Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
12/2002
12/25/2002CN1096911C Method of brazing directionally solidified or monocrystalline components
12/24/2002US6497357 Apparatus and method for removing interconnections
12/24/2002US6497039 Method of producing an encased honeycomb body
12/19/2002US20020190097 Method and arrangement for a martensite-free brazing process
12/19/2002US20020190035 Methods and apparatus for localized heating of metallic and non-metallic surfaces
12/18/2002EP1266430A1 Method for making an electroconductive joint
12/18/2002EP1038984B1 Corrosion protective sacrificial aluminum alloy for heat exchanger and aluminum alloy composite material highly resistant to corrosion for heat exchanger and heat exchanger using said composite material
12/18/2002CN1385271A Selectively removing braze composition from conneted assembly
12/18/2002CN1096327C Heat-conducting process for lining lead-plate
12/17/2002US6494254 Brazed tube for a heat exchanger, method of manufacture and exchanger
12/17/2002CA2157225C Method and apparatus for fluxing and soldering terminals on a printed circuit board
12/12/2002WO2002098600A1 Brazing material and brazed product manufactured therewith
12/12/2002WO2002081137A3 Method and device for producing metallic honeycomb bodies using radiant heaters
12/12/2002US20020185524 Bonded niobium silicide and molybdenum silicide composite articles using brazes
12/12/2002US20020185198 Repair of single crystal nickel based superalloy article
12/12/2002DE10221613A1 Verfahren und Vorrichtung zum martensitfreien Löten Method and apparatus for soldering martensitfreien
12/11/2002EP1265469A2 Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed
12/11/2002EP1263692A1 Method for assembling parts made of materials based on sic by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method
12/11/2002CN1384773A Composition for preventing creeping of flux for soldering and use thereof
12/11/2002CN1384699A Tin solder jointing method and electronic circuit base board and electronic equipment made in the said method
12/11/2002CN1383956A Welding flux and welding slag separator
12/11/2002CN1095717C Use of silver-copper-palladium brazing alloy and method of manufacturing composite device using the same
12/11/2002CN1095715C Method for brazing part of aluminium and/or aluminium alloy
12/10/2002US6491205 Assembly of multi-chip modules using eutectic solders
12/10/2002US6491204 Stencil wiping device
12/05/2002WO2002097160A1 Coating forming method and coating forming material, and abrasive coating forming sheet
12/05/2002WO2002096588A1 Component, method for producing said component and use of the same
12/05/2002US20020182842 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module
12/05/2002US20020182436 Freestanding reactive multilayer foils
12/05/2002US20020182070 Bonded niobium silicide and molybdenum silicide composite articles and method of manufacture
12/05/2002US20020179696 Solder-ball bonding device and method
12/05/2002US20020179695 Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed
12/05/2002US20020179693 Method and device for flow soldering
12/05/2002US20020179690 Flux applying method, flow soldering method and devices therefor and electronic circuit board
12/05/2002US20020179679 Three-dimensional soldering inspection apparatus and method
12/05/2002US20020179322 Method of packaging electronic components without creating unnecessary solder balls
12/05/2002US20020179297 Heat exchanger
12/05/2002US20020179295 Evaporator consisting of stacked flat tubes having two opposite fluid boxes
12/05/2002US20020178705 Filtering apparatus
12/04/2002EP1263270A2 A method of packaging electronic components without creating unnecessary solder balls
12/04/2002EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
12/04/2002EP1262267A1 Bonded niobium silicide and molybdenum silicide composite articles using germanium and silicon based brazes
12/04/2002EP1140416B1 Brazing composition and method for brazing parts made of alumina-based materials with said composition
12/04/2002EP0758937B1 Process for soldering metal structures with a bonding material comprising different states
12/04/2002CN1383566A Covered conductork, soldering method using covered conductor, and electric acoustic converter
12/03/2002US6489678 High performance multi-chip flip chip package
12/03/2002US6489277 Quasi-azeotropic mixture based on 1,1,1,3,3-pentafluorobutane, methylene chloride and methanol for the treatment of solid surfaces
12/03/2002US6488199 Method for improving the manufacturing safety of weld joints
11/2002
11/28/2002US20020175204 Sealing system for electronic device and sealing method therefor
11/27/2002EP1260302A1 Method for laser working, especially for laser soldering and/or laser welding, of workpieces with a high reflectivity
11/27/2002EP1259772A1 Modular furnace system
11/27/2002EP0921887B1 Method and apparatus for forming termination stripes
11/27/2002CN1095316C Method and device for wave soldering
11/26/2002US6485025 Metallic cellular structure
11/26/2002US6484926 Vapor phase reflow system with superheated vapor
11/26/2002US6484923 Hand held flux and solder feeding tool
11/21/2002US20020171157 Electronic device
11/21/2002US20020170947 Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument
11/21/2002US20020170942 Method for forming a flip chip semiconductor package
11/21/2002DE10124328A1 Device for unsoldering electronic component has heat source at distance from bearer's component side so solder joint heating to melting point takes place indirectly by heating component
11/20/2002EP1259101A1 Method and device for flow soldering
11/20/2002EP1258545A1 Method for isothermal brazing of single crystal components
11/20/2002EP1258312A2 Repair of a single crystal nickel based superalloy article
11/19/2002CA2157264C Method and apparatus for fluxing and soldering terminals on a printed circuit board
11/14/2002WO2002091800A1 Mosi2 arc-shaped heater, and method and device for manufacturing the heater
11/14/2002WO2002091395A1 Interface materials and methods of production and use thereof
11/14/2002WO2002090734A1 Sheet film with sliding structure, honeycomb body and method for production thereof
11/14/2002WO2002090032A1 Method of brazing thin heat exchanging plates and brazed plate heat exchanger produced according to the method
11/14/2002US20020168537 Article having turbulation and method of providing turbulation on an article
11/14/2002DE10122082C1 Blechfolie mit Gleitstruktur, Wabenkörper und Verfahren zu seiner Herstellung Metal sheet with slide structure, the honeycomb body and process for its preparation
11/14/2002CA2442034A1 Interface materials and methods of production and use thereof
11/13/2002EP1256408A1 Soldering method for joining flex circuits by diode laser
11/13/2002EP0827438B1 Amorphous alloy and solder made from amorphous alloy
11/12/2002US6479318 Method of manufacturing a substrate with directionally anisotropic warping
11/12/2002US6478215 Automatic wave soldering apparatus and method
11/12/2002US6478213 Fluxless fabrication of a multi-tubular structure
11/12/2002CA2165338C A method of brazing
11/07/2002WO2002087814A1 A process of making a shaped product
11/07/2002US20020163085 Pb-free solder-connected structure and electronic device
11/07/2002US20020162880 Apparatus and method for removing interconnections
11/07/2002US20020162780 Solder dross removal apparatus
11/06/2002EP1254734A1 Solder dross removal apparatus
11/06/2002EP0988128B1 Processing station for heat treatment of surfaces using a process gas
11/06/2002CN1378638A Method for manufacturing double-walled heat exchanging tube with leak detection and said heat exchanging tube
11/06/2002CN1377753A Ag solder for welding and soldering method using it
11/05/2002US6475637 Liquid interface diffusion bonded composition and method
11/05/2002US6475301 Conversion coatings on aluminum from KF solutions
11/05/2002US6474537 Soldering method using a Cu-containing lead-free alloy
11/05/2002US6474530 Adaptor assembly for interchangeably mounting hot air solder reflow nozzles to soldering/desoldering apparatus
10/2002
10/31/2002WO2002087297A1 Electronic apparatus
10/31/2002US20020157737 Nickel diffusion braze alloy and method for repair of superalloys
10/31/2002US20020157486 Solderability testing apparatus and solderability testing method
10/30/2002EP1253379A2 Methods and apparatus for cooling gas turbine engine combustors
10/30/2002CN1377025A Lead wire connecting structure and method and coating materials used in lead wire connection
10/29/2002US6472607 Electronic circuit board with known flow soldering warp direction
10/29/2002US6471115 Process for manufacturing electronic circuit devices
10/29/2002US6471111 Method and apparatus for acoustic pressure assisted wave soldering
10/29/2002US6471109 Method and apparatus for soldering and soldering land of a printed circuit board
10/29/2002US6470570 Method for making a tube for a heat exchanger having a fin insert with transverse convolutions
10/29/2002US6470569 Method for producing a compact catalytic reactor