| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 08/29/2002 | WO2002019422A3 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
| 08/29/2002 | US20020117536 Hand held flux and solder feeding tool |
| 08/29/2002 | US20020117535 Rework and underfill nozzle for electronic components |
| 08/29/2002 | US20020117485 Method and apparatus for increasing welding rates for high aspect ratio welds |
| 08/29/2002 | US20020117327 Structure and method of lead wire connection, and clad material for lead wire connection |
| 08/29/2002 | US20020116816 Method and apparatus for the end-surface connection of a carrier matrix of a honeycomb body by a joining technique |
| 08/29/2002 | DE10104414A1 Elektrotechnisches Bauteil, Verfahren zum Verlöten dieses Bauteils mit einem weiteren elektrotechnischen Bauteil sowie Anordnung dieser miteinander verlöteten Bauteile Electro-technical component method for soldering of this component with another electrical component and assembly of these components are soldered together |
| 08/28/2002 | EP1233842A1 Method and device for flux-free soldering with reactive gas-enriched molten metals |
| 08/28/2002 | EP1233841A1 Method and device for producing a soldered joint |
| 08/28/2002 | EP1156886A4 Apparatus and method for applying flux to a substrate |
| 08/28/2002 | EP1003622B1 Assembling electroconductive parts by electric current heating |
| 08/28/2002 | EP0758284B1 Gas turbine engine vane assembly repair |
| 08/28/2002 | CN1366169A Improved pipe material for wave shaped radiator heat exchanger |
| 08/28/2002 | CN1365867A Soldering paste coating method and coating apparatus |
| 08/28/2002 | CN1089883C Pipe connecting method and pipe structure |
| 08/28/2002 | CN1089654C Process for soldering metal structures with bonding material |
| 08/27/2002 | US6441339 Apparatus for manufacturing circuit modules |
| 08/27/2002 | US6440578 Adhesive compositions for bonding different members bonding method using the composition and composite members bonded by the bonding method |
| 08/27/2002 | US6440215 Fluid knife |
| 08/22/2002 | US20020115035 Radiation furnace with independently controlled heating elements |
| 08/22/2002 | US20020114726 Electronic device |
| 08/22/2002 | US20020113115 Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
| 08/22/2002 | US20020112350 Heat exchanger manufacturing methods and brazing filler metal compositions useful therein, characterized by low nickel leaching rates |
| 08/22/2002 | CA2364910A1 Method of applying braze materials to a substrate |
| 08/21/2002 | EP1232824A2 Radiation furnace with independently controlled heating elements |
| 08/21/2002 | EP1232040A1 Aluminium product with excellent brazing characteristics |
| 08/21/2002 | EP1232039A1 Composition for preventing creeping of a flux for soldering and use thereof |
| 08/21/2002 | CN1365122A Electric wire processing device, flux coating device and soft brazing filler metal adhesion device |
| 08/21/2002 | CN1364677A Setting method of reflux furnace parameters for soldering surface mounted element |
| 08/20/2002 | US6437289 Reflow soldering apparatus |
| 08/20/2002 | US6436545 Joint body of ceramic member and metal member and method of producing the same |
| 08/20/2002 | US6435866 Radiation furnace with independently controlled heating elements |
| 08/20/2002 | US6435401 Apparatus and a method for removing solder from an object |
| 08/20/2002 | US6434946 Method for making an article assembly with a brazed joint and brazed assembly and preform |
| 08/15/2002 | WO2002063674A1 Lead-free solder structure and method for high fatigue life |
| 08/15/2002 | WO2002062517A2 Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same |
| 08/15/2002 | WO2001034335A9 Compact reflow and cleaning apparatus |
| 08/15/2002 | US20020110636 Nozzle for soldering apparatus |
| 08/15/2002 | US20020108932 Continuous metal matrix composite consolidation |
| 08/15/2002 | US20020108740 Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same |
| 08/14/2002 | EP1230829A1 Apparatus and method for connecting printed circuit boards through soldered lap joints |
| 08/14/2002 | EP1230065A1 Fluxing agent for dry application |
| 08/14/2002 | EP1230059A1 Compact reflow and cleaning apparatus |
| 08/14/2002 | EP0932471B1 Method for producing a soldered metal honeycomb body |
| 08/14/2002 | CN1364106A Microfluid device and ultrasonic bonding process |
| 08/14/2002 | CA2371641A1 Folded fin heat sink assembly |
| 08/13/2002 | US6432221 Fluxing agents |
| 08/13/2002 | CA2178574C Dry fluxing of metal surfaces under water vapour containing atmosphere |
| 08/08/2002 | WO2002062111A2 Apparatus and method for atmospheric pressure reactive atom plasma processing for surface modification |
| 08/08/2002 | WO2002061361A1 Heat exchanger |
