| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 01/01/2004 | US20040000580 Forming solder structure with exterior tin oxide layer over under bump metallurgy; exposure to hydrogen, carbon tetrafluoride, and/or sulfur tetrafluoride; heating and cooling semiconductor |
| 01/01/2004 | US20040000576 Method and apparatus for producing a refined grain structure |
| 01/01/2004 | US20040000574 Solder applying method and solder applying apparatus |
| 12/31/2003 | WO2004000497A1 Fluxing apparatus for applying powdered flux |
| 12/31/2003 | CN1465208A Mosi2 arc-shaped heater, and method and device for manufacturing the heater |
| 12/30/2003 | US6670570 Methods and apparatus for localized heating of metallic and non-metallic surfaces |
| 12/30/2003 | US6669471 Furnace conveyer belt having thermal barrier |
| 12/30/2003 | US6669077 High-strength solder joint |
| 12/30/2003 | CA2245000C Unit construction plate-fin heat exchanger |
| 12/25/2003 | US20030234280 Braze system and method for reducing strain in a braze joint |
| 12/25/2003 | US20030234276 Strengthened bonding mechanism for semiconductor package |
| 12/25/2003 | US20030234272 Fluxing apparatus for applying powdered flux |
| 12/24/2003 | WO2003106374A1 Method for producing gas-tight and high-temperature resistant unions of shaped parts, which are made of a non-oxidic ceramic material, by using a laser |
| 12/24/2003 | WO2003106102A1 Water-base aluminum-brazing composition and process of brazing |
| 12/24/2003 | WO2003106101A1 Iron-chromium base brazing filler metals |
| 12/24/2003 | WO2003106093A2 Method and apparatus for vapour phase soldering |
| 12/24/2003 | WO2003106092A1 Process chamber of an installation for thermally treating printed circuit boards |
| 12/24/2003 | WO2003106091A1 Method for fixing metal foam to a metal plate |
| 12/24/2003 | WO2003106027A1 Non-cylindrical converter-carrier body and tool and method for the production thereof |
| 12/24/2003 | WO2003079743A3 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 12/24/2003 | WO2003070994A3 Lead-free tin-silver-copper alloy solder composition |
| 12/24/2003 | WO2002062517A3 Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same |
| 12/24/2003 | DE10249992C1 Durchsichtige Scheibe mit einer undurchsichtigen Kontaktfläche für eine Lötverbindung Transparent disk with an opaque contact surface for solder |
| 12/24/2003 | CN1463302A Coating forming method and coating forming material and abrasive coating forming sheet |
| 12/24/2003 | CN1462663A Method for mamufacturing oxidation resisting welding spots for surface adhesion components (SMD) |
| 12/23/2003 | US6666371 Sealing system for electronic device and sealing method therefor |
| 12/18/2003 | US20030230806 Method for manufacturing semiconductor device and electronic device and method for calculating connection condition |
| 12/18/2003 | US20030230623 Means for brazing palladium alloy elements intended for hydrogen purifier |
| 12/18/2003 | US20030230466 Conveyor belt cleaner scraper blade with sensor and control system therefor |
| 12/18/2003 | CA2775689A1 A method for attaching a porous metal layer to a metal substrate |
| 12/17/2003 | EP1372184A2 Electrode system for a metal halide lamp and lamp provided with such a system |
| 12/17/2003 | EP1371079A2 Miniature x-ray device and method of its manufacture |
| 12/17/2003 | EP1370817A1 Inner fin for heat exchanger flat tubes and evaporator |
| 12/17/2003 | EP1370386A2 System and process for the treatment of gaseous emissions |
| 12/17/2003 | EP0894332B8 Use of a connecting process and connecting process |
| 12/17/2003 | CN1131554C Die boning apparatus |
| 12/16/2003 | US6664637 Flip chip C4 extension structure and process |
| 12/16/2003 | US6662862 Plate heat exchanger |
| 12/16/2003 | CA2260342C Solder placement apparatus and method |
| 12/11/2003 | US20030226877 Thermal solder writing eutectic bonding process and apparatus |
| 12/11/2003 | US20030226253 Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device |
| 12/10/2003 | EP1370123A2 Metal/ceramic bonding article and method for producing same |
| 12/10/2003 | EP1165859B1 A method of depositing flux or flux and metal onto a metal brazing substrate |
| 12/09/2003 | US6660961 SBB machine and method for HGA mass production |
| 12/09/2003 | US6660946 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 12/09/2003 | US6659334 Method for forming end-face electrode |
| 12/09/2003 | US6659333 Forming exhaust systems by joining thin flat films to corrugated sheets using microstructure powders |
| 12/09/2003 | US6659329 Soldering alloy |
