| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/19/2006 | CN1805655A Array base plate and its manufacturing method |
| 07/19/2006 | CN1805654A Flexible circuit board and display |
| 07/19/2006 | CN1805653A Printed circuit board and manufacturing method thereof |
| 07/19/2006 | CN1805652A Soft printing circuit board, multi-layer soft printing circuit board and portable telephone terminal |
| 07/19/2006 | CN1805651A Compound wired circuit board |
| 07/19/2006 | CN1805136A Circuit device and portable device |
| 07/19/2006 | CN1803874A Epoxy plant oil modified phenol-formaldehyde resin, its preparation method and application |
| 07/19/2006 | CN1265691C Multi-layer printed wiring board and method for manufacturing the same |
| 07/19/2006 | CN1265690C Printed circuit board and its mfg. method |
| 07/19/2006 | CN1265688C Carrier-attached copper foil and printed board using copper foil |
| 07/19/2006 | CN1265687C Preimpregnation material block and circuit substrate and their manufacture method |
| 07/19/2006 | CN1265686C Flexible printed circuit board |
| 07/19/2006 | CN1265685C High-frequency circuit board with signal pickup pad and measuring tool thereof |
| 07/19/2006 | CN1265561C Passive device and module of transceiver |
| 07/19/2006 | CN1265455C Semiconductor device and its making method |
| 07/19/2006 | CN1265450C Thin film bearing belt for assembling electronic parts |
| 07/19/2006 | CN1265387C Connecting mechanism of tape drive wheel electric machine for tape recorder |
| 07/19/2006 | CN1264924C Thermosetting polyimide resin composition and method for producing polyimide resin |
| 07/19/2006 | CN1264893C Okumura acid, polyimide and optical material |
| 07/18/2006 | US7080337 Non-uniform decoupling capacitor distribution for providing more uniform noise reduction across chip |
| 07/18/2006 | US7080186 Electromagnetically-coupled bus system |
| 07/18/2006 | US7079778 Rugged shock-resistant backplane for embedded systems |
| 07/18/2006 | US7079400 High-frequency circuit |
| 07/18/2006 | US7079399 Printed circuit boards having improved solder pads |
| 07/18/2006 | US7079398 Sash for land grid arrays |
| 07/18/2006 | US7079373 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit |
| 07/18/2006 | US7079371 Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device |
| 07/18/2006 | US7079352 Magnetic disk apparatus with separate printed-circuit boards |
| 07/18/2006 | US7079086 Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials |
| 07/18/2006 | US7078890 Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment |
| 07/18/2006 | US7078816 Circuitized substrate |
| 07/18/2006 | US7078809 Chemical leadframe roughening process and resulting leadframe and integrated circuit package |
| 07/18/2006 | US7078797 Hybrid integrated circuit device |
| 07/18/2006 | US7078795 High voltage module and method for producing same |
| 07/18/2006 | US7078788 Microelectronic substrates with integrated devices |
| 07/18/2006 | US7078629 Multilayer wiring board |
| 07/18/2006 | US7078628 Substrate for circuit wiring |
| 07/18/2006 | US7078304 Method for producing an electrical circuit |
| 07/18/2006 | US7078106 Thermosetting resin composition and use thereof |
| 07/18/2006 | US7077943 Barium titanate film synthesizing process |
| 07/18/2006 | US7077908 Substrate holder |
| 07/18/2006 | US7077882 Gold powders, methods for producing powders and devices fabricated from same |
| 07/18/2006 | US7077710 Patch panel |
| 07/18/2006 | US7077678 Electrical connector assembly having board hold down |
| 07/18/2006 | US7077664 Module connector |
| 07/18/2006 | US7077661 Socket for having the same conductor inserts for signal, power and ground |
| 07/18/2006 | US7077660 Land grid array structures and methods for engineering change |
| 07/18/2006 | US7076868 Wiring circuit board having bumps and method of producing same |
| 07/18/2006 | CA2221315C Semiconductor device |
| 07/13/2006 | WO2006073336A1 Emc connector assembly |
| 07/13/2006 | WO2005098941A3 Integrated circuit stacking system and method |
| 07/13/2006 | WO2005086887A3 Improved replaceable led module |
| 07/13/2006 | US20060154827 Aluminum nitride sintered compact |
| 07/13/2006 | US20060154499 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box |
| 07/13/2006 | US20060154496 Wiring board incorporating components and process for producing the same |
| 07/13/2006 | US20060154402 Tile-based routing method of a multi-layer circuit board and related structure |
