| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/30/2006 | CN1825702A 无线通信终端装置 The wireless communication terminal apparatus |
| 08/30/2006 | CN1825640A Semiconductor luminescent element composition |
| 08/30/2006 | CN1825581A Printed circuit board, flip chip ball grid array board and method of fabricating the same |
| 08/30/2006 | CN1825579A Circuit substrate structure and circuit apparatus |
| 08/30/2006 | CN1824484A Molded part and electronic device comprising said molded part |
| 08/30/2006 | CN1272876C Assembly unit for mounting electric element on flexible cable |
| 08/30/2006 | CN1272872C Satellite broadcasting-receiving converter |
| 08/30/2006 | CN1272849C Flexible electronic device |
| 08/30/2006 | CN1272783C Optical head device and its adjusting method |
| 08/30/2006 | CN1272138C System and method for unveiling targets embedded in a multi-layered electrical circuit |
| 08/29/2006 | US7099648 Radio frequency integrated circuit layout with noise immunity border |
| 08/29/2006 | US7099139 Integrated circuit package substrate having a thin film capacitor structure |
| 08/29/2006 | US7099131 Surge absorber and surge absorber array |
| 08/29/2006 | US7098903 Flat panel display device |
| 08/29/2006 | US7098534 Sacrificial component |
| 08/29/2006 | US7098533 Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
| 08/29/2006 | US7098532 Ceramic package and chip resistor, and methods for production of the same |
| 08/29/2006 | US7098528 Embedded redistribution interposer for footprint compatible chip package conversion |
| 08/29/2006 | US7098525 Organic polymers, electronic devices, and methods |
| 08/29/2006 | US7098475 Apparatuses configured to engage a conductive pad |
| 08/29/2006 | US7098408 Techniques for mounting an area array package to a circuit board using an improved pad layout |
| 08/29/2006 | US7098407 Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate |
| 08/29/2006 | US7098267 Polyamic acid varnish composition and a flexible printed board |
| 08/29/2006 | US7098163 Depositing an ink comprising a liquid vehicle, particulate support phase and molecular precursor to active species phase; heating ink to convert molecular precursor to active species phase dispersed on support phase and form a catalyst layer |
| 08/29/2006 | US7098160 Dielectric ceramic composition and ceramic electronic component employing the same |
| 08/29/2006 | US7098136 Structure having flush circuit features and method of making |
| 08/29/2006 | US7098132 Method of manufacturing flexible wiring board |
| 08/29/2006 | US7098126 Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints |
| 08/29/2006 | US7097958 Mixture of epoxy and phenolic resins, latent curing agents and photosensitive acid generator |
| 08/29/2006 | US7097788 Conducting inks |
| 08/29/2006 | US7097686 Generating an aerosol including a liquid comprising a nickel precursor and a reducing agent and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy |
| 08/29/2006 | US7097479 FPCB connection mechanism |
| 08/29/2006 | US7097463 Electrical connector |
| 08/29/2006 | US7097462 Patch substrate for external connection |
| 08/29/2006 | US7097394 Circuit board production method and circuit board production data |
| 08/29/2006 | US7097365 Transceiver assembly for use in fiber optics communications |
| 08/29/2006 | US7097104 Image manipulation device |
| 08/29/2006 | US7096555 Closed loop backdrilling system |
| 08/24/2006 | WO2006089255A2 High aspect ratio plated through holes in a printed circuit board |
| 08/24/2006 | WO2006088979A1 Electronic compliance packaging systems and methods |
| 08/24/2006 | WO2006087873A1 Barrier film for flexible copper substrate and sputtering target for barrier film formation |
| 08/24/2006 | WO2006087769A1 Package mounted module and package board module |
| 08/24/2006 | WO2006053206A9 Single or multi-layer printed circuit board with improved via design |
| 08/24/2006 | WO2005112100A3 Stacked module systems and methods |
| 08/24/2006 | US20060190780 High reliability memory module with a fault tolerant address and command bus |
| 08/24/2006 | US20060189773 Aqueous formaldehyde-free composition and fiberglass insulation including the same |
| 08/24/2006 | US20060189182 Connector |
| 08/24/2006 | US20060189181 Method of forming a circuit structure |
| 08/24/2006 | US20060189180 Plug connector and construction therefor |
| 08/24/2006 | US20060189044 High reliability multilayer circuit substrates and methods for their formation |
| 08/24/2006 | US20060187980 Thin laser module |
| 08/24/2006 | US20060187063 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 08/24/2006 | US20060186204 Combined multi-frequency electromagnetic and optical communication system |
| 08/24/2006 | US20060185895 Universal pattern of contact pads for semiconductor reflow interconnections |
