| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 07/15/2004 | US20040134973 Optically baffled solder sleeve heating station |
| 07/15/2004 | DE10304774B3 Workpiece or component heating method for formation of solder connection using convection heating via heated gas flow |
| 07/14/2004 | EP1437192A2 Method and apparatus for dispensing small amounts of liquid material |
| 07/14/2004 | EP1437185A1 Method for manufacturing an aluminium alloy wheel rim |
| 07/14/2004 | EP1436827A2 Device for soldering contacts on semiconductor chips |
| 07/14/2004 | CN2625092Y Four-cabin continuous vacuum braze welding furnace |
| 07/13/2004 | US6761993 Electrode plate unit for rechargeable battery and manufacturing method thereof |
| 07/13/2004 | US6761304 Heating head for soldering and de-soldering of SMD components |
| 07/13/2004 | US6761302 Device mounting method |
| 07/13/2004 | US6761301 Soldering machine |
| 07/08/2004 | WO2004037454B1 Double wall nickel or nickel alloy coated stainless steel tubing |
| 07/08/2004 | US20040131877 Article having turbulation and method of providing turbulation on an article |
| 07/08/2004 | US20040129765 Junction box and soldering method for printed circuit board of the junction box |
| 07/08/2004 | US20040129758 Die bonding apparatus |
| 07/08/2004 | US20040129412 Method for making a heat exchanger with soldered plates and resulting heat exchanger |
| 07/08/2004 | DE4312642B4 Verfahren und Vorrichtung zum Kontaktieren Method and apparatus for contacting |
| 07/08/2004 | DE10261422A1 Laser welding and soldering method involves adjusting sub-beams in respect of their energy distribution, focal point rotation and/or working point separation by adjusting beam separating devices |
| 07/08/2004 | DE10261073A1 Verfahren zum Fügen von Werkstücken aus Titanaluminid mittels eines Lötverfahrens A method for assembling titanium aluminide workpieces by means of a soldering |
| 07/08/2004 | DE10257803A1 Schutzgasgemisch für das Laser-Löten von Metallwerkstoffen Shielding gas mixture for laser soldering of metallic materials |
| 07/08/2004 | DE10257802A1 Schutzgasgemisch für das Laser-Löten von Metallwerkstoffen Shielding gas mixture for laser soldering of metallic materials |
| 07/07/2004 | CN1511072A Process of making shaped product |
| 07/06/2004 | US6759738 Systems interconnected by bumps of joining material |
| 07/06/2004 | US6759687 Aligning an optical device system with an optical lens system |
| 07/06/2004 | US6759629 Method for connecting a first object to a second object which has a partly open structure |
| 07/06/2004 | US6758389 Composition for preventing creeping of a flux for soldering and use thereof |
| 07/06/2004 | US6758388 Titanium aluminide honeycomb panel structures and fabrication method for the same |
| 07/06/2004 | US6758387 Electroplating difficult to solder material with easier to solder one; hot dipping; applying ultrasonic waves; adhesion to plated portions |
| 07/06/2004 | US6758384 Three-dimensional soldering inspection apparatus and method |
| 07/06/2004 | US6758108 Solderability testing apparatus and solderability testing method |
| 07/01/2004 | US20040126612 Different materials bonded member and production method thereof |
| 07/01/2004 | US20040126269 Solder for use on surfaces coated with nickel by electroless plating |
| 07/01/2004 | US20040124232 Furnace brazing process |
| 07/01/2004 | US20040123439 Clamp for ring parts |
| 06/30/2004 | EP1433564A1 System and method for hermetic seal formation |
| 06/30/2004 | EP1433559A2 Brazing method for workpieces made of titanium aluminide |
| 06/30/2004 | CN2621867Y Self-spreading welding for ceramic inner lining composite cast pipe |
| 06/29/2004 | US6756680 Flip chip C4 extension structure and process |
| 06/29/2004 | US6756132 Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials |
| 06/29/2004 | US6755339 Fluxing apparatus for applying powdered flux |
| 06/24/2004 | US20040121180 metallic core having an aluminium-silicon alloy clad layer and a further metal layer to form a filler metal; iron alloy with tin, zinc, manganese, and/or copper |
| 06/24/2004 | US20040119247 System and method for hermetic seal formation |
| 06/24/2004 | US20040118898 Spatial integration of pipeline datasets |
| 06/24/2004 | US20040118679 Target and manufacturing method thereof |
| 06/23/2004 | EP1431242A2 Bonding method for flip-chip semiconductor device, mems device package and package method using the same |
| 06/23/2004 | EP1175276B1 Material inspection |
| 06/23/2004 | CN1507379A Method of brazing thin heat exchanging plates and brazed plate heat exchanger produced according to the method |
| 06/23/2004 | CN1507023A Side welding method for flip-chip semiconductor device |
| 06/22/2004 | US6753094 Aluminum or alloy substrate coupled to acrylic acid-ethylene layer filled with flux material |
