Patents for H05K 1 - Printed circuits (98,583)
07/2006
07/26/2006CN1809253A Electronic component package and packaging method
07/26/2006CN1809249A Multilayer printed circuit board
07/26/2006CN1809248A Printed wiring substrate and method for identifying printed wiring substrate
07/26/2006CN1809247A Multilayer soft printed wiring board and production method thereof
07/26/2006CN1809246A High-frequency equipments assembly base plate and communication machine
07/26/2006CN1809245A Double printed circuit board with solderless connecting structure
07/26/2006CN1809244A High-speed printed circuit board with earth layer in microwave photon crystalline structure
07/26/2006CN1808780A Connecting device of a flexible printed circuit board
07/26/2006CN1807509A Semi-conducting resin composition, and wired circuit board
07/26/2006CN1807503A Halogen-free phosphor-free combustion-proof epoxide resin composition
07/26/2006CN1266810C Electric contactor and electric connection device using same
07/26/2006CN1266777C Luminous unit, luminous unit assembly and illuminator produced by said unit
07/26/2006CN1266753C Method for manufacturing semiconductor device
07/26/2006CN1266752C Manufacturing method of circuit device
07/26/2006CN1266715C Multilayer circuit and method of manufacturing
07/26/2006CN1266532C Liquid crystal display apparatus
07/26/2006CN1266364C Bonding structure for plastic parts with of clamper of clamp mould pressing and bonding method thereof
07/26/2006CN1266218C Heat resistant resin composition, its heat resistant film or sheet and laminated product containing the film or sheet as base material
07/26/2006CN1266196C Continuous filament mat binder system
07/26/2006CN1266062C Insulative ceramic compact
07/25/2006US7082037 PC card housing
07/25/2006US7081803 Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
07/25/2006US7081691 Switching device for controlling large amount of current
07/25/2006US7081661 High-frequency module and method for manufacturing the same
07/25/2006US7081650 Interposer with signal and power supply through vias
07/25/2006US7081630 Compact microcolumn for automated assembly
07/25/2006US7081591 Circuit board
07/25/2006US7081590 Wiring board and method of fabricating tape-like wiring substrate
07/25/2006US7081491 High strength; heat and chemical resistance; reacting isophthaloyl chloride with hexafluoro-3,3*-diaminobisphenol a; high temperature cyclization
07/25/2006US7081288 Suitable for high temperature applications such as those found in printed circuit board and automotive industries, printable
07/25/2006US7081214 Low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked
07/25/2006US7081209 Solder mask removal method
07/25/2006US7080990 Control module assembly
07/25/2006US7080988 Flexible contact-connection device
07/25/2006US7080575 Mechatronic transmission control
07/25/2006US7080446 Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method
07/25/2006CA2387012C Method of manufacturing printed wiring board
07/25/2006CA2301625C Electrochemical deposition of a composite polymer-metal oxide
07/20/2006WO2006076615A1 Ink-jet printing of compositionally no-uniform features
07/20/2006WO2006076613A2 Metal nanoparticle compositions
07/20/2006WO2006076609A2 Printable electronic features on non-uniform substrate and processes for making same
07/20/2006WO2006076608A2 A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
07/20/2006WO2006076607A1 Ink-jet printing of passive electricalcomponents
07/20/2006WO2006076606A2 Optimized multi-layer printing of electronics and displays
07/20/2006WO2006076604A2 Processes for planarizing substrates and encapsulating printable electronic features
07/20/2006WO2006076603A2 Printable electrical conductors
07/20/2006WO2006075751A1 Capacitor layer forming material, process for producing the same, and printed wiring board having built-in capacitor layer obtained using the material
07/20/2006WO2006075381A1 Camera module and semiconductor device
07/20/2006WO2006075176A1 Electrical power substrate
07/20/2006WO2006050286A3 An apparatus and method for improving printed circuit board signal layer transitions
07/20/2006WO2004090942A9 Thermally conductive adhesive composition and process for device attachment
07/20/2006US20060161874 Printed circuit wiring board designing support device, printed circuit board designing method, and its program
