Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
04/2003
04/10/2003US20030066681 Solder paste and terminal-to-terminal connection structure
04/10/2003US20030066177 Method for isothermal brazing of single crystal components
04/10/2003DE20300375U1 Cooler for workpieces or components under cooled vacuum dome, especially in vapor phase vacuum soldering installation
04/10/2003DE20300374U1 Assembly for temp. treatment of workpieces or components in controllably heated vacuum dome
04/09/2003EP1299324A1 Freestanding reactive multilayer foils
04/08/2003US6546077 Miniature X-ray device and method of its manufacture
04/08/2003US6544662 Process for manufacturing of brazed multi-channeled structures
04/08/2003US6544623 Honeycomb cell structure and method of manufacture
04/08/2003US6544397 Method for enhancing the solderability of a surface
04/08/2003US6543677 Solder-ball bonding device and method
04/08/2003US6543675 Method for soldering an exhaust gas heat exchanger
04/08/2003CA2099201C Ball earring process and construction
04/03/2003WO2003026835A1 Flux composition for solder, solder paste, and method of soldering
04/03/2003WO2003026833A1 Ball bumping machine and techniques
04/03/2003US20030064242 Method of manufacturing an aluminium joined product
04/03/2003US20030062401 Method of providing wear-resistant coatings, and related articles
04/03/2003US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry
04/02/2003EP1298970A2 Method for producing metal/ceramic bonding circuit board
04/02/2003EP1298108A2 Metal/ceramic bonding article
04/02/2003EP1073537B1 Method for soldering an exhaust gas heat exchanger
04/02/2003CN1407568A Ceramic electronic element with leads
04/02/2003CN1104328C Technology for periodically semi-continuous production of coiled composite metal band
04/01/2003US6541364 Bump forming method and bump forming apparatus
03/2003
03/27/2003WO2003024653A1 Method for the production of a soldered connection
03/27/2003US20030057265 Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
03/27/2003US20030057263 Method of brazing and article made therefrom
03/26/2003EP1295671A1 Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method
03/26/2003EP1294528A1 Method of brazing and article made therefrom
03/26/2003EP1294519A1 Laser beam soldering of aluminium alloys
03/26/2003EP1294518A2 Implementation system for continuous welding, method, and products for implementation of the system and/or method
03/26/2003CN1406106A Hydrogen and scaling-powder-free welding conducted through electronic adsorption
03/26/2003CN1405339A Method and apparatus for separating oxide
03/26/2003CN1104046C Semiconductor device and its wire welding method and apparatus
03/25/2003US6538229 Method for the positionally accurate adjustment and fixing of a microoptical element
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/20/2003WO2003023496A1 Method and apparatus for manufacturing the rim of a pair of spectacles
03/20/2003WO2003022504A2 Soldering method for metallic fastening elements
03/20/2003WO2003022500A1 Method of manufacturing an aluminium joined product
03/20/2003WO2003022499A1 Method and device for applying a solder material to a metallic structure by means of vibration
03/20/2003WO2002045900A9 Device for light-beam material processing
03/20/2003US20030052156 A soldering means having a curved exterior surface enclosing a first volume, and an interior cavity having a displacement constituting a second volume, useful for electrical and mechaincal connecting two metal planer surfaces
03/20/2003US20030051909 Ball grid array attaching means having improved reliability and method of manufacturing same
03/20/2003US20030051792 Use of a cleaning process, a cleaning process, a connection process and a workpiece pair
03/20/2003US20030051342 Filler metal for aluminum brazing sheet for heat exchangers and method of manufacturing same
03/19/2003EP1294218A1 Flux applying method, flow soldering method and devices therefor and electronic circuit board
03/19/2003EP1293649A2 Foil made of a ferrite type heat resistant high alloy steel
03/19/2003EP1293286A2 Diffusion bonding of gaps in high temperature nickel and cobalt alloy components
03/19/2003EP1293283A2 Method for local application of solder to preselected areas on a printed circuit board
03/19/2003CN1404354A Electronic element assembling examining method
03/19/2003CN1103263C Method for introducing solder into apparatus