| 06/22/2004 | US6752710 Controlled atmosphere zones and exhaust stacks with nozzles to accelerate the exhaust flow, measuring the flow and at a predetermined level |
| 06/22/2004 | US6752310 Electrically conductive wire |
| 06/22/2004 | US6752308 Diebond strip |
| 06/17/2004 | WO2004050287A1 Method for soldering miniaturised components to a base plate |
| 06/17/2004 | WO2003089176A3 Flux coated brazing sheet |
| 06/17/2004 | US20040115088 Lead-free solder |
| 06/17/2004 | US20040112935 Integrated flex substrate metallurgical bonding |
| 06/17/2004 | US20040112474 Lead-free solder ball |
| 06/17/2004 | DE10253954A1 Process for attaching electronic components such as ball grid arrays and flip chips to a carrier, involves using a prehardened adhesive layer which is softened by radiation |
| 06/16/2004 | EP1428610A1 Protective gas for laser soldering of metallic materials |
| 06/16/2004 | EP1428604A1 Protective gas for laser soldering of metallic materials |
| 06/16/2004 | EP1428603A2 Furnace brazing process |
| 06/16/2004 | CN1505137A Semiconductor device |
| 06/15/2004 | US6750431 Electric component removing device |
| 06/15/2004 | US6749901 Initial emissivity of higher mass workpiece portion is substantially less than 0.2, and is enhanced by thermally sprayed surface material |
| 06/15/2004 | US6749105 Method and apparatus for securing a metallic substrate to a metallic housing |
| 06/15/2004 | US6749104 Heat exchanger manufacturing methods and brazing filler metal compositions useful therein, characterized by low nickel leaching rates |
| 06/10/2004 | WO2004037454A3 Double wall nickel or nickel alloy coated stainless steel tubing |
| 06/10/2004 | US20040110366 Forming solder balls on substrates |
| 06/10/2004 | US20040108366 Iron-chromium base brazing filler metals |
| 06/10/2004 | US20040108365 Method and apparatus for positioning solder or braze material on the fins |
| 06/09/2004 | EP1426071A2 Guidewire with superelastic distal portion |
| 06/09/2004 | EP1147355B1 Manifold for heat exchanger |
| 06/09/2004 | DE10351541A1 Arrangement for soldering a metal block comprises fixing elements acting as supports for soldering material |
| 06/09/2004 | DE10255088A1 Method for forming soldered joints e.g. for electronics and modular engineering, involves using laser heating source with spatially restricting beam forming |
| 06/09/2004 | CN1503769A Multilayer foil capable of independent reaction |
| 06/09/2004 | CN1503343A Method and device for holding chip in package |
| 06/09/2004 | CN1502439A Method for constraining the spead of solder during reflow for preplated high wettability lead frame flip chip assembly |
| 06/08/2004 | US6745932 Low strain chip removal apparatus |
| 06/08/2004 | US6745931 Method for the production of a sealing element |
| 06/03/2004 | WO2004019377A3 Method for metallurgically joining a tube to a member |
| 06/03/2004 | US20040106294 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
| 06/03/2004 | DE10245788B3 Heat exchanger making process for vehicle air conditioner involves first assembling tubes and collector boxes and soldering them, then inserting fins in intermediate regions |
| 06/02/2004 | EP1424748A2 Microelectronic contacts and assemblies |
| 06/02/2004 | EP1424158A1 A method for fabricating, modifying or repairing of single crystal or directionally solidified articles |
| 06/02/2004 | EP1424156A1 Process for soldering miniaturized components onto a base plate |
| 06/02/2004 | EP1423225A2 Soldering method for metallic fastening elements |
| 06/02/2004 | EP1423224A1 Method and device for applying a solder material to a metallic structure by means of vibration |
| 06/02/2004 | CN1501490A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/01/2004 | US6742702 Gas injection type soldering method and apparatus |
| 06/01/2004 | US6742701 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
| 06/01/2004 | US6742699 Method for manufacturing a cooling element and a cooling element |
| 06/01/2004 | US6742694 Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
| 05/27/2004 | US20040099715 System and method for seal formation |
| 05/27/2004 | US20040099709 Griper and method for detaching packaged chip from PCB |
| 05/27/2004 | DE10252577A1 Connecting solder partners used in die bonding or chip bonding comprises heating the solder partners so that a solder depot melts and is pulled by capillary forces into a joining region to join the solder partners |
| 05/26/2004 | EP1422017A2 Welded structure with stress relief slot and LNG schip with such structure |
| 05/26/2004 | EP1422010A1 Soldered copper heat exchangers and welding method of manufacturing them |
| 05/26/2004 | CN1498702A Method for manufacturing brazed composited tube |
| 05/26/2004 | CN1151008C High-strength welding head |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740178 Method for producing a sintered honeycomb body |