Patents for H05K 1 - Printed circuits (98,583)
03/1987
03/31/1987US4654383 Flame-retardant epoxy resins
03/31/1987US4654248 Layers with different coefficient of expansion bonded together
03/31/1987US4654116 Redeposition, oxidizers
03/31/1987US4654102 Adding electrical connections
03/31/1987US4653365 Method for punching ceramic green sheet
03/31/1987US4653186 Method of manufacturing film-covered terminal
03/31/1987CA1219963A1 Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads
03/31/1987CA1219838A1 Masking tape for electroplating processes
03/25/1987EP0215638A1 Metallizing composition for sintered ceramic article
03/25/1987EP0215580A2 Miscible blends of poly(aryl ether sulfones)
03/25/1987EP0215557A2 Copper-chromium-polyimide composite
03/25/1987EP0215175A1 A copper-foiled flexible base for printed circuit board
03/25/1987CN86105670A Resin composition and a process for preparing laminates therefrom
03/24/1987US4652977 Microelectronics module
03/24/1987US4652975 Mounting arrangement for circuit breaker current sensing transformers
03/24/1987US4652974 Method and structure for effecting engineering changes in a multiple device module package
03/24/1987US4652848 Overvoltage protection for a ceramic printed circuit board
03/24/1987US4652734 Method of and device for feeding information about articles to be processed in galvanizing installations
03/24/1987US4652324 Process for the production of laminated sheet
03/24/1987US4652066 Insertible electric assembly
03/24/1987US4652065 Method and apparatus for providing a carrier termination for a semiconductor package
03/24/1987US4651416 Printed circuits
03/18/1987EP0214916A1 Process for making an interconnection substrate for electronic components
03/18/1987EP0214663A2 Electronic control device
03/18/1987EP0214662A2 Ignition control device
03/18/1987EP0214652A2 Electromagnetic relay
03/18/1987EP0214628A2 Process for the manufacture of substrates to interconnect electronic components and articles made by said process
03/18/1987EP0214573A2 Integration process of resistances in chemically disposed conductor networks
03/18/1987EP0214465A1 Plating process for an electronic part
03/17/1987US4651011 Non-destructive method for determining the extent of cure of a polymer
03/17/1987US4650933 Jack and test plug
03/17/1987US4650723 Laminate of electroconductive metal, plastic, and springy metal
03/17/1987US4650267 Device for fixing electronic display
03/17/1987CA1219315A1 Self-aligning electrical connection assembly
03/12/1987WO1987001557A1 Manufacture of electrical circuits
03/12/1987WO1987001509A1 Manufacture of a hybrid electronic or optical device
03/12/1987WO1987001323A1 Grinding guide and method for controlling the automatic grinding of objects
03/12/1987WO1987001322A1 Automatic grinding machine
03/11/1987EP0214103A2 Adhesively bonded photostructurable polyimide foil
03/11/1987EP0213974A1 Micromodule with embedded contacts and a card containing circuits comprising such a micromodule
03/11/1987EP0213859A2 Multiconductor electrical cable terminations and methods and apparatus for making same
03/11/1987EP0213805A1 Multilayer circuit board
03/11/1987EP0213675A2 Cathode ray tubes
03/11/1987EP0213629A2 Process for the production of inorganic fibers
03/11/1987EP0213205A1 Method of stacking printed circuit boards
03/10/1987US4649461 Grounding construction for multilayer printed circuit boards
03/10/1987US4649417 Multiple voltage integrated circuit packaging substrate
03/10/1987US4649125 Peroxide
03/10/1987US4649083 Aluminum alloy and oxide layer
03/10/1987US4648212 Automatic grinding machine
03/10/1987US4648211 Grinding guide and method for controlling the automatic grinding of objects
03/05/1987DE3629864A1 Device and method for welding thin wires
03/04/1987EP0213014A1 Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
03/04/1987EP0212294A2 Terpolymers
03/04/1987EP0212124A1 Method of fabricating a multilayer ceramic substrate
03/04/1987EP0211979A1 Laminate board containing uniformly distributed filler particles and method for producing the same
03/04/1987EP0211887A1 Finger line screen printing method and apparatus
03/03/1987US4648125 Portable radio transceiver
03/03/1987US4647959 Integrated circuit package, and method of forming an integrated circuit package
03/03/1987US4647882 Miniature microwave guide
03/03/1987US4647508 Flexible circuit laminate
03/03/1987US4647477 Surface preparation of ceramic substrates for metallization
03/03/1987US4647133 Electrical interconnect system
03/03/1987US4647126 Compliant lead clip
03/03/1987US4647123 Bus networks for digital data processing systems and modules usable therewith
03/03/1987US4646436 Shielded interconnection boards
03/03/1987CA1218739A1 Composite substrate for electronic components
03/03/1987CA1218738A1 Assembling construction of electronic apparatus
03/03/1987CA1218719A1 Electrical connection for polymeric conductive material
02/1987
02/26/1987DE3620063A1 LP 8561 - Process for the preparation of epoxy based, flame-inhibiting binders
02/26/1987DE3529641A1 Printed-circuit board
02/26/1987DE3528993A1 Contact arrangement having contacts between which soft, permanently elastic, non-conductive material is located in order to produce restoring forces and for protection of the contact zones against environmental influences, and which contacts penetrate this material during operation
02/25/1987EP0211708A1 Process and device for soldering a cable terminal on an electric circuit borne by a glass sheet
02/25/1987EP0211619A2 A multilayer ceramic circuit board
02/25/1987EP0211604A2 Polymer compositions
02/25/1987EP0211603A1 Method of making ceramic dielectric bodies
02/25/1987EP0211517A2 High voltage transient protection device
02/25/1987EP0211382A2 Resin compositions and a process for preparing laminates therefrom
02/25/1987EP0211036A1 Static free molded plastic parts
02/25/1987CN86105713A Integrated backplane
02/24/1987US4646132 IC socket having a backup power cell and circuit
02/24/1987US4645733 High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates
02/24/1987US4645732 Method for manufacturing two-sided circuit board
02/24/1987US4645114 Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads
02/17/1987US4644096 Surface mounting package
02/17/1987US4644093 Circuit board
02/17/1987US4644092 Shielded flexible cable
02/17/1987US4643936 Backup material for small bore drilling
02/17/1987US4643497 Device and method for connecting a printed circuit film
02/17/1987CA1218123A1 High capacitance laminated buss and method of manufacture
02/12/1987WO1987001007A1 Electric switchgear
02/12/1987DE3527332A1 Film having conductor tracks printed on both sides
02/10/1987US4642592 Grounding and supporting metal mesh
02/10/1987US4642421 Adhesive electrical interconnecting means
02/10/1987US4642160 Electrolessly depositing metal foil, etching
02/10/1987US4642148 Reduced residual carbon
02/10/1987CA1217875A Method of fabricating a substrate which includes one or more apertures therethrough
02/10/1987CA1217686A Metallization of ceramics
02/05/1987DE3527969A1 Method for fabricating printed-circuit boards
02/05/1987DE3527967A1 Method for the fabrication of printed-circuit boards