| 08/24/2006 | US20060185894 Conductive contamination reliability solution for assembling substrates |
| 08/24/2006 | US20060185893 Surface-mounting type electronic circuit unit without detachment of solder |
| 08/24/2006 | US20060185892 Semiconductor device with micro connecting elements and method for producing the same |
| 08/24/2006 | US20060185891 Printed board |
| 08/24/2006 | US20060185890 Air void via tuning |
| 08/24/2006 | US20060185790 Security tag & method using a flowable material |
| 08/24/2006 | US20060185782 Manufacturing apparatus for manufacturing electronic monolithic ceramic components |
| 08/24/2006 | US20060185141 Multilayer wiring board and manufacture method thereof |
| 08/24/2006 | DE202006005809U1 Signal interface for connecting e.g. mouse with personal computer, has coupling body connected with attachment part and projecting from attachment surface in order to be inserted into hole in board and thus to attach interface to board |
| 08/24/2006 | DE10317675B4 Keramisches Multilayersubstrat und Verfahren zu seiner Herstellung A ceramic multilayer substrate and process for its preparation |
| 08/24/2006 | DE10239090B4 Anzeigevorrichtung und Verfahren zur Herstellung Display device and methods for making |
| 08/24/2006 | DE10220981B4 Sensor für schwach magnetische Felder unter Verwendung der Herstellungstechnik für gedruckte Leiterplatten und Verfahren zum Herstellen eines solchen Sensors Sensor for weak magnetic fields using the manufacturing technology for printed circuit boards and methods for manufacturing of such a sensor |
| 08/24/2006 | DE102006006328A1 Electric current detector e.g. for electric motor, has measuring resistor formed by section of conductive track and provided with temperature sensor |
| 08/24/2006 | DE102005002751A1 Printed circuit board, has recess, in which functional unit e.g. permanent magnet, is arranged, where recess is hole that is closed with punching part and thin layer and functional unit is bonded on thin section using adhesive |
| 08/24/2006 | CA2598474A1 Electronic compliance packaging systems and methods |
| 08/23/2006 | EP1694104A1 Surface-mounting type electronic circuit unit |
| 08/23/2006 | EP1694103A2 Method for implanting an electronic component on a support in order to increase resistance of the assembly to repeated impacts and vibrations and system comprising said component and support |
| 08/23/2006 | EP1693792A1 Method for manufacturing RFID labels |
| 08/23/2006 | EP1693772A1 Printed circuit board design method, program thereof, recording medium containing the program, printed circuit board design device using them, and cad system |
| 08/23/2006 | EP1693395A1 Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
| 08/23/2006 | EP1692926A1 Method for constructing emi shielding around a component embedded in a circuit board |
| 08/23/2006 | EP1692722A2 Light emitting diode based illumination assembly |
| 08/23/2006 | EP1692553A1 A circuit board and a method for its manufacture |
| 08/23/2006 | EP1507906A4 Plural layer woven electronic textile, article and method |
| 08/23/2006 | EP1330883B1 Electronic device |
| 08/23/2006 | CN2810113Y Backboard of radiator |
| 08/23/2006 | CN2810097Y Metal based circuit carrier |
| 08/23/2006 | CN2809931Y Embedded type surface-mounting socket and cooperative circuit board |
| 08/23/2006 | CN1823555A Circuit board with embedded components and method of manufacture |
| 08/23/2006 | CN1823459A Electric junction box and its assembling process |
| 08/23/2006 | CN1823449A Component for a printed circuit board and method for fitting a printed circuit board with this component |
| 08/23/2006 | CN1823448A Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box |
| 08/23/2006 | CN1823396A Inductive-system |
| 08/23/2006 | CN1823341A Memory card with raised portion |
| 08/23/2006 | CN1823339A Memory card with raised portion |
| 08/23/2006 | CN1823181A Surface treating agent for tin or tin alloy material |
| 08/23/2006 | CN1823114A Asymmetric polymer film, method for the production and the utilization thereof |
| 08/23/2006 | CN1822904A Method of pattern coating |
| 08/23/2006 | CN1822749A Copper-clad laminated sheet |
| 08/23/2006 | CN1822747A Three-dimensional circuit module and method of manufacturing the same |
| 08/23/2006 | CN1822746A Printed board |
| 08/23/2006 | CN1822360A Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same |
| 08/23/2006 | CN1822358A Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized subs |
| 08/23/2006 | CN1822357A Semiconductor device package, method of manufacturing semiconductor device and semiconductor device |
| 08/23/2006 | CN1822356A Interposer for decoupling integrated circuits on a circuit board |
| 08/23/2006 | CN1822240A Compound for forming thick film conductor |