| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 04/08/2004 | WO2003072289A3 Method of producing metallic packaging |
| 04/08/2004 | US20040065718 Solder joint structure and method for soldering electronic components |
| 04/08/2004 | US20040065392 Manufacturing process for a plated product comprising a support part in steel and an anticorrosion metallic coating |
| 04/08/2004 | DE10342964A1 Flachdrahtreparaturwerkzeugsysteme und -verfahren Flat wire repair tool systems and procedures |
| 04/08/2004 | DE10246540A1 Reinigungsvorrichtung und Verfahren zur Reinigung von Prozessgas einer Reflowlötanlage Cleaning apparatus and method for cleaning a process gas reflow soldering |
| 04/07/2004 | EP1405687A2 Method and device for flow soldering |
| 04/07/2004 | EP1214168B1 System for monitoring and controlling a welding/brazing operation |
| 04/07/2004 | CN1488063A Innerfin for heat exchanger flat tubes and evaporator |
| 04/07/2004 | CN1487123A Pre-electroplating treatment process of electronic element and device to prevent electrical performance degradation |
| 04/07/2004 | CN1486813A Soft brazing method |
| 04/07/2004 | CN1144644C Method for setting reflux furnace parameters for soldering surface mounted element |
| 04/06/2004 | US6715667 Method of joining steel tubes with aluminum ribs |
| 04/06/2004 | US6715662 Waste energy recovery system for a controlled atmosphere system |
| 04/06/2004 | US6715203 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 04/06/2004 | CA2035383C Method for improving the solderability of corrosion resistant heat exchange tubing |
| 04/01/2004 | WO2004026517A2 Solder hierarchy for lead free solder joint |
| 04/01/2004 | US20040063058 Convection furnace thermal profile enhancement |
| 04/01/2004 | US20040060971 Method for the production of a soldered connection |
| 04/01/2004 | US20040060970 Under bump metallurgy for Lead-Tin bump over copper pad |
| 04/01/2004 | US20040060969 Structure and method for connecting flexible printed circuit board to inkjet print head |
| 04/01/2004 | US20040060960 Selective gas knife for wave soldering |
| 03/31/2004 | EP1402988A1 The use of a solder on surfaces coated with nickel by electroless plating |
| 03/31/2004 | EP1401610A1 Brazing material and brazed product manufactured therewith |
| 03/31/2004 | EP0739221B1 Guidewire with superelastic distal portion |
| 03/31/2004 | CN1144018C Method for manufacturing double-walled heat exchanging tube with leak detection and said heat exchanging tube |
| 03/30/2004 | US6713714 Method and device for thermally connecting the contact surfaces of two substrates |
| 03/30/2004 | US6712261 Solid conductive element insertion apparatus |
| 03/30/2004 | US6712260 Bump reflow method by inert gas plasma |
| 03/25/2004 | US20040058192 Can be applied to a wiring structure, a circuit |
| 03/25/2004 | US20040058183 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection |
| 03/25/2004 | US20040056550 Stator for an electric machine and method for producing the same |
| 03/25/2004 | US20040056078 Individual selective rework of defective BGA solder balls |
| 03/25/2004 | US20040056074 Comprises iron based alloy/brazing material produced by gas/water atomising or melt-spinning; for heat exchangers |
| 03/25/2004 | US20040056068 Reflow soldering apparatus and method for selective infrared heating |
| 03/25/2004 | US20040056067 Process and apparatus for flow soldering |
| 03/25/2004 | US20040055784 Solder interconnections for flat circuits |
| 03/25/2004 | DE10242835A1 Soldering process for producing diamond adjusting toothed wheels or rollers comprises using a hard solder which takes over the function of the nickel coating instead of galvano-forming with nickel |
| 03/25/2004 | DE10241662A1 Ribbon cable conductor soldering process monitoring method using detection and evaluation of counter magnetic field variations for determining temperature and conductivity variations |
| 03/25/2004 | DE10241658A1 Partially soldering electrical conductors, comprises removing the insulation from the conducting material, heating the conductor by induction, and supplying solder and flux |
| 03/24/2004 | EP1400300A1 Layered heat-resistant alloy plate and method of producing the same |
| 03/24/2004 | EP1399699A1 Brazed heat transfer element |
| 03/24/2004 | EP1399280A1 Method of manufacturing heat transfer tubes |
| 03/24/2004 | EP1399135A2 Methods for hermetically sealing microchip reservoir devices |
| 03/24/2004 | CN1142843C Pb-free solder-connected structure and electronic device |
| 03/23/2004 | US6710239 Electrodes coated with lead-free solder; fired metal paste contains powdery silver, powdery glass, an organic vehicle, an organic solvent, phosphorous oxide, and/or halide; pollution control |
| 03/23/2004 | US6709890 Method of manufacturing semiconductor integrated circuit device |
| 03/23/2004 | US6708869 Method for production of heat exchanger |
| 03/23/2004 | US6708862 Die bonding apparatus |
| 03/23/2004 | US6708756 Method for fixing components to a pipe for circulation of a fluid forming part of a heat exchanger, in particular a condenser of an air-conditioning system |
