| Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089) |
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| 12/02/2004 | US20040240865 Device and method for soldering contacts on semiconductor chips |
| 12/02/2004 | US20040238604 Method for brazing magnesium-containing aluminum alloy material |
| 12/02/2004 | US20040238602 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
| 12/02/2004 | US20040238510 Soldering method for metal fastening elements |
| 12/02/2004 | US20040237304 Ultrasonic bonding process for making a microfluid device |
| 12/02/2004 | DE10323086A1 Method for soldering pins to electronic components involves heating solder supply just above melting point and pumping it to solder side where it is heated to soldering temperature and pin is inserted in free solder jet |
| 12/02/2004 | DE10320740A1 Soldering parts involves applying solder to at least one part, thereby or thereafter carrying out soldering process; solder is applied to part(s) by cold gas spraying which cleans/activates surface |
| 12/02/2004 | DE10320472A1 Plasmabehandlung zur Reinigung von Kupfer oder Nickel Plasma treatment for the purification of copper or nickel |
| 12/02/2004 | CA2526775A1 Method for connecting a hollow profile to a two-dimensionally contacting component |
| 12/01/2004 | EP1195217B1 Method of soldering using lead-free solder |
| 12/01/2004 | CN1552078A Interface materials and methods of production and use thereof |
| 12/01/2004 | CN1551813A Process and apparatus for applying brazing material to a metallic structure through the use of vibration |
| 12/01/2004 | CN1551412A Apparatus and method for forming solder wicking prevention zone and electronic part |
| 12/01/2004 | CN1551322A Electrode assembly for the removal of surface oxides by electron attachment |
| 12/01/2004 | CN1178565C Device for heating printed-circuit board |
| 12/01/2004 | CN1178055C Anaytical system of closing indoor atmosphere with alloy soldering or during tinplating |
| 12/01/2004 | CN1177671C Fluxing agent for dry application |
| 11/30/2004 | US6826328 Soldering apparatus and method for a collimator |
| 11/30/2004 | US6824041 High temperature eutectic solder ball attach |
| 11/25/2004 | WO2004102469A1 Method for mounting an electronic component on a substrate |
| 11/25/2004 | US20040232207 Forge welding process |
| 11/25/2004 | US20040232206 Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same |
| 11/25/2004 | US20040231597 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation |
| 11/25/2004 | DE10016699B4 Verfahren zum Anlöten von Zähnen an einen Sägeblattgrundkörper Method for soldering of teeth on a saw blade |
| 11/24/2004 | EP1478827A1 Method and apparatus for increasing welding rates for high aspect ratio welds |
| 11/24/2004 | CN1549869A Method of manufacturing rivets having high strength and formability |
| 11/23/2004 | US6821639 Metal substrate for carrying catalyst and method for manufacturing the same |
| 11/23/2004 | US6821558 Depositing brazing filler material directly onto the substrate by a kinetic spray application to form the brazing surface |
| 11/23/2004 | US6820797 System and method for seal formation |
| 11/23/2004 | US6820794 Solderless test interface for a semiconductor device package |
| 11/23/2004 | CA2266059C Solderless aluminum brazing |
| 11/18/2004 | WO2004099697A1 Flat tube for aluminium heat exchanger |
| 11/18/2004 | WO2004098825A1 A novel connecting piece of electrically conducting material preferably a cable terminal and a method of producing the same |
| 11/18/2004 | WO2004098259A2 Plasma treatment for purifying copper or nickel |
| 11/18/2004 | US20040228036 Manufacturing method and apparatus of magnetic head device, and magnetic head device |
| 11/18/2004 | US20040226985 Optical processing apparatus |
| 11/18/2004 | US20040226979 Optical processing apparatus |
| 11/18/2004 | US20040226914 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation |
| 11/18/2004 | US20040226831 Providing a substrate, electrodes that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy toand/or electrodes to generate electrons; contacting substrate with negatively charged reducing gas to reduce metal oxides |
| 11/18/2004 | US20040226153 Electrode plate unit for rechargeable battery and manufacturing method thereof |
| 11/18/2004 | DE102004018639A1 System und Verfahren zum Löten von Elektronikkomponenten auf einem wärmeempfindlichen flexiblen Substrat mit Kühlung für einen vektortransienten Aufschmelzprozess System and method for the soldering of electronic components on a heat-sensitive flexible substrate with a cooling system for reflow vektortransienten |
| 11/18/2004 | DE102004014703A1 Wärmeverteilermodul und Verfahren zur Herstellung desselben Heat spreader module and method of manufacturing the same |
| 11/17/2004 | EP1477438A2 Conveyor belt cleaner scraper blade with sensor and control system therefor |
| 11/17/2004 | EP1477258A1 Device and method for local temperature treatment with heat detector and image treatment |
| 11/17/2004 | EP1477049A1 Solder interconnections for flat circuits |
| 11/17/2004 | EP1476270A2 Bioptical laser scanner for six-sided 360 pos-based scanning |
| 11/17/2004 | EP1222049B1 Method and device for joining a support matrix of a honeycomb on the end face using bonding technology |
