 Method for Producing a Gas Turbine Component Which is to be Coated, With Exposed Holes, Device for Carrying Out the Method, and Coatable Turbine Blade with Film Cooling Holes
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