03/19/2003CN1103262C Method for welding aluminium base composite material without protection at low temperature
03/18/2003US6534195 Corrosion resistance and sealing can be improved without using Pb; Sn-Zn alloy is plated on first metallic member and/or second metallic member, and soldered with Sn-Ag alloy
03/18/2003US6534194 Method of making reactive multilayer foil and resulting product
03/18/2003US6533577 Compartmentalized oven
03/18/2003US6533163 Solder ball pitcher
03/18/2003US6533161 Vacuum electronics; soldering of a ceramic component to copper; layer of silver is first applied galvanically to copper to form the soldering material; a copper-silver eutectic
03/13/2003US20030049483 Composite of metal foils with a soldering material
03/13/2003US20030047591 Hydrogen fluxless soldering by electron attachment
03/13/2003US20030046813 Heat exchanger and tube therefor
03/13/2003DE20300224U1 Heating equipment for batch- and in-line soldering plant based on e.g. infra-red, convective, hot air or microwaves, has heating and cooling integrated in vacuum bell
03/12/2003EP1291111A1 Hydrogen fluxless soldering by electron attachment
03/12/2003EP1290394A1 Heat exchanger and tube therefor
03/12/2003EP1290246A1 Method of manufacturing an aluminium product
03/12/2003CN1401458A Repair of single crystal nickel superalloy part
03/11/2003US6531676 Method for producing an electrically conductive connection by laser radiation
03/11/2003US6530971 Repairing such as gas turbine engine combustor liner; also containing at least chromium, cobalt, titanium, aluminum, tungsten and molybdenum with minor amounts of carbon, boronand zirconium
03/11/2003US6530778 Condensation oven for heat treating a workpiece
03/11/2003US6530653 Ultrasonic bonding of ink-jet print head components
03/11/2003US6530514 Method of manufacturing heat transfer tubes
03/06/2003US20030042289 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method
03/06/2003DE20203599U1 Heating system for a reflow soldering process has heated gas split into two streams
03/05/2003EP1287934A1 Heat exchanger and method for production thereof
03/05/2003EP1286803A1 Method for producing a structural member from plates stacked on top of each other and soldered together
03/05/2003CN1400078A Chip soldering apparatus
03/04/2003US6527165 Method of making an environmental resistant brazed assembly including a wear resistant surface portion
03/04/2003US6527164 Removing flux residue from reflow furnace using active gaseous solvent
02/2003
02/27/2003US20030039856 Protective coatings; coorosion resistance
02/27/2003US20030038166 Method for assembling parts made of materials based on sic by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method
02/27/2003US20030038165 Method for making an electroconductive joint
02/27/2003US20030038164 Method for manufacturing a cooling element and a cooling element
02/27/2003US20030038163 Solder shaping process and apparatus
02/27/2003US20030038160 Ceramic electronic component having lead wires
02/27/2003US20030038157 Electronic component with a semiconductor chip and method for producing the electronic component
02/27/2003US20030037804 Method of cleaning solder paste
02/25/2003US6524644 Process for selective deposition of OSP coating on copper, excluding deposition on gold
02/25/2003US6524398 Low-residue, low-solder-ball flux
02/25/2003US6524100 Facility for the thermal treatment of workpieces
02/25/2003US6523735 Method of manufacturing bonded assembly
02/25/2003US6523438 Process and device for securing teeth to blanks
02/20/2003WO2003014612A1 Method and structure for connecting difficult-to-join pipes to be used at high temperature
02/20/2003US20030035975 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method
02/20/2003US20030034381 Packaging method using lead-free solder
02/20/2003US20030034380 Method for removing solder bumps from LSI
02/20/2003US20030033715 Manufacturing method of heat exchanger
02/19/2003CN1398223A Improved electrical conductivity and high strength aluminium alloy composite material and methods of mfg. and use
02/19/2003CN1398212A Aluminium product with excellent brazing characteristics
02/18/2003US6521861 Method and apparatus for increasing welding rate for high aspect ratio welds
02/18/2003US6520401 Diffusion bonding of gaps
02/13/2003WO2003012833A2 Process and apparatus for mounting semiconductor components to substrates and parts therefor
02/13/2003WO2002039463A9 Methods and system for attaching substrates using solder structures