| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 06/05/2002 | EP1211011A1 Solder coating material and production method therefor |
| 06/05/2002 | EP1211010A2 Method of induction brazing transformer strands to base plate |
| 06/05/2002 | CN1352585A Method for producing radiator |
| 06/04/2002 | US6399902 Inline flux measurement system |
| 06/04/2002 | US6399019 Silver and active metal optionally with copper or titanium oxide paste; temperature lower than eutectic point; high strength; thermal impact resistance; power modules |
| 06/04/2002 | US6398104 Apparatus and method for inerting a wave soldering installation |
| 06/04/2002 | US6398103 Method of providing wear-resistant coatings, and related articles |
| 06/04/2002 | US6397939 Tube for use in serpentine fin heat exchangers |
| 06/04/2002 | US6397937 Heat exchanger and a method for producing a heat exchanger |
| 05/30/2002 | WO2002042610A2 Metallic honeycomb cellular seal-structure for a turbomachine |
| 05/30/2002 | WO2002042016A1 Method of processing printed board scrap and apparatus for the same |
| 05/30/2002 | WO2002017380A3 Selective flux deposition |
| 05/30/2002 | US20020064899 Semiconductor device substrate and semiconductor device fabrication method |
| 05/30/2002 | US20020064674 Part |
| 05/29/2002 | EP1209958A2 Laminated structure for electronic equipment and method of electroless gold plating |
| 05/29/2002 | EP1207979A2 Cobalt-base composition and method for diffusion braze repair of superalloy articles |
| 05/28/2002 | US6394794 Modular furnace system |
| 05/28/2002 | US6394281 Hermetic sealing |
| 05/28/2002 | US6394158 Method and device for thermally bonding connecting surfaces of two substrates |
| 05/28/2002 | CA2161770C Process and apparatus for the wave soldering of circuit boards |
| 05/23/2002 | US20020061490 Reflow furnace |
| 05/23/2002 | US20020060724 Ultrasonic bonding of ink-jet print head components |
| 05/23/2002 | US20020060380 Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| 05/23/2002 | US20020060235 Reflow soldering apparatus and method |
| 05/23/2002 | DE10150401A1 Optoelectronic component has solder connections between metallisation structures of optical component system and optical lens system |
| 05/22/2002 | EP1206674A1 Plate heat exchanger |
| 05/22/2002 | CN1085382C Conductive soldering paste material connection structure and method of manufacturing conductive soldering paste dendritic crystal material |
| 05/21/2002 | US6391252 Self-brazing; injection molding; sintering; turbine blades |
| 05/21/2002 | US6390668 Blackbody source using a heat pipe principle and transition region |
| 05/21/2002 | US6390355 Method for forming a metallic contact on an electronic printed circuit board and a product therefrom |
| 05/21/2002 | US6390353 Multilayer; visible seal; electronic packages |
| 05/21/2002 | US6390352 Method for bonding a tubular part in coaxial relationship with a part having a bore therein |
| 05/16/2002 | WO2002039463A2 Methods and system for attaching substrates using solder structures |
| 05/16/2002 | WO2002038327A1 Material for joining and product produced therewith |
| 05/16/2002 | WO2002038326A2 Brazing product having a low melting point |
| 05/16/2002 | WO2002038321A1 Method of manufacturing an assembly of brazed dissimilar metal components |
| 05/16/2002 | WO2002038320A1 Method for producing a soldered honeycomb body arrangement |
| 05/16/2002 | US20020058406 Bump forming method and bump forming apparatus |
| 05/16/2002 | US20020057557 Circuit unit and method of producing same |
| 05/16/2002 | US20020056742 Methods and systems for attaching substrates to one another using solder structures having portions with different melting points |
| 05/16/2002 | US20020056740 Flip chip bonding method |
| 05/16/2002 | US20020056710 Heating device |
| 05/16/2002 | DE10055910A1 Verbindungsverfahren Connection method |
| 05/16/2002 | DE10055650A1 Production of soldered honeycomb body arrangement comprises forming honeycomb body by stacking and/or winding sheet layers, inserting body into tool, soldering, transferring to casing or housing, and soldering |
| 05/16/2002 | DE10054467A1 Method for temperature monitoring during unsoldering of components from a circuit board in which the melting temperature is determined using simple mechanical and electrical means |
| 05/15/2002 | EP0798779B1 Ceramic circuit board |
| 05/15/2002 | CN1084652C Glow soldering method for ceramic and metal |
| 05/14/2002 | US6387540 Composite material formed by cladding one side of aluminum alloy core containing iron, manganese and nickel with corrosion-protective aluminum alloy containing zinc, iron and nickel and other side with filler aluminum-silicon alloy |