| 08/08/2002 | WO2002060828A2 Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces |
| 08/08/2002 | WO2002060639A1 Brazing product |
| 08/08/2002 | WO2002001190A3 Method and apparatus for improved process control in combustion applications |
| 08/08/2002 | US20020106154 Apparatus for and method of jointing probes |
| 08/08/2002 | DE10163324A1 Verfahren und Vorrichtung zur thermischen Analyse, Verfahren und Vorrichtung zur Berechnung thermischer Bedingungen sowie Computerprodukt Method and apparatus for thermal analysis, Method and apparatus for calculating thermal conditions and computer product |
| 08/07/2002 | EP1229554A1 Covered conductor, soldering method using the covered conductor, and electric acoustic converter |
| 08/07/2002 | EP0936024B1 Flux composition for brazing of aluminum material and method for brazing of aluminum material |
| 08/07/2002 | CN1362904A Control method for copper content in solder dipping bath |
| 08/07/2002 | CN1088637C Welding method |
| 08/07/2002 | CN1088636C Nozzle structure of repair apparatus for semiconductor package |
| 08/06/2002 | US6428911 Using tin alloy |
| 08/06/2002 | US6428745 A solder comprising 2.0 to 3.5 wt % of silver, 5 to 18 wt % of bismuth and rest is tin; used for soldering an electronic part to a circuit board |
| 08/06/2002 | US6428249 Method of manufacturing diamond cutting tools through instantaneous heating process and cooling process and such a diamond cutting tool |
| 08/06/2002 | US6427903 Solder ball placement apparatus |
| 08/06/2002 | US6427902 Machine for wave soldering of tinning |
| 08/06/2002 | US6427901 System and method for forming stable solder bonds |
| 08/06/2002 | US6427768 Heat exchanger and brazing method |
| 08/01/2002 | US20020102431 Method of manufacturing an assembly of brazed dissimilar metal components |
| 08/01/2002 | US20020102409 Attaching a foil which comprises the bond coating to the substrate surface, and then fusing the foil to the substrate surface, so that the bond coating adheres to the substrate. |
| 08/01/2002 | US20020100986 Electronic device |
| 08/01/2002 | US20020100796 Method for applying self-fluxing coatings to non-cylindrical ferritic objects |
| 08/01/2002 | US20020100793 Method for repairing damaged areas in a metal component |
| 08/01/2002 | US20020100791 Soldering machine |
| 08/01/2002 | US20020100751 Apparatus and method for atmospheric pressure reactive atom plasma processing for surface modification |
| 07/31/2002 | EP1226896A2 Nickel-base braze material and braze repair method |
| 07/31/2002 | EP1082190B1 Cobalt-chromium-palladium-based brazing alloys |
| 07/30/2002 | US6426152 Salvaged castings and methods of salvaging castings with defective cast cooling bumps |
| 07/30/2002 | US6425785 Electric connector |
| 07/30/2002 | US6425517 Method for applying a brazing medium to a configuration |
| 07/30/2002 | US6425515 Method and apparatus for micro BGA removal and reattach |
| 07/25/2002 | WO2002057700A1 Inner fin for heat exchanger flat tubes and evaporator |
| 07/25/2002 | WO2002056952A2 Miniature x-ray device and method of its manufacture |
| 07/25/2002 | US20020096556 Wave solder apparatus and method |
| 07/25/2002 | US20020096555 System for forming bumps on wafers |
| 07/25/2002 | US20020096361 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 07/25/2002 | DE19654975C2 Apparatus for surface treating electronic parts |
| 07/25/2002 | DE10102768A1 Soldering arrangement has robot-controled solder burner, wire feeder, voltage source, signaling device that produces information signal if solder wire, workpiece electrically connected |
| 07/24/2002 | EP1224339A1 Process for selective deposition of copper substrates |
| 07/24/2002 | EP1224051A1 Apparatus for monitoring a solder wave |
| 07/24/2002 | EP1224050A1 Process for manufacturing of brazed multi-channeled structures |
| 07/24/2002 | EP1123525B1 Device and method for the optical inspection of concealed soldered connections |
| 07/24/2002 | CN1360529A Method for plugging hole and cooling element manufactured by said method |
| 07/24/2002 | CN1360086A Stack structure of electronic apparatus and method for electroless plating of gold |
| 07/24/2002 | CN1359768A Device for making honeycomb structure of waste gas exhausting controlling means |
| 07/23/2002 | US6423950 Reflow soldering apparatus |
| 07/23/2002 | US6423945 Device for heating printed-circuit board |
| 07/23/2002 | US6422451 Interconnection of aluminum components |
| 07/18/2002 | WO2002028582A3 Device for removing solder material from a soldered joint |
| 07/18/2002 | WO2001088226A3 Method of manufacturing an aluminium product |
| 07/18/2002 | US20020094449 Laminated structure for electronic equipment and method of electroless gold plating |