Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
09/2004
09/10/2004CA2516756A1 Elongated intracorporal medical device
09/09/2004US20040175937 Metallic coating for electrical connectors
09/09/2004US20040175030 Systems and methods for detecting defects in printed solder paste
09/09/2004US20040173667 Connecting method of wheel rim of bicycle
09/09/2004DE102004006027A1 Gelötetes Aluminiumturbinenrad für ein Kraftfahrzeuggetriebe und Verfahren zu dessen Herstellung Soldered Aluminiumturbinenrad for a motor vehicle transmission, and process for its preparation
09/08/2004EP1454706A1 Components coated with an aluminium-silicon alloy
09/08/2004EP1338076B1 Stator for an electric machine and method for producing the same
09/08/2004CN1526504A Heat sink machining process
09/08/2004CN1166266C Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board
09/08/2004CN1165400C Method for plugging hole and cooling element manufactured by said method
09/07/2004US6786391 Method of controlling solder deposition utilizing two fluxes and preform
09/02/2004US20040169065 Process and apparatus for applying brazing material to a metallic structure through the use of vibration
09/02/2004US20040169064 Low temperature methods of bonding components and related structures
09/01/2004EP1452260A1 Apparatus and process for applying flux for brazing of parts
09/01/2004EP1452259A1 Optically baffled solder sleeve heating station
09/01/2004EP1451488A1 Gearbox idle pinion and method for assembling the latter
09/01/2004EP1450984A1 A method for manufacturing a stator or rotor component
09/01/2004CN1525545A Soft soldering method for semiconductor components and semiconductor device
08/2004
08/31/2004US6784086 Lead-free solder structure and method for high fatigue life
08/31/2004US6783213 Microfluid device and ultrasonic bonding process
08/31/2004US6783056 Method and apparatus for applying flux for use in brazing aluminum material
08/26/2004US20040167443 Elongated intracorporal medical device
08/26/2004US20040167442 Elongated intracorporal medical device
08/26/2004US20040164131 Solder applying method and solder applying apparatus
08/26/2004US20040164130 Brazing flux for dry application
08/26/2004US20040164125 Process of making a shaped product
08/26/2004US20040164059 Method for fabricating, modifying or repairing of single crystal or directionally solidified articles
08/26/2004US20040164055 Nitrogen saving device
08/26/2004US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts
08/26/2004DE10306772A1 Soldering tool for soldering and unsoldering components on circuit board, has flexible suction device which prevents force exerted on soldering device being transmitted to component
08/25/2004EP1449610A1 Laser processing method, laser soldering method, and laser processing apparatus
08/25/2004CN1164010C Method for attaching solderable wire leads to lead frame and solderable electronic component
08/25/2004CN1163721C Plate type heat exchanger and process for manufacturing same
08/24/2004US6780225 Reflow oven gas management system and method
08/24/2004US6779713 Joining of composite beryllium-aluminum parts
08/24/2004US6779710 Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument
08/19/2004WO2004069461A1 Method and device for temperature impingement of workpieces
08/19/2004US20040159939 High performance multi-chip flip chip package
08/19/2004US20040158981 Techniques for connecting a lead to a conductor
08/18/2004EP1447846A2 Socket and method for connecting electronic components
08/18/2004EP1446262A1 Improvements in fluxless brazing
08/18/2004EP1446261A1 Product and method for low temperature fluxless brazing
08/18/2004EP1446260A1 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
08/18/2004CN1522186A Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same
08/17/2004US6777105 Part
08/17/2004US6776330 Hydrogen fluxless soldering by electron attachment
08/17/2004US6776325 Electronic components carrier for collecting electronic components dropping from a circuit board and related method
08/12/2004WO2004068055A1 Heat exchanger and process for fabricating same
08/12/2004US20040158450 Solder joint life prediction method
08/12/2004DE102004004279A1 Vorrichtung und Verfahren zum korrektiven Löten Apparatus and method for corrective soldering
08/12/2004DE102004004278A1 Vorrichtung und Verfahren zur visuellen Überprüfung von Lötverbindungen Apparatus and method for visual inspection of solder joints
08/11/2004CN1520343A Method of mfg. heat transfer tubes
08/11/2004CN1520249A Laser processing method, laser welding method and laser processor
08/10/2004US6774339 Hermetic sealing of target/backing plate assemblies using electron beam melted indium or tin