| 11/17/2004 | EP1194263B1 Process for the production of components coated with an aluminium-silicon alloy |
| 11/17/2004 | EP0898443B1 Reflow soldering device |
| 11/17/2004 | CN1546251A Method for manufacturing high-frequency soldering finned tubes |
| 11/16/2004 | US6818840 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 11/16/2004 | US6818543 Process and apparatus for mounting semiconductor components to substrates and parts therefor |
| 11/16/2004 | US6818320 Welding method for welded members subjected to fluoride passivation treatment, fluoride passivation retreatment method, and welded parts |
| 11/16/2004 | US6817821 Wafer handling for a reflow tool |
| 11/16/2004 | US6817513 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method |
| 11/16/2004 | CA2119038C Device for ultrasonic sealing |
| 11/11/2004 | WO2004097322A1 Evaporator and process for fabricating same |
| 11/11/2004 | US20040224541 Apparatus and method for forming solder wicking prevention zone and electronic part |
| 11/11/2004 | US20040224224 capable of reflow soldering; the required mounting area is reduced by soldering one electrode directly to a circuit board; underlying plating suppresses whisker formation in tin or tin-alloy |
| 11/11/2004 | US20040222271 Method and pallet assembly for reflow soldering of interconnections between printed circuits having low-temperature substrates |
| 11/11/2004 | US20040222200 Brazed copper heat exchangers and process for manufacturing them by welding |
| 11/11/2004 | US20040222193 Method for resistance welding/brazing a tube to a member |
| 11/11/2004 | US20040222090 Carbon fiber and copper support for physical vapor deposition target assemblies |
| 11/10/2004 | EP1475179A2 Electrode assembly for the removal of surface oxides by electron attachment |
| 11/10/2004 | EP1475178A1 Brazed sintered compact |
| 11/10/2004 | EP1475177A1 Apparatus and method for forming solder wicking prevention zone and electronic part |
| 11/10/2004 | EP1474540A1 Procedure and arrangement for coating a metal surface with a thin layer containing metal |
| 11/10/2004 | EP1474261A1 Flux collection method and system |
| 11/10/2004 | EP1474260A1 Radiant heating method and assembly for a multi-chamber vacuum-soldering system |
| 11/10/2004 | CN1174934C Joining method for ceramic and metal and joined body of ceramics and metal joined by the method |
| 11/10/2004 | CN1174819C Multi wrapping metal tube and making method and equipment |
| 11/09/2004 | US6815088 Copper preservative treatment |
| 11/09/2004 | US6815086 Methods for fluxless brazing |
| 11/09/2004 | US6815052 Filled diamond foam material and method for forming same |
| 11/09/2004 | US6814273 Flatwire repair tool systems and methods |
| 11/04/2004 | US20040217150 Method for ablating points of contact (debumping) |
| 11/04/2004 | US20040217149 Honeycomb structure and method for applying adhesive and brazing material to the structure |
| 11/04/2004 | US20040216301 Method of brazing a liquid-cooled stator bar |
| 11/04/2004 | DE19643846B4 Linearmotor-Pumpe für Wellenlötanlagen Linear motor pump for wave soldering |
| 11/04/2004 | DE10314876A1 Verfahren zum mehrstufigen Herstellen von Diffusionslötverbindungen für Leistungsbauteile mit Halbleiterchips A method for multistage manufacturing Diffusionslötverbindungen for power devices with semiconductor chips |
| 11/04/2004 | DE102004018640A1 Lotaufschmelzofen Solder reflow oven |
| 11/04/2004 | DE10017453B4 Verfahren zur Herstellung einer Schweiß- bzw. Lötverbindung A process for producing a welded or soldered joint |
| 11/03/2004 | EP1473525A2 An accumulator dehydrator end cap and a method of assembling thereof |
| 11/03/2004 | EP1473105A2 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachement and remote ion generation |
| 11/03/2004 | EP1472038A2 Vacuum compression brazing furnace and method of using same |
| 11/03/2004 | EP1472037A2 Welding apparatus and method |
| 11/03/2004 | CN1543546A Method and structure for connecting difficult-to-join pipes to be used at high temperature |
| 11/03/2004 | CN1173799C Components coated with aluminium-silicon alloy |
| 11/02/2004 | US6813153 Polymer solder hybrid |
| 11/02/2004 | US6812429 SBB machine and method for HGA mass production |
| 11/02/2004 | US6811898 Abrasion-resistant coating which has high oxidation resistance and durability and can be applied easily at a low cost. the abrasion resistant coating in accordance with the present invention is formed at the tip end of a base material forming |
| 11/02/2004 | US6811074 Method and apparatus for dispensing solder on a substrate |
| 11/02/2004 | US6811072 Known good die removal method and apparatus |
| 11/02/2004 | US6811071 Method for the manufacture of a metal structure and device for wetting a metal structure with an adhesive |
| 11/02/2004 | US6810573 Method for manufacturing fuel inlet |
| 10/28/2004 | US20040214406 Bonding method and bonding apparatus |
| 10/28/2004 | US20040213450 Image recognition apparatus and image recognition method |
| 10/28/2004 | US20040211817 System for fabricating an integrated circuit package on a printed circuit board |
| 10/28/2004 | US20040211816 Wave soldering apparatus |
| 10/28/2004 | US20040211815 Apparatus for removing an image sensor from a printed circuit board |