Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
02/2014
02/13/2014US20140041909 Ceramic Substrate and Method for Reducing Surface Roughness of Metal Filled Via Holes Thereon
02/13/2014US20140041908 Flame retardant fillers prepared from bridged polysilsesquioxanes
02/13/2014US20140041907 Core substrate and printed circuit board using the same
02/13/2014US20140041906 Metal heat radiation substrate and manufacturing method thereof
02/13/2014US20140041904 Method for making a two-layer capacitive touch sensor panel
02/13/2014US20140041903 Printed circuit board structure
02/13/2014US20140041902 Printed circuit board and method of manufacturing the same
02/13/2014US20140041900 Circuit Pattern with high aspect ratio and Method of Manufacturing the Same
02/13/2014DE10211647B4 Verfahren zum Bestücken und Löten einer Leiterplatte A method for assembling and soldering a circuit board
02/13/2014DE10202107B4 Verfahren zum Herstellen einer geformten, gedruckten Schaltung A method for producing a molded printed circuit
02/13/2014DE102012214264A1 Printed circuit board, has releasing agent layer formed such that substrate layer in region of agent layer is removed from electrical conductive layer while electrical conductive contact is formed in region of printed circuit board edge
02/13/2014DE102012214158A1 Method of contacting and joining single or multilayer flat conductor with conductors in automotive industry, involves performing physical connection of conductor to conductive layer through contact element in recess of conductive layer
02/13/2014DE102004007740B4 Modulplatine und Trennbügel Module board and separating frame
02/13/2014DE10008569B4 Substrat für eine Schaltungsanordnung Substrate for a circuit arrangement
02/12/2014EP2695914A1 Thermally conductive polymer composite material and an article comprising same
02/12/2014EP2695733A1 Copper foil complex, copper foil used in copper foil complex, molded body, and method for producing molded body
02/12/2014EP2695495A1 Compound to produce conductive circuits
02/12/2014EP2695494A1 Process or method for inserting or spreading quartz inside a substrate
02/12/2014EP2695493A1 Electronic module
02/12/2014EP2695492A1 Electronic module and method for the production thereof
02/12/2014EP2694579A2 Nanotube dispersants and dispersant free nanotube films therefrom
02/12/2014CN203435282U LED evaporator
02/12/2014CN203435235U Photoelectron part surface mounting structure of LED display panel
02/12/2014CN203435234U SIM card fixing structure
02/12/2014CN203435233U Circuit board for portable mobile terminals and portable mobile terminal
02/12/2014CN203435232U Printed circuit board (PCB) used for mobile terminal
02/12/2014CN203435231U Structure of to-be-punched flexible circuit board
02/12/2014CN203435230U Gold finger electroplating structure of multilayer printed circuit board
02/12/2014CN203435229U Rigid flexible combination circuit board protecting structure
02/12/2014CN203435228U Power amplifier wiring board
02/12/2014CN203435227U Thin wire row-made LED single-sided circuit board
02/12/2014CN203435226U Etching-free aluminum substrate
02/12/2014CN203435225U Easy-uncovering rigid-flexible-combined board
02/12/2014CN203435224U Composite circuit board structure of single-chip microcomputer
02/12/2014CN203435223U Composite circuit board of single-ship microcomputer
02/12/2014CN203435222U Computer circuit board
02/12/2014CN203435221U Integrated circuit board
02/12/2014CN203435220U Computer circuit board
02/12/2014CN203435219U Novel circuit board
02/12/2014CN203435218U Printed circuit boards and detection device thereof
02/12/2014CN203435217U Circuit board capable of radiating heat rapidly
02/12/2014CN203435216U Peelable glue protective structure
02/12/2014CN203433761U Light-emitting diode (LED) light-emitting display board
02/12/2014CN203433760U Flexible LED (light-emitting diode) display panel
02/12/2014CN103583087A Circuit board and electronic device provided with same
02/12/2014CN103582945A 半导体器件 Semiconductor devices
02/12/2014CN103582677A Non-combustible film, dispersion liquid for non-combustible films, method for producing non-combustible film, solar cell back sheet, flexible board, and solar cell
02/12/2014CN103582664A Resin composition, prepreg and laminate
02/12/2014CN103582564A Laminate sheet, application therefor, and method for producing same