08/10/2004US6774327 Hermetic seals for electronic components
08/10/2004US6774314 Electronic device and coupler
08/10/2004US6772936 Method for making an electroconductive joint
08/05/2004WO2004065881A1 Tank-equipped heat exchanger which is intended, in particular, for a motor vehicle, and production method thereof
08/05/2004WO2004065046A2 Brittle material sputtering target assembly and method of making same
08/05/2004WO2004030854A3 Selective gas knife for wave soldering
08/05/2004US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
08/05/2004US20040151939 Reactive multilayer foil with conductive and nonconductive final products
08/05/2004US20040149813 Method of making reactive multilayer foil
08/05/2004US20040149811 Method of making finned tubes
08/05/2004US20040149805 Solder ball dispenser
08/05/2004US20040149593 Applying bias voltage to remove solder and debris; low cost, nondamaging
08/05/2004US20040149373 Method of bonding a first body to a second body
08/05/2004US20040149372 Method of connecting semiconductor or microelectronic device to a substrate
08/05/2004US20040148755 Method for manufacturing fuel inlet
08/03/2004US6769599 Method and device for placing and remelting shaped pieces consisting of solder material
08/03/2004US6769354 Position adjustment in laser-assisted pressing
07/2004
07/29/2004WO2004063733A1 Image recognition apparatus and image recognition method
07/29/2004WO2004062843A2 Universal remover for electronic components and unsoldering paste for removing surface mount electronics components
07/29/2004US20040146640 Reduction of mixture of metal compound; alloying
07/29/2004US20040144835 situating sealing member between first and second member, positioning members to create bounded volume between members, creating pressure differential between ambient pressure outside bounded volume and pressure created within bounded volume
07/29/2004US20040144829 Method of soldering lead-free solder, and joined object soldered by the soldering method
07/29/2004DE10301479A1 Printed circuit board junction box installed in vehicle, has wiring pattern and auxiliary metal pattern having bus bar and metal traces, that allow current to flow through electrical terminals mounted in board
07/28/2004EP1441232A2 Method for connecting electronic components
07/28/2004EP1440759A1 Method for manufacturing a heat exchanger
07/28/2004EP1440752A1 Fabrication and utilization of metallic powder prepared without melting
07/28/2004EP1440045A1 Metallization and/or brazing method, using a silicon alloy, for oxide ceramic parts which are non-wettable by said alloy
07/28/2004EP1439931A1 Device and method for laser beam soldering, in particular, laser beam hard soldering
07/28/2004CN1516631A System and process for treatment of gaseous emission
07/28/2004CN1515362A Surface processing equipment and method, and equipment and method for wiring using said equipment
07/27/2004US6768083 Reflow soldering apparatus and method for selective infrared heating
07/22/2004US20040140293 Method and device for connecting minute joint metal, and composite tape for connecting minute joint metal
07/22/2004US20040139607 Process and device for producing metallic honeycomb bodies using radiation heaters
07/22/2004DE202004003111U1 Bonding agent to heat-join two aluminum components consists of a combination of heated aluminum and zinc applied as a wire, rod, foil or powder
07/22/2004DE19617618B4 Verfahren und Vorrichtung zum Auslöten von Bauelementen, insbesondere elektronischen Bauelementen Method and apparatus for desoldering of components, in particular electronic components
07/22/2004DE10360242A1 Metallurgisches Bonden von integriertem flexiblem Substrat Metallurgical bonding of integrated flexible substrate
07/22/2004DE10019095B4 Verfahren zum Plasma-Pulver-Löten A method for plasma powder brazing
07/21/2004EP1439397A2 Method of performing a burn-in
07/21/2004EP1439025A1 FLUX COMPOSITION FOR SOLDER, SOLDER PASTE, AND METHOD OF SOLDERING
07/21/2004EP1439020A2 Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
07/21/2004CN1514758A Brazing material and brazed product manufacted therewith
07/21/2004CN1158159C Reinforced connecting method for nickel-titanium alloy parts glasses
07/21/2004CN1158155C Method and apparatus for dispensing material in printer
07/20/2004US6763580 Method and apparatus for securing an electrically conductive interconnect through a metallic substrate
07/15/2004WO2003098982A8 Reflow soldering device
07/15/2004US20040134975 Composite pallet for a vector transient reflow process
1 ... 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 ... 161