| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 02/13/2003 | US20030031418 Ball grid array element and optical communication module using the same |
| 02/13/2003 | US20030029782 Solder dross removal apparatus and method |
| 02/12/2003 | EP1283664A2 Flat conductor and process for making a solder connection therewith |
| 02/12/2003 | EP1283086A2 Solder dross removal apparatus and method |
| 02/12/2003 | EP1283085A1 Method and apparatus for thermal assembling of connecting areas of two substrates |
| 02/12/2003 | CN1396850A Method of linking steel tubes with aluminium ribs |
| 02/12/2003 | CN1396803A Dip soldering method and dip soldering device |
| 02/12/2003 | CN1396037A High-temp soldering method for aluminium nitride and copper |
| 02/12/2003 | CN1396033A Method for making heat exchanger |
| 02/12/2003 | CN1101642C Method and apparatus for producing electronic circuit device |
| 02/06/2003 | US20030024966 Process and device for soldering electrical components on a plastic sheet |
| 02/06/2003 | US20030024963 Die bonding apparatus |
| 02/04/2003 | US6513701 Method of making electrically conductive contacts on substrates |
| 02/04/2003 | CA2224772C Gas knife cooling system |
| 02/03/2003 | WO2002042031A1 Layered heat-resistant alloy plate and method of producing the same |
| 01/30/2003 | US20030020183 Semiconductor device without use of chip carrier and method for making the same |
| 01/30/2003 | US20030019918 Rework methods for lead BGA/CGA |
| 01/30/2003 | US20030019917 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
| 01/30/2003 | US20030019915 Layer of a zinc-aluminum alloy is applied onto surface of the steel tube or the aluminum rib, and then a fluxing agent of cesium-aluminum tetrafluoride is deposited between the steel tube and the rib then heated to solder |
| 01/30/2003 | US20030019914 Method for the production of a sealing element |
| 01/30/2003 | US20030019912 Outer cover shell and plate member soldering method |
| 01/30/2003 | US20030019846 Flex to flex soldering by diode laser |
| 01/30/2003 | US20030019761 Immersing brazed nickel-base alloy components joined by nickel alloy brazing composition in electrolyte, applying potential at magnitude wherein nickel base alloy components are electrochemically passive and brazing alloy dissolves |
| 01/30/2003 | US20030019656 Covered conductor, soldering method using the covered conductor, and electric acoustic converter |
| 01/30/2003 | US20030019576 Electronic component removal method through application of infrared radiation |
| 01/29/2003 | EP1279457A2 Manufacturing method of sealing elements |
| 01/29/2003 | EP1278631A2 Method of making reactive multilayer foil and resulting product |
| 01/29/2003 | CN1394112A Soldering paste printing method and equipment for printing soldering paste on wiring pattern board |
| 01/28/2003 | US6512205 Gettering system for brazing heat exchangers in CAB furnace |
| 01/28/2003 | US6511759 Means and method for producing multi-element laminar structures |
| 01/28/2003 | US6510978 Solder jet machine and soldering method |
| 01/28/2003 | US6510976 Method for forming a flip chip semiconductor package |
| 01/28/2003 | CA2068583C A joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal |
| 01/23/2003 | US20030015588 Point-of-sale (POS) based bar code driven cash register system with an integrated internet-enabled customer-kiosk terminal |
| 01/23/2003 | US20030015572 Successive integration of multiple devices process and product |
| 01/23/2003 | US20030015571 Method for continuous high-speed welding of double-ply metal tubes and welding furnace for performing the same |
| 01/23/2003 | US20030015090 Controlled atmosphere zones and exhaust stacks with nozzles to accelerate the exhaust flow, measuring the flow and at a predetermined level |
| 01/23/2003 | DE10123852C1 Verfahren zur Laserbearbeitung, insbesondere zum Laserlöten und/oder Laserschweissen, von Teilen mit hoher Reflektivität A method for laser machining, in particular for laser brazing and / or laser welding, of parts with high reflectivity |
| 01/22/2003 | EP0988129B1 Method and device for repairing defective soldered joints |
| 01/22/2003 | CN1392816A Coating method and device for solder material |
| 01/22/2003 | CN1392760A Electronic element assembling method without producing unnecessary welding balls |
| 01/22/2003 | CN1392025A Forming method for high resolution welding lug |
| 01/22/2003 | CN1392024A Forming method for high resolution welding lug |
| 01/21/2003 | US6509543 Semiconductor laser heating apparatus |
| 01/16/2003 | WO2002076664A3 System and process for the treatment of gaseous emissions |
| 01/16/2003 | US20030010825 Point of sale (POS) based bar code reading system with integrated internet-enabled customer-kiosk terminal |
| 01/16/2003 | US20030010810 Diebond strip |
| 01/16/2003 | US20030010808 Methods for hermetically sealing microchip reservoir devices |
| 01/16/2003 | US20030010484 Tank of heat exchanger and method of producing same |
| 01/16/2003 | US20030010480 Exhaust gas heat exchanger |
| 01/16/2003 | US20030010475 Method for fixing components to a pipe for circulation of a fluid forming part of a heat exchanger, in particular a condenser of an air-conditioning system |