02/12/2014CN103582325A 电路板及其制作方法 Circuit board and its manufacturing method
02/12/2014CN103582322A Multilayer circuit board and manufacturing method thereof
02/12/2014CN103582321A Multilayer circuit board and manufacturing method thereof
02/12/2014CN103582320A Multilayer circuit board and manufacturing method thereof
02/12/2014CN103582304A 透明印刷电路板及其制作方法 Transparent printed circuit board and its manufacturing method
02/12/2014CN103582302A Printed circuit board and method for manufacturing a printed circuit board
02/12/2014CN103582301A Circuit board with embedded elements
02/12/2014CN103582300A Security wrap film for protecting electronic device
02/12/2014CN103582299A Security wrap
02/12/2014CN103582298A Security wrap
02/12/2014CN103582297A Processing method of PCB and PCB
02/12/2014CN103582296A Flexible printed circuit film and display device using the same
02/12/2014CN103582295A Wiring board and method for manufacturing wiring board
02/12/2014CN103582294A Printed wiring board, printing method, and liquid device
02/12/2014CN103582293A Method and circuit for achieving bridge joint and close range wireless communication antenna
02/12/2014CN103582292A Printed wiring board, printed circuit board, and printed circuit board manufacturing method
02/12/2014CN103582291A Metal matrix printed circuit board and electronic device
02/12/2014CN103582290A Flexible substrate and lighting device including flexible substrate
02/12/2014CN103582289A 金属热辐射基片以及其制造方法 Metallic heat radiation substrate and manufacturing method
02/12/2014CN103582288A Electrode pattern and method of manufacturing the same, printed circuit board using electrode pattern and method of manufacturing the same
02/12/2014CN103582287A Insulator for build-up pcb and method of manufacturing pcb using the same
02/12/2014CN103582286A Circuit board assembly and camera module
02/12/2014CN103582285A ITO electric conducting film current converging electrode and manufacturing method thereof
02/12/2014CN103582284A Circuit board device used for camera module
02/12/2014CN103582283A Flexible printed circuit board and manufacturing method
02/12/2014CN103582282A Circuit board and electronic module and light-emitting module comprising same
02/12/2014CN103582281A High-speed backboard via hole design method based on 10GBaseKR
02/12/2014CN103582280A 电路板装置 Circuit board apparatus
02/12/2014CN103582279A 电路板及其制作方法 Circuit board and its manufacturing method
02/12/2014CN103582278A Multiplayer printed circuit board
02/12/2014CN103579011A Package carrier and manufacturing method thereof
02/12/2014CN103578763A Laminated capacitor mounting structure and laminated capacitor
02/12/2014CN103578761A Capacitor and multi-layer circuit board with same
02/12/2014CN103578744A Mounting land structure and mounting structure for laminated capacitor
02/12/2014CN103578743A Capacitor component and capacitor component mounting structure
02/12/2014CN103578201A Security wrap and method for forming and installing same
02/12/2014CN103576459A Light-curing thermal-curing resin composition
02/12/2014CN103576452A Light-curing thermal-curing resin composition
02/12/2014CN103571275A Conductive ink composition, manufacturing method of conductive pattern and conductive circuit
02/12/2014CN103571269A Printing ink composition, circuit board and preparation method thereof
02/12/2014CN103571160A Epoxy resin composition for printed circuit board, insulting film, prepreg and multilayer printed circuit board
02/12/2014CN103571156A Thermosetting resin composition and application thereof
02/12/2014CN102138373B Device for electromagnetic screening of electronic component and for dissipation of heat generated by said component, and corresponding electronic circuit
02/11/2014US8649186 Package substrate and semiconductor package having the same
02/11/2014US8649185 Elastic conformal transducer apparatus
02/11/2014US8649184 Signal conversion device with dual chip
02/11/2014US8649183 Electronic assembly
02/11/2014US8648668 Electrical impedance precision control of signal transmission line for circuit board
02/11/2014US8648262 Embedded multi-layer circuit board and noise suppression method
02/11/2014US8648261 Printed circuit board
02/11/2014US8648260 Wiring substrate
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