07/20/2006US20060161016 Bis(3-amino-4-hydroxyphenyl)adamantane derivatives and process for production thereof
07/20/2006US20060160411 Grounding structure for a liquid crystal module
07/20/2006US20060160410 Connecting device of a flexible printed circuit board
07/20/2006US20060160394 Electrical connector assembly having board hold down
07/20/2006US20060160382 Electronic apparatus including connector terminal
07/20/2006US20060160381 Image forming apparatus having high voltage circuit board
07/20/2006US20060160378 Multi-pin RF field replaceable coaxial mounting flange structure
07/20/2006US20060159929 Epoxy compound and cured epoxy resin product
07/20/2006US20060159928 Resin composition for printed wiring board, prepreg, and laminate obtained with the same
07/20/2006US20060159927 Paste composition and dielectric composition using the same
07/20/2006US20060158865 Circuit board, electronic device employing circuit board, and mehtod of producing circuit board
07/20/2006US20060158863 Interconnection structure through passive component
07/20/2006US20060158861 Semiconductor device and display module using same
07/20/2006US20060158824 Composite electronic component
07/20/2006US20060158580 Liquid crystal module
07/20/2006US20060157573 IC card
07/20/2006US20060157572 IC card
07/20/2006US20060157272 Microvia structure and fabrication
07/20/2006US20060157271 Double-sided flexible printed circuits
07/20/2006US20060157270 Printed wiring substrate and method for identifying printed wiring substrate
07/20/2006US20060156543 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit
07/20/2006DE202006003441U1 Contact less access card/chip card, for e.g. banking transaction, has radio frequency identification unit and coil inserted in recess, where coil receives and sends data and card is made of metal, precious metal or wood
07/20/2006DE10340297B4 Verbindugsanordnung zur Verbindung von aktiven und passiven elektrischen und elektronischen Bauelementen Verbindugsanordnung for connection of active and passive electrical and electronic components
07/20/2006DE102005047170A1 Electronic device e.g. optical device used for optical connector, has no wiring pattern at outer periphery edge or its vicinity of mold resin and between surface of substrate and base
07/20/2006DE102004062441B3 Mehrschichtaufbau mit Temperierfluidkanal und Herstellungsverfahren Multilayered structure Temperierfluidkanal and manufacturing processes
07/20/2006DE102004055616A1 Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder Method for connecting a bridge module comprising a substrate and multilayered transponder
07/19/2006EP1681910A1 Connecting device of a flexible printed circuit board
07/19/2006EP1681321A1 Inkjet ink composition
07/19/2006EP1680818A1 Light-emitting diode arrangement comprising a heat-dissipating plate
07/19/2006EP1405446A4 System and method for integrating optical layers in a pcb for inter-board communications
07/19/2006EP1197131A4 A via connector and method of making same
07/19/2006EP0956161B1 Ipc (chip) termination machine
07/19/2006CN2798509Y Welding structure for chip group of electronic component
07/19/2006CN2798506Y 印刷电路板 A printed circuit board
07/19/2006CN1806475A Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
07/19/2006CN1806474A Rigid-flex wiring board and method for producing same
07/19/2006CN1806356A Method of producing membrane electrode assemblies
07/19/2006CN1806329A Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion.
07/19/2006CN1806301A High-frequency heating device
07/19/2006CN1806210A Ground connection of a printed circuit board placed in a wristwatch type electronic device
07/19/2006CN1806168A System and method for attenuating the effect of ambient light on an optical sensor
07/19/2006CN1805901A Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material
07/19/2006CN1805801A Structure for mounting multi-featured vibration actuator on circuit board
07/19/2006CN1805665A Manufacturing method of strip type macromolecular ESD protective device
07/19/2006CN1805663A Wiring pattern drawing formation method and circuit board manufactured by using the same
07/19/2006CN1805662A Method for producing printed wiring board
07/19/2006CN1805657A Wired circuit board
07/19/2006CN1805656A Circuit board module and its forming method