| 03/23/2004 | US6708730 Temporary fixing structure for tubular bodies |
| 03/23/2004 | CA2145555C Differential coating for micro extruded tubes used in parallel flow heat exchangers |
| 03/18/2004 | US20040052050 Polymer solder hybrid |
| 03/18/2004 | US20040050915 System and method for mounting electronic components onto flexible substrates |
| 03/18/2004 | US20040050910 Flatwire repair tool systems and methods |
| 03/18/2004 | US20040050905 Processing device, processing method, and production equipment using the device and the method |
| 03/18/2004 | US20040050904 Solder hierarchy for lead free solder joint |
| 03/18/2004 | US20040050541 Inner fin for heat exchanger flat tubes and evaporator |
| 03/18/2004 | DE10240355A1 Composite component used in the production of optical lenses and filters comprises bodies joined together by a solder connection free from a fluxing agent |
| 03/18/2004 | DE10239141A1 Laser soldering method for two sheet metal workpieces, involves heating solder using an electric current prior to its supply to the are to be joined |
| 03/17/2004 | EP1179167B1 Heat exchanger and method for producing a heat exchanger |
| 03/17/2004 | EP1023136B1 Flux management system |
| 03/16/2004 | US6706219 Comprises resin of vinyl terminated polydimethyl siloxane, methylhydrosiloxane-dimethylsiloxane copolymers, polysilicate, silicone rubber formed with use of karstedt cataylst; heat dissipation; heat resistant semiconductors |
| 03/16/2004 | US6705513 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 03/16/2004 | US6705510 Valve housing fabrication process enabling complete coverage of joint surfaces with protective coating |
| 03/16/2004 | US6705509 Method of recovering lead-free solder from printed circuit boards |
| 03/16/2004 | US6705506 Inert atmosphere soldering apparatus |
| 03/16/2004 | CA2087109C Method of making a brazeable metal pipe having tube-insertion apertures formed with guide lugs |
| 03/11/2004 | US20040049758 Component mounting control method |
| 03/11/2004 | US20040046005 Stack package and manufacturing method thereof |
| 03/11/2004 | US20040045642 Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor |
| 03/11/2004 | US20040045455 Position adjustment in laser-assisted pressing |
| 03/11/2004 | DE10240353A1 Manufacture of contact elements for electrical power switches has conductor material continuously fed to press to provide elements fitted with contacts |
| 03/11/2004 | DE10237494A1 System, for soldering electronic component, includes a vapor phase within a sealed chamber that is evacuated using a low pressure |
| 03/10/2004 | EP1395384A2 Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same |
| 03/10/2004 | CN1480288A Method for directly coating welding agent on brazing surface |
| 03/09/2004 | US6703069 Under bump metallurgy for lead-tin bump over copper pad |
| 03/09/2004 | US6702177 Manufacturing process for a plated product comprising a support part in steel and an anticorrosion metallic coating |
| 03/09/2004 | US6702175 Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| 03/09/2004 | US6701598 Joining and forming of tubular members |
| 03/04/2004 | WO2004019377A2 Method for metallurgically joining a tube to a member |
| 03/04/2004 | WO2004019376A2 Method for metallurgically joining a tube to a member |
| 03/04/2004 | WO2004018098A1 Method and device for the production of honeycomb members, and honeycomb member |
| 03/04/2004 | WO2003012833A3 Process and apparatus for mounting semiconductor components to substrates and parts therefor |
| 03/04/2004 | US20040041012 Low strain chip removal apparatus |
| 03/04/2004 | US20040041011 Method and apparatus for removing known good die |
| 03/04/2004 | US20040041010 Exothermic processing |
| 03/04/2004 | US20040040153 Method for manufacturong heat exchanger |
| 03/04/2004 | DE10239205A1 Verfahren und Vorrichtung zur Herstellung von Wabenkörpern und Wabenkörper Method and apparatus for manufacturing honeycomb bodies and the honeycomb body |
| 03/04/2004 | DE10238551A1 Production of a composite component used as a sealing element in gas turbines comprises joining a structure to a support by soldering using aluminum as the solder material |
| 03/03/2004 | EP1394100A2 Apparatus and method for controlling movement of a device after packaging |
| 03/03/2004 | CN1480015A Method for making solder between metallic balls of electronic components and mounting lands of circuit and soldering furnace therefor |
| 03/03/2004 | CN1479918A SBB machine and method for HGA mass production |
| 03/03/2004 | CN1479661A Working device and working method, and production equipment using it |
| 03/03/2004 | CN1479568A Wave soldering equipment |
| 03/03/2004 | CN1140373C Welding method |
| 03/02/2004 | US6699306 Dip soldering printed circuit board with surfaced copper foil and component having a copper lead attached thereto; replenishment; lead-free solders |
| 03/02/2004 | US6698936 Tool for constructing a pair of races of a bearing |
| 03/02/2004 | US6698649 Desolder apparatus |
| 03/02/2004 | US6698644 Joins titanium to stainless steel in single tube coriolis mass flow sensor |
| 03/02/2004 | US6698346 Screen-printing material replenishing device |