| 01/16/2003 | CA2393309A1 Solder shaping process and apparatus |
| 01/16/2003 | CA2354546A1 Solder shaping process using a light source |
| 01/15/2003 | EP1275926A2 Tank of heat exchanger and method of producing same |
| 01/15/2003 | EP1275536A1 Method for fixing components to a pipe for circulation of a fluid forming part of a heat exchanger, in particular a condenser of an air-conditioning system |
| 01/15/2003 | EP1275463A2 Pb-free solder-connected electronic device |
| 01/15/2003 | EP1275462A1 Method and apparatus for soldering electronic devices to a polymer film |
| 01/15/2003 | EP1274964A1 Notched finned heat sink structure |
| 01/15/2003 | EP1274536A1 Novel use for complex fluorides |
| 01/15/2003 | EP1274532A1 Method for applying a silver solder to a tooth in a solder device |
| 01/15/2003 | EP0994777B1 Method for producing a metallic or ceramic body |
| 01/15/2003 | CN1391618A Process for selective deposition of copper substrates |
| 01/15/2003 | CN1390670A Technology for welding golf club head and structure of golf club head |
| 01/15/2003 | CN1099120C Metal-ceramic composition chip, production method therefor, and soldering material for said method |
| 01/14/2003 | US6505553 Screen printing method and screen printing apparatus |
| 01/09/2003 | WO2003003800A1 Successive integration of multiple devices process and product |
| 01/09/2003 | WO2003002282A1 Method of manufacturing heat transfer tubes |
| 01/08/2003 | EP1273377A2 Manufacturing method of heat exchanger |
| 01/08/2003 | EP1272802A2 Method for manufacturing a cooling element and a cooling element |
| 01/08/2003 | EP1272361A1 Microstructures and method for wafer to wafer bonding |
| 01/08/2003 | CN1098373C Method for cleaning parts |
| 01/07/2003 | US6504105 Solder ball connections and assembly process |
| 01/07/2003 | US6503640 Method of manufacturing an assembly of brazed dissimilar metal components |
| 01/07/2003 | US6503351 Use of a cleaning process, a cleaning process, a connection process and a workpiece pair |
| 01/07/2003 | US6503349 Heating a repair alloy to a temperature that avoids recrystallization and repair zone incipient melting; rapid cooling and aging; stability of mechanical properties; joint strength; fatique; gas turbine high-pressurue vanes |
| 01/07/2003 | US6503336 Techniques for modifying a circuit board using a flow through nozzle |
| 01/07/2003 | US6502740 Solder a lead wire of an electronic device to a wiring pattern formed on a printed circuit board, the electronic device is first placed on a first face of the printed circuit board such that the lead wire thereof are protruded from a second face |
| 01/02/2003 | US20030002981 Bonded niobium silicide and molybdenum silicide composite articles using germanium and silicon based brazes |
| 01/02/2003 | US20030001010 Point-of-sale (POS) station having a based bar code driven cash register system with an integrated internet-enabled customer-kiosk terminal |
| 01/02/2003 | US20030001000 Method of manufacturing heat transfer tubes |
| 01/02/2003 | US20030000994 Transducer and a bonding apparatus using the same |
| 01/02/2003 | US20030000611 Method for continuous heat-treatment of metals under argon atmosphere |
| 01/02/2003 | EP1270749A1 Method for continuous heat-treatment of metals under argon atmosphere |
| 01/02/2003 | EP1270130A1 Apparatus and method for producing a soldered joint between two parts having a common plane of contact |
| 01/02/2003 | EP1270129A2 Selective removal of brazing compound from joined assemblies |
| 01/02/2003 | EP1269099A2 Method for manufacturing a double-walled heat exchanging tube with leak detection |
| 01/02/2003 | EP1268190A2 Improved electrical conductivity and high strength aluminium alloy composite material and methods of manufacturing and use |
| 01/01/2003 | CN1387974A Non-matched one step ceramic-metal sealing for switching vacuum tube |
| 12/31/2002 | US6501044 Method for welding the surfaces of materials |
| 12/31/2002 | US6499994 Heating apparatus in reflow system |
| 12/31/2002 | US6499645 Automatic soldering apparatus |
| 12/31/2002 | US6499644 Rework and underfill nozzle for electronic components |
| 12/27/2002 | WO2002103262A1 Brazed heat transfer element |
| 12/27/2002 | WO2002102539A2 Honeycomb cell structure and method of manufacture |
| 12/27/2002 | WO2002067647A3 Bonder |
| 12/26/2002 | US20020198427 Providing silicoaluminophosphate molecular sieve having catalytic sites; providing a shield to protect the catalytic sites from contact with water molecules; removing the shield; contacting with oxygenate feedstock to produce olefin product |
| 12/26/2002 | US20020195479 Device and process for producing a soldered joint between two joining partners which can be joined by means of a common contact surface |
| 12/26/2002 | US20020195476 Head assembly of a disk apparatus having a head IC chip mounted on a suspension by ultrasonic bonding |
| 12/25/2002 | CN1387468A Method and device for producing soldered joint |
| 12/25/2002 | CN1387241A Method for forming packaging of flip-chip semiconductor |