| 05/14/2002 | US6387527 Article comprising metal-based substrate and foil which comprises at least one bond coating fused to substrate by intervening layer of braze material |
| 05/14/2002 | US6386436 Method of forming a solder ball |
| 05/14/2002 | US6386429 Printed circuit board header attachment station |
| 05/14/2002 | US6386428 Multi-element composite object |
| 05/14/2002 | US6386422 Solder reflow oven |
| 05/14/2002 | CA2034209C Method, system and composition for soldering by induction heating |
| 05/10/2002 | WO2001054840A3 Method of linking steel tubes with aluminum ribs |
| 05/09/2002 | US20020053589 Material inspection |
| 05/09/2002 | US20020053588 Reflow method and reflow device |
| 05/08/2002 | CN2489911Y Welding glue removal machine |
| 05/07/2002 | US6383661 Method of manufacturing an aluminum product |
| 05/07/2002 | US6382502 Brazing fins of aluminum, magnesium, silicon alloy onto heat dissipating substrate |
| 05/07/2002 | US6382501 Furnace brazing |
| 05/07/2002 | US6382500 Solder reflow furnace with flux effluent collector and method of preventing flux contamination |
| 05/07/2002 | US6382497 Reflow soldering apparatus and method |
| 05/07/2002 | US6382307 Device for forming heat dissipating fin set |
| 05/07/2002 | CA2250735C Improving fillet forming of brazeable aluminum articles |
| 05/02/2002 | WO2002034448A1 Method for making a heat exchanger with soldered plates and resulting heat exchanger |
| 05/02/2002 | WO2002034447A1 Soldering method for producing a ceramic-metal joint |
| 05/02/2002 | US20020050346 Method of manufacturing a brazed-plate heat exchanger and exchanger thus produced |
| 05/02/2002 | US20020050217 Screen-printing material replenishing device |
| 05/02/2002 | DE10049664A1 Abtragen von Kontaktstellen (De-bumping) Removal of contact points (De-bumping) |
| 05/01/2002 | CN1347359A Composite sheet material for brazing |
| 05/01/2002 | CN1347357A Method for producing building components, use thereof, airbearing workpiece and vacuum treatment chamber |
| 04/30/2002 | US6380513 Method for fixing miniaturized components onto a base plate by soldering |
| 04/30/2002 | US6379818 Brazing sheet product and method of its manufacture |
| 04/30/2002 | US6378753 Gas distribution system which can be connected to a gas supply |
| 04/30/2002 | US6378203 Method of making fluid heat exchanger |
| 04/25/2002 | DE10049660A1 Verfahren zum Herstellen lokal verstärkter Blechumformteile A method for producing the locally enhanced formed sheet metal parts |
| 04/24/2002 | EP1198625A2 Brazing sheet product and method of its manufacture |
| 04/24/2002 | EP1198324A1 Method for assembling metal parts with an induction-heated metallic powder |
| 04/24/2002 | EP0883501B1 Light metal rim ring and method for constructing it |
| 04/24/2002 | CN1083685C Apparatus for the wave soldering of circuit boards |
| 04/23/2002 | US6375060 Fluxless solder attachment of a microelectronic chip to a substrate |
| 04/18/2002 | US20020045330 Kinetically controlled solder bonding |
| 04/18/2002 | US20020044821 Method for connecting a first object to a second object which has a partly open structure |
| 04/17/2002 | EP1198001A2 Method of testing and mounting devices using a resilient contact structure |
| 04/17/2002 | EP1091800B1 Method for producing a compact catalytic reactor |
| 04/17/2002 | EP1051278B1 Method for introducing solder into a system |
| 04/17/2002 | CN1082861C Ultrasonic vibration soldering apparatus |
| 04/16/2002 | US6371360 Method for applying brazing material to metal structures with an adhesive material having different states |
| 04/16/2002 | US6371354 Apparatus for the temperature regulation of electronic components |
| 04/11/2002 | WO2002028587A1 Method for bonding a surface pre-machined by electrical discharge machining |
| 04/11/2002 | WO2002028586A1 Method for applying solder to a substrate or a chip without using flux |
| 04/11/2002 | WO2002028585A2 Method for ablating points of contact (debumping) |
| 04/11/2002 | WO2002028584A1 System and method for mounting electronic components onto flexible substrates |
| 04/11/2002 | WO2002028583A1 System and method for mounting electronic components onto flexible substrates |
| 04/11/2002 | WO2002028582A2 Device for removing solder material from a soldered joint |
| 04/11/2002 | US20020041485 Circuit board cooling apparatus with air guide plates |
| 04/11/2002 | US20020041039 Semiconductor device without use of chip carrier and method for making the same |
| 04/11/2002 | US20020040804 Electrically conductive wire |
| 04/11/2002 | US20020040521 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |