Patents for H05K 1 - Printed circuits (98,583)
09/2006
09/20/2006CN1276700C Electromagnetic interference masking method and shading device and printing circuit board
09/20/2006CN1276696C Multi layer connection board and its producing method
09/20/2006CN1276695C Circuit board making process
09/20/2006CN1276694C 挠性印刷电路板 Flexible printed circuit board
09/20/2006CN1276650C Apparatus and method for sharing signal control lines
09/20/2006CN1276563C Multi-functional energy conditioner
09/20/2006CN1275769C Inkjet deposition apparatus and method
09/20/2006CN1275764C Multilayered metal laminate and process for producing the same
09/19/2006US7111324 USB hub keypad
09/19/2006US7111271 Inductive filters and methods of fabrication thereof
09/19/2006US7110263 Reference slots for signal traces
09/19/2006US7110262 Adapter device, memory device and integrated circuit chip
09/19/2006US7110258 Heat dissipating microdevice
09/19/2006US7110257 Electronic apparatus including printed wiring board provided with heat generating component
09/19/2006US7110246 Electronic control unit case
09/19/2006US7110241 Substrate
09/19/2006US7110227 Universial energy conditioning interposer with circuit architecture
09/19/2006US7110115 Method and arrangement for aligning an optical component on a printed wiring board
09/19/2006US7109948 Dielectric antenna module
09/19/2006US7109945 Flat antenna, antenna unit and broadcast reception terminal apparatus
09/19/2006US7109922 Rf system concept for vehicular radar having several beams
09/19/2006US7109874 Smoke detectors
09/19/2006US7109830 Low cost highly isolated RF coupler
09/19/2006US7109825 Passive devices and modules for transceiver
09/19/2006US7109817 Interference signal decoupling on a printed circuit board
09/19/2006US7109722 Apparatus and method for PCB smoke and burn detection and prevention
09/19/2006US7109590 Semiconductor component comprising a surface metallization
09/19/2006US7109578 Semiconductor device and electronic equipment using the same
09/19/2006US7109575 Low-cost flexible film package module and method of manufacturing the same
09/19/2006US7109569 Dual referenced microstrip
09/19/2006US7109410 EMI shielding for electronic component packaging
09/19/2006US7109067 Semiconductor device and method for fabricating same
09/19/2006US7108807 Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing polybenzoxazoles, and processes for producing an electronic component
09/19/2006US7108733 Spherical nano particle sized silver powder ; dispersion medium( water and lower molecualr weight alochol) for dispersing silver spherical powder, in a volume % content ratio with the powder between 1:99 and 40:60 ; high density electrode film
09/19/2006US7108559 Router with field replaceable motherboard
09/19/2006US7108526 Component and circuit module
09/19/2006US7108516 Flexible board, connection method thereof, and connection structure thereof
09/19/2006US7108515 Wiring board with bending section
09/19/2006US7108399 Light source unit
09/19/2006US7108396 Modular mounting arrangement and method for light emitting diodes
09/19/2006US7108385 Illumination module of light emitting elements
09/19/2006US7108369 Inkjet deposition apparatus and method
09/19/2006US7108172 Display of operational instructions
09/19/2006US7107674 Method for manufacturing a chip carrier
09/19/2006US7107673 Technique for accommodating electronic components on a multiplayer signal routing device
09/19/2006US7107672 Method of mounting electronic parts on a flexible printed circuit board
09/14/2006WO2006095805A1 Electronic circuit and method for manufacturing same
09/14/2006WO2006095590A1 Filler for resin, resin base material containing same and electronic component substrate material
09/14/2006WO2006095511A1 Cyclic olefin resin composition, and substrate provided from said resin composition
09/14/2006WO2006094656A1 Solar sensor in mid-technology
09/14/2006WO2006077164A3 Method for producing an angled printed circuit board structure from at least two circuit board sections
09/14/2006WO2006009823A3 Ethoxysilane containing fiberglass binder
09/14/2006US20060206850 Automated system for designing and developing field programmable gate arrays
09/14/2006US20060205891 Containing at least one polyimide resin, a phenolic resin component containing at least one phenolic resin, and an epoxy resin component containing at least one epoxy resin; phosphazene and cyanate ester; excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability
09/14/2006US20060205250 Electric power distribution and control apparatus
09/14/2006US20060205248 Voltmeter relay with shaped base which contains slots designed to form seatings for the insertion of "faston" connectors
09/14/2006US20060205244 Electret capacitor microphone
09/14/2006US20060205242 Light emitting cluster and direct light emitting type backlight unit having the same and liquid crystal display device having the backlight unit
09/14/2006US20060204748 Fluoropolymer laminates and a process for manufacture thereof
09/14/2006US20060203458 Electronic package with integrated capacitor
09/14/2006US20060203457 Z-axis component connections for use in a printed wiring board
09/14/2006US20060203040 Structure and method for connecting flexible printed circuit board to inkjet print head
09/14/2006US20060202784 Systems and methods for blocking microwave propagation in parallel plate structures
09/14/2006US20060202639 Discharge lamp lighting apparatus
09/14/2006US20060202351 Underfilling efficiency by modifying the substrate design of flip chips
09/14/2006US20060202349 Circuit substrate and its manufacturing method
09/14/2006US20060202344 Printed Wiring Board and Method for Manufacturing The Same
09/14/2006US20060202328 Memory module and memory configuration with stub-free signal lines and distributed capacitive loads
09/14/2006US20060202322 Interposer, and multilayer printed wiring board
09/14/2006US20060201937 High-frequency dielectric heating device and printed board with thermistor
09/14/2006US20060201818 Manufacturing method of double-sided wiring glass substrate
09/14/2006US20060201705 Electrical device allowing for increased device densities
09/14/2006US20060201704 Stacked microfeature devices and associated methods
09/14/2006US20060201703 Flip chip mounting substrate
09/14/2006US20060201702 Component for a printed circuit board and method for fitting a printed circuit board with this component
09/14/2006US20060201701 Circuit security
09/14/2006US20060201201 Manufacturing method of double-sided wiring glass substrate
09/14/2006US20060200982 Method of making a biosensor
09/14/2006US20060200981 Method of making a biosensor
09/14/2006US20060200977 Method of making circuitized substrate with signal wire shielding
09/14/2006US20060200958 Method of manufacture of ceramic composite wiring structures for semiconductor devices
09/14/2006DE102006009500A1 Printed circuit plate has laminate including electrically conducting layer overlying on insulating layer and made up of heat conducting material, which contains metal and crystalline carbon, where metal has high heat conducting coefficient
09/14/2006DE102005056263A1 Äußere Impedanzabgleichskomponentenverbindungen mit nicht kompensierten Anschlussleitungen External impedance matching components connections with non-compensated connection cables
09/14/2006DE102005011252A1 Verfahren und Vorrichtung zur Herstellung einer elektrischen Leiterzugstruktur, sowie eine damit hergestellte Leiterzugstruktur Method and device for producing an electrical conduction path, and a conduction path thus produced
09/14/2006DE102005010342A1 Induktives Bauelement Inductive component
09/13/2006EP1701601A2 Multilayer printed wiring board
09/13/2006EP1701599A1 Circuit board for hiding electronic components
09/13/2006EP1701381A2 Ceramic circuit board
09/13/2006EP1700194A1 Printable electromechanical input means and an electronic device including such input means
09/13/2006EP1700003A2 High temperature circuits
09/13/2006EP1699852A1 Low temperature sintering nanoparticle compositions
09/13/2006EP1488449B1 Component mounting method, component mounting apparatus, and ultrasonic bonding head
09/13/2006EP1305988B1 Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner
09/13/2006EP1103168B1 High density printed circuit substrate and method of fabrication
09/13/2006CN2817320Y Single plate
09/13/2006CN2817308Y Welding seat
09/13/2006CN2817305Y Cartridge clip type wire fixing device
09/13/2006CN2817292Y 软性印刷电路板 A flexible printed circuit board
09/13/2006CN1833368A Radio frequency communication between devices via a power plane on a circuit board
09/13/2006CN1833165A Generation of test patterns for subsequent inspection