| 12/09/2003 | US6659004 Screen printing paste, screen printing method, and baked thick film body |
| 12/04/2003 | WO2003099502A1 Reflow oven gas management system and method |
| 12/04/2003 | US20030224555 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device |
| 12/04/2003 | US20030224199 Metal/ceramic bonding article and method for producing same |
| 12/04/2003 | US20030222667 Probe card assembly |
| 12/04/2003 | US20030222126 Method of manufacturing semiconductor device |
| 12/04/2003 | US20030222124 Radio wave soldering method for semiconductor device |
| 12/04/2003 | US20030222119 Waste energy recovery system for a controlled atmosphere system |
| 12/04/2003 | US20030221854 Connecting structures |
| 12/04/2003 | US20030221853 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device |
| 12/03/2003 | EP1367147A1 Wear-resistant coating and method for applying it |
| 12/03/2003 | EP1366508A2 Apparatus and method for atmospheric pressure reactive atom plasma processing for surface modification |
| 12/03/2003 | CN1129501C Laser welding method |
| 12/02/2003 | US6656750 Method for testing chips on flat solder bumps |
| 12/02/2003 | US6656292 Iron-chromium base brazing filler metals |
| 12/02/2003 | US6655576 Process for disassembling a brazed structure |
| 12/02/2003 | US6655023 Method and apparatus for burning-in semiconductor devices in wafer form |
| 11/27/2003 | WO2003098982A1 Reflow soldering device |
| 11/27/2003 | WO2003097889A1 Method of manufacturing rivets having high strength and formability |
| 11/27/2003 | WO2003097287A1 Method for joining a part to be joined to a counterpart using an alloy containing silver and copper constituents |
| 11/27/2003 | WO2003097264A2 Transition metal and transition metal oxide glove and condom formers and coatings therefor |
| 11/27/2003 | WO2003097230A1 Method for making a chemical device element comprising a metal supporting part and an anti-corrosive metal coating |
| 11/27/2003 | US20030218332 Joint for double pipe and brazing method thereof |
| 11/27/2003 | US20030218058 Reflow oven gas management system and method |
| 11/27/2003 | US20030218053 Method of manufacturing rivets having high strength and formability |
| 11/27/2003 | US20030218052 Method and apparatus for producing a refined grain structure |
| 11/27/2003 | US20030217996 Method for simultaneous laser beam soldering |
| 11/26/2003 | EP1365204A1 Heat exchanger |
| 11/26/2003 | EP1363859A1 Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces |
| 11/26/2003 | EP1051279B1 Method for introducing solder into a system |
| 11/26/2003 | CN1458548A Adhesive device for producing liquid crystal display device |
| 11/25/2003 | US6651872 Method and apparatus for disassembling joined layers |
| 11/25/2003 | US6651869 Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering |
| 11/25/2003 | US6651334 Tank of heat exchanger and method of producing same |
| 11/20/2003 | US20030213833 Reflow soldering apparatus and reflow soldering method |
| 11/20/2003 | US20030213832 Solder ball attaching system and method |
| 11/19/2003 | EP1361931A1 Reducing metals as a brazing flux |
| 11/19/2003 | CN1457375A Wear-resistant coating and method fr applying it |
| 11/19/2003 | CN1128468C Chip packaging device |
| 11/18/2003 | US6649887 Apparatus and method for protective atmosphere induction brazing of complex geometries |
| 11/18/2003 | US6649878 Heating device |
| 11/18/2003 | US6648216 Process and apparatus for flow soldering |
| 11/18/2003 | US6648214 Method for partially or completely coating the surfaces of components produced from aluminum or its alloys with solders, fluxing agents or binders for brazing |
| 11/18/2003 | US6648213 Solder balls and an underfill compound; chip assembly |
| 11/18/2003 | US6648212 Components coated with an aluminum-silicon alloy |
| 11/18/2003 | US6648211 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 11/18/2003 | US6648210 Tombstoning susceptibility and reflow peak temperature reduction; printed circuit boards; mixing with a SnBi alloy powder, which is lower melting to produce a Cu, Ag, Sb, Sn, Bi alloy |
| 11/18/2003 | US6648207 Method for applying self-fluxing coatings to non-cylindrical ferritic objects |
| 11/13/2003 | WO2003092946A1 Method for the production of soldered heat-exchanger structures, particularly regeneratively cooled combustion chambers |
| 11/13/2003 | WO2002066200A8 Reducing metals as a brazing flux |
| 11/13/2003 | US20030211439 Furnace conveyor belt having thermal barrier |
| 11/13/2003 | US20030211306 Filled diamond foam material and method for forming same |