| 07/13/2006 | US20060154099 Multilayer body and method for producing same |
| 07/13/2006 | US20060154095 Mold release film |
| 07/13/2006 | US20060154052 Soft magnetic material for manufacturing printed circuit boards |
| 07/13/2006 | US20060153506 Transceiver assembly for use in fiber optics communications |
| 07/13/2006 | US20060152913 Method and apparatus for reducing electromagnetic emissions from electronic circuits |
| 07/13/2006 | US20060152907 Assembly for accommodating the power electronics and control electronics of an electric motor |
| 07/13/2006 | US20060152323 Embedded inductor for semiconductor device circuit |
| 07/13/2006 | US20060151755 Overvoltage protection materials and process for preparing same |
| 07/13/2006 | US20060151330 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method |
| 07/13/2006 | US20060151206 Semiconductor device and manufacturing method therefor |
| 07/13/2006 | US20060151205 Multilayer printed circuit board |
| 07/13/2006 | US20060151203 Encapsulated electronic component and production method |
| 07/13/2006 | US20060151202 Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate |
| 07/13/2006 | US20060151201 Mounting components to a hardware casing |
| 07/13/2006 | DE19920593B4 Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls A chip carrier for a chip module and method of manufacturing the chip module |
| 07/13/2006 | DE102005062770A1 System und Verfahren zum Schutz eines elektrischen Bauteils gegen einen Stoß oder wiederholte mechanische Beanspruchung System and method for protecting an electrical component to a shock or repeated mechanical stress |
| 07/13/2006 | DE102005057464A1 Komponente zur Impedanzanpassung Component for impedance matching |
| 07/13/2006 | DE102005000655A1 Bilderfassungseinrichtung Image capture device |
| 07/13/2006 | DE102004063852A1 Inductance for use DC to DC electrical voltage converters is in the form of a planar coil on a carrier surface |
| 07/13/2006 | DE102004063851A1 Verfahren zur Herstellung einer elektronischen Schaltung A process for producing an electronic circuit |
| 07/13/2006 | DE102004063135A1 Leiterplatte zur Bestückung mit elektrischen und/oder elektronischen Bauteilen Circuit board for use with electrical and / or electronic components |
| 07/13/2006 | DE102004062547A1 Elektrische Baugruppe mit ineinander angeordneten Schaltungsträgern The electrical assembly with nested circuit boards |
| 07/13/2006 | DE102004062028A1 Attaching and aligning sensor module with respect to circuit board, for motor vehicle rotation speed sensor |
| 07/13/2006 | DE102004060962A1 Mehrlagige gedruckte Schaltung mit einer Durchkontaktierung für Hochfrequenzanwendungen The multilayer printed circuit having a via hole for high-frequency applications |
| 07/13/2006 | DE102004053557B4 Verfahren und Vorrichtungen zum Drucken leitfähiger Dickfilme über Dickfilmdielektrika Methods and apparatus for printing conductive thick films on Dickfilmdielektrika |
| 07/12/2006 | EP1678991A1 A method of producing a conductive layer on a substrate |
| 07/12/2006 | EP1678990A2 Method and apparatus for the manufacture of electric circuits |
| 07/12/2006 | EP1678988A1 Printed circuit board including a fuse |
| 07/12/2006 | EP1678789A1 Method of fabricating an rf substrate with selected electrical properties |
| 07/12/2006 | EP1678761A1 Electrical connection of components |
| 07/12/2006 | EP1546051B1 Low-temperature, fluoride free fiber glass compositions and products made using same |
| 07/12/2006 | EP1269805B1 Electrical circuit and substrate therefor |
| 07/12/2006 | EP1169736B1 Power semiconductor module |
| 07/12/2006 | EP1131168B1 Methods of forming metal contact pads on a metal support substrate |
| 07/12/2006 | CN2796315Y Radiator combination |
| 07/12/2006 | CN2796304Y Anti-elastic fatigue spring sheet |
| 07/12/2006 | CN2796303Y Welding pad structure of printed circuit |
| 07/12/2006 | CN1802885A Testing of interconnections between stacked circuit boards |
| 07/12/2006 | CN1802882A Arrangement for authentication of a person |
| 07/12/2006 | CN1802407A Nanoporous laminates |
| 07/12/2006 | CN1802080A Mother plate for a flexible printed circuit film and display device |
| 07/12/2006 | CN1802076A Printing circuit connecting control chip and memory chip in mobile communication terminal |
| 07/12/2006 | CN1802069A Substrate with high heat conduction and its making process |
| 07/12/2006 | CN1802068A Circuit board and semiconductor apparatus parts |