Patents for H05K 1 - Printed circuits (98,583)
09/2006
09/06/2006CN1829420A Printed circuit board with embedded capacitors therein and manufacturing process thereof
09/06/2006CN1829416A Embedded chip printed circuit board and method of manufacturing the same
09/06/2006CN1829415A Composite structure of flexible printed circuit and electronic component
09/06/2006CN1829414A Transmission line and wiring forming method
09/06/2006CN1829413A Wired circuit board
09/06/2006CN1829412A Double-side flexible circuit substrate capable of repeatedly bending
09/06/2006CN1827667A Novel polyimide copolymer and metal laminate using the same
09/06/2006CN1274187C Sheet element for jumper line and its mounting structure
09/06/2006CN1274186C Wiring board and its mfg. method
09/06/2006CN1274068C 电连接器 The electrical connector
09/06/2006CN1274011C Crystalline grain in metal film growth control method
09/06/2006CN1273993C Conductive paste structure, product containing same and method for manufacturing same
09/06/2006CN1273962C Method and apparatus for bonding flexible board
09/06/2006CN1273544C Electronic element for high frequency using low-dielectric loss angle tangent insulating material
09/05/2006US7103753 Backplane system having high-density electrical connectors
09/05/2006US7103249 Optical module and manufacturing method of the same, optical-communication apparatus, and electronic apparatus
09/05/2006US7102905 Stacked memory, memory module and memory system
09/05/2006US7102896 Electronic component module
09/05/2006US7102892 Modular integrated circuit chip carrier
09/05/2006US7102891 Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
09/05/2006US7102876 Structure of an interleaving striped capacitor substrate
09/05/2006US7102874 Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode
09/05/2006US7102721 Liquid crystal display having different shaped terminals configured to become substantially aligned
09/05/2006US7102631 Display panel with signal transmission patterns
09/05/2006US7102480 Printed circuit board integrated switch
09/05/2006US7102463 Printed circuit board (PCB) which minimizes cross talk and reflections and method therefor
09/05/2006US7102455 Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk
09/05/2006US7102376 Power semiconductor module with detector for detecting main circuit current through power semiconductor element
09/05/2006US7102221 Memory-Module with an increased density for mounting semiconductor chips
09/05/2006US7102211 Semiconductor device and hybrid integrated circuit device
09/05/2006US7102196 Multi-layered printed circuit board for efficient electrostatic discharge protection
09/05/2006US7102097 Method of making hole in ceramic green sheet
09/05/2006US7102085 Wiring substrate
09/05/2006US7102015 Maleimide compounds in liquid form
09/05/2006US7101933 reacting polyphenylene ether (PPE) with an epoxy resin that has low bromine content in a non-polar solvent in the presence of a catalyst in a reactor; PPE needs not to be cleaved into small molecules and instead mixes and react directly reducing reaction time
09/05/2006US7101627 Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronics devices
09/05/2006US7101619 Laminate
09/05/2006US7101197 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box
09/05/2006US7101090 Transceiver assembly for use in fiber optics communications
09/05/2006US7101021 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
09/05/2006US7100834 Method of data distribution using ink dots on cards
09/05/2006US7100279 Method of mounting an electronic part
09/05/2006US7100276 Method for fabricating wiring board provided with passive element
09/05/2006US7100270 forming pairs of conductive electrodes as terminals of thick film resistors on a substrate, the electrodes are separated and parallel to each other forming a thick film resistor, a dielectric passivation layer over the thick film resistors, layering titanium and copper, a dry film and a photomask
08/2006
08/31/2006WO2006091940A1 Integrated circuit package with lead stops
08/31/2006WO2006091938A2 Fusible device and method
08/31/2006WO2006091188A1 Printed circuit board with integral strain gage
08/31/2006WO2006090658A1 Laminate for wiring board
08/31/2006WO2006090013A1 Interlocking means
08/31/2006WO2006089701A1 Air void via tuning
08/31/2006WO2006089377A1 Flexible electronic device
08/31/2006WO2006067028A3 Circuit board to be fitted with electrical and/or electronic components
08/31/2006WO2006056648A3 Electronics module and method for manufacturing the same
08/31/2006WO2005089204A3 Maximizing capacitance per unit area while minimizing signal transmission delay in pcb
08/31/2006WO2005076206A8 Method and device for continuously producing electronic film components, and an electronic film component
08/31/2006US20060194920 Thermally conductive adhesive composition and process for device attachment
08/31/2006US20060194481 Power connector
08/31/2006US20060194457 Structure using soldering and soldering method
08/31/2006US20060194369 Carrier for substrate film
08/31/2006US20060194156 Method for forming patterned insulating elements and methods for making electron source and image display device
08/31/2006US20060193117 Display
08/31/2006US20060192572 Method and structure for measuring a bonding resistance
08/31/2006US20060192276 Integrated circuit and wireless IC tag
08/31/2006US20060191715 Multilayer circuit board and manufacturing method thereof
08/31/2006US20060191714 High frequency multilayer circuit structure and method for the manufacture thereof
08/31/2006US20060191713 Fusible device and method
08/31/2006US20060191712 Interconnect
08/31/2006US20060191711 Embedded chip printed circuit board and method of manufacturing the same
08/31/2006US20060191710 Multilayer printed wiring board and a process of producing same
08/31/2006US20060191709 Printed circuit board, flip chip ball grid array board and method of fabricating the same
08/31/2006US20060191708 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
08/31/2006US20060191707 Circuit board and method for producing the same
08/31/2006US20060191632 Method for producing flexible metal foil-polyimide laminate
08/31/2006US20060191134 Patch substrate for external connection
08/31/2006DE202006005208U1 Multi-layered backplane for data processing and telecommunications technique, has two printed circuit boards, where current-carrying conductors are provided only on rigid board and data transmission lines are provided only on other board
08/31/2006DE19928225B4 Verfahren zur Herstellung von Mehrlagen-Hybriden A process for producing multi-layer hybrids
08/31/2006DE19908979B4 Anschlusssockel mit darin eingeschobenem Halbleiterbauteil für photoelektrische Elemente Terminal block with inserted therein semiconductor device for photoelectric elements
08/31/2006DE19826428B4 Chipmodul mit Aufnahmekörper Chip module with inclusion body
08/31/2006DE10324043B4 Kartenförmiger elektronischer Datenträger, Funktionsinlett dafür und ihre Herstellungsverfahren A card-shaped electronic media, Funktionsinlett for it and its manufacturing method
08/31/2006DE10319525B4 Bandförmige Anordnung mit einer Leiterbahnstruktur und mit damit elektrisch verbundenen elektronischen Bauteilen, insbesondere Lichtband mit Leuchtelementen Strip-type arrangement with a printed conductor structure and electrically connected thereto with electronic components, in particular strip lighting with light emitting elements
08/31/2006DE102005007772A1 Foil with printed aerial for use in radio frequency identification chip, with aerial consisting of conductive print ink
08/31/2006DE102005006638A1 Haftfeste Leiterbahn auf Isolationsschicht Tenacious conductor on insulating layer
08/31/2006DE102004040414B4 Verfahren zur Herstellung eines Verdrahtungssubstrats eines Halbleiterbauteils mit Außenkontaktanschlussflecken für Außenkontakte Process for the preparation of a wiring substrate of a semiconductor device with external contact pads for external contacts
08/30/2006EP1696716A1 Multilayer printed wiring board
08/30/2006EP1696715A2 Soldering method and structure manufactured by using this soldering method
08/30/2006EP1696714A2 Multilayer printed wiring board
08/30/2006EP1696559A1 Noise filter mounting structure
08/30/2006EP1696515A1 Power connector
08/30/2006EP1696443A1 Method for forming transparent conductive film and transparent electrode
08/30/2006EP1696003A1 Thermoplastic resin composition, material for substrate and film for substrate
08/30/2006EP1695419A2 Patch panel with crosstalk reduction system and method
08/30/2006EP1695360A2 Printed circuit embedded capacitors
08/30/2006EP1695308A1 Improved resonance security tag and method of producing such a tag
08/30/2006EP1695065A1 Liquid or gas sensor and method
08/30/2006EP0993039B1 Substrate for mounting semiconductor chips
08/30/2006CN2812503Y 多孔陶瓷电路板 Porous ceramic circuit board
08/30/2006CN1826365A Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same
08/30/2006CN1826299A Insulating ceramic composition, insulating ceramic sintered body, and multilayer ceramic electronic component
08/30/2006CN1826047A High frequency unit
08/30/2006CN1826037A Rigid flexible printed circuit board and method of fabricating same