| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 05/25/2004 | US6739045 Method for removing solder bumps from LSI |
| 05/25/2004 | US6739044 Electrical terminal tinning process |
| 05/21/2004 | WO2004042420A2 Arrangement for the soldering of a metal block with a number of jointing segment sheets with fixing elements as support for soldering material |
| 05/21/2004 | WO2004041475A1 Solder flux compositions undergoing phase separation during soldering reflow process |
| 05/20/2004 | US20040096691 Multilayer; carbon foam insulation overcoated with antioxidant protective coating containing aluminum, or alloy thereof; cryogenic tanks |
| 05/20/2004 | US20040096689 Sheet-metal foil with sliding structure, honeycomb body and process for producing the same |
| 05/20/2004 | US20040094842 Flip chip C4 extension structure and process |
| 05/20/2004 | US20040094608 Use of silver-copper-palladium brazing alloys |
| 05/20/2004 | US20040094607 System and method for mounting electronic components onto flexible substrates |
| 05/20/2004 | US20040094599 Rework nozzle and method |
| 05/20/2004 | US20040094536 Mosi2 arc-shaped heater, and method and device for manufacturing the heater |
| 05/20/2004 | US20040094517 Device and method for determining parameters of a welding system |
| 05/20/2004 | US20040094292 Fin-tube block type heat exchanger with grooved spacer bars |
| 05/19/2004 | EP1419842A2 Welding method for elements made of stainless steel or nickel alloy type alloy 625 |
| 05/19/2004 | EP1263692B1 Method for assembling parts made of materials based on sic by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method |
| 05/19/2004 | EP0764352B1 Microelectronic contacts and assemblies |
| 05/19/2004 | DE10251658A1 Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil A method of joining for the production of microstructured components suitable micro-structured component layers, as well as micro-structural component |
| 05/19/2004 | CN1498066A Solder structure and soldering method of electronic assembly |
| 05/19/2004 | CN1496780A Leadless welding flux |
| 05/18/2004 | US6736942 Freestanding reactive multilayer foils |
| 05/18/2004 | US6735857 Method of mounting a BGA |
| 05/13/2004 | WO2004040950A1 Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly |
| 05/13/2004 | WO2004040944A1 Transparent window with non-transparent contact surface for a soldering bonding |
| 05/13/2004 | WO2004039526A1 Soldering method and device |
| 05/13/2004 | US20040091627 Coating forming method and coating forming material, and abbrasive coating forming sheet |
| 05/13/2004 | US20040089700 Preconditioning via plug material for a via-in-pad ball grid array package |
| 05/13/2004 | US20040089699 Beam end weld preparation |
| 05/13/2004 | US20040088999 Coupling for heat transfer member |
| 05/12/2004 | EP1418376A1 Method and structure for connecting difficult−to−join pipes to be used at high temperature |
| 05/12/2004 | EP1218137B1 Method for plugging a hole and a cooling element manufactured by said method |
| 05/12/2004 | EP1073539B1 Use of lead-free solder alloy powder paste in pcb production |
| 05/11/2004 | US6733598 Brazing flux for dry application |
| 05/11/2004 | US6732914 Braze system and method for reducing strain in a braze joint |
| 05/11/2004 | US6732911 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system |
| 05/11/2004 | US6732910 Device and process for producing a soldered joint between two joining partners which can be by means of a common contact surface |
| 05/11/2004 | US6732907 Soldering method, soldering device, and method and device of fabricating electronic circuit module |
| 05/11/2004 | US6732905 Vented cavity, hermetic solder seal |
| 05/06/2004 | WO2004038062A2 Method of forming a sputtering target assembly and assembly made therefrom |
| 05/06/2004 | WO2004037454A2 Double wall nickel or nickel alloy coated stainless steel tubing |
| 05/06/2004 | WO2004026517A3 Solder hierarchy for lead free solder joint |
| 05/06/2004 | WO2004019376A3 Method for metallurgically joining a tube to a member |
| 05/06/2004 | WO2003049893A8 Convection-phase equipment for reflow soldering |
| 05/06/2004 | WO2003032957A9 Methods for hermetically sealing microchip reservoir devices |
| 05/06/2004 | US20040087046 Method for testing chips on flat solder bumps |
| 05/06/2004 | US20040084510 Phase separated system for fluxing |
| 05/06/2004 | US20040084509 Method of connecting module layers suitable for the production of microstructure modules and a microstructure module |
| 05/06/2004 | US20040084508 Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly |
| 05/06/2004 | US20040084417 Clad material for lead wire connection |
| 05/06/2004 | EP1415748A2 Method of connecting micro structured component layers suitable for making micro structered components and micro structured component |
| 05/06/2004 | EP1415328A2 Process and apparatus for mounting semiconductor components to substrates and parts therefor |
| 05/06/2004 | EP1414609A2 Etching process for micromachining crystalline materials and devices fabricated thereby |
| 05/06/2004 | EP1222050B1 Method and apparatus for coating the seams of welded tubes |
| 05/06/2004 | DE10249005A1 Verfahren zur Herstellung einer Schaltungsanordnung A process for producing a circuit arrangement |
| 05/04/2004 | US6730848 Techniques for connecting a lead to a conductor |
| 05/04/2004 | US6730173 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module |
| 04/29/2004 | WO2004035253A1 An apparatus and method for filling a ball grid array template |
| 04/29/2004 | US20040081220 Controlled atmosphere furnace and heating method thereof |
| 04/29/2004 | US20040079785 Electronic components carrier for collecting electronic components dropping from a circuit board and related method |
| 04/29/2004 | US20040079634 Method of forming a sputtering target assembly and assembly made therefrom |
| 04/29/2004 | US20040078976 Stainless steel honeycomb panel and method for manufacturing thereof |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6726087 Process and device for soldering electrical components on a plastic sheet |
| 04/27/2004 | US6726085 Method and apparatus for producing a refined grain structure |
| 04/27/2004 | US6725517 Method for plugging a hole and a cooling element manufactured by said method |
| 04/22/2004 | WO2004033140A1 A method and a means for the fixation of objects |
| 04/22/2004 | US20040076495 Wafer handling for a reflow tool |
| 04/22/2004 | US20040074952 Method of controlling solder deposition utilizing two fluxes and preform |
| 04/22/2004 | US20040074950 High temperature eutectic solder ball attach |
| 04/22/2004 | US20040074879 SBB machine and method for HGA mass production |
| 04/21/2004 | EP1410871A1 Lead-free solder ball |
| 04/21/2004 | EP1409992A2 Method and apparatus for improved process control in combustion applications |
| 04/21/2004 | CN2612496Y Digital control impulse ultrasonic spot welding machine |
| 04/21/2004 | CN1491433A Lead-free solder structure and method for high fatigue life |
| 04/21/2004 | CN1491145A Reducing metals as brazing flux |
| 04/21/2004 | CN1146484C Structure and method for jointing metal members |
| 04/20/2004 | US6722558 Method of soldering metallic terminals |
| 04/20/2004 | US6722557 Pretreating and preheating |
| 04/20/2004 | US6722554 Soldering apparatus |
| 04/20/2004 | US6722553 Controlled and programmed deposition of flux on a flip-chip die by spraying |
| 04/20/2004 | CA2105493C Method and apparatus for assessing and restoring solderability |
| 04/15/2004 | WO2004030855A1 Cleaning gas device cleaning the process gas of a reflow soldering system |
| 04/15/2004 | WO2004030854A2 Selective gas knife for wave soldering |
| 04/15/2004 | US20040069840 Method and apparatus for filling a mask with solder paste |
| 04/15/2004 | US20040069837 Method of manufacturing plate type titanium heat exchanger |
| 04/15/2004 | US20040069478 Heat exchanger |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | DE19741192C5 Reflowlötverfahren Reflow soldering |
| 04/15/2004 | DE10257441A1 Elektrisches Bauelement und Anordnung mit dem Bauelement Electrical component and assembly with the component |
| 04/15/2004 | DE10147789B4 Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips Apparatus for soldering contacts on semiconductor chips |
| 04/14/2004 | EP1408338A2 Method for making a probe card with multiple contact tips for testing integrated circuit |
| 04/14/2004 | EP1408337A2 Probe card assembly |
| 04/14/2004 | CN1489505A 硬钎焊产品 Brazing Products |
| 04/14/2004 | CN1146308C Method for making electronic circuit |
| 04/13/2004 | US6720665 Enhanced pad design for substrate |
| 04/13/2004 | US6719892 Selective removal of brazing compound from joined assemblies |
| 04/13/2004 | US6719188 Rework methods for lead BGA/CGA |
| 04/13/2004 | US6719183 Transducer and a bonding apparatus using the same |
| 04/13/2004 | US6719144 Method of separating oxide from dross, device for separating oxide from dross, and jet solder tank |
| 04/08/2004 | WO2004029531A2 Convection furnace thermal profile enhancement |
| 04/08/2004 | WO2004014591A3 